Patents by Inventor Tatsuhiko Ueki

Tatsuhiko Ueki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5951793
    Abstract: The present invention provides a Ni--Ti--Pd superelastic alloy material of a composition consisting of, by atomic percent, 34 to 49% nickel, 48 to 52% titanium and 3 to 14% palladium. Optionally, in a part of nickel and/or titanium of this alloy is replaced with one or more elements selected from a group of Cr, Fe, Co, V, Mn, B, Cu, Al, Nb, W and Zr such that these elements to be replaced amount to 2% or less in total (by atomic percent), wherein a stress hysteresis between the loading and unloading stresses in the stress-strain curve at temperatures between Af and Af+5.degree. is as small as 50 to 150 MPa. Since the Ni--Ti--Pd superelastic alloy material having the above composition is excellent in hot workability, it can be hot-worked into a wire having a diameter up to the range from 1 to 5 mm and manufactured at a low cost. Then, a final heat-treatment is given to the hot-worked material at a temperature in the range from 300 to 700.degree. C.
    Type: Grant
    Filed: July 9, 1996
    Date of Patent: September 14, 1999
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Kengo Mitose, Tatsuhiko Ueki
  • Patent number: 5885381
    Abstract: The present invention provides a Ni--Ti--Pd superelastic alloy material of a composition consisting of, by atomic percent, 34 to 49% nickel, 48 to 52% titanium and 3 to 14% palladium. Optionally, a part of nickel and/or titanium of this alloy is replaced with one or more elements selected from a group of Cr, Fe, Co, V, Mn, B, Cu, Al, Nb, W and Zr such that these elements to be replaced amount to 2% or less in total (by atomic percent), wherein a stress hysteresis between the loading and unloading stresses in the stress-strain curve at temperatures between Af and Af+5.degree. is as small as 50 to 150 MPa. Since the Ni--Ti--Pd superelastic alloy material having the above composition is excellent in hot workability, it can be hot-worked into a wire having a diameter up to the range from 1 to 5 mm and manufactured at a low cost. Then, a final heat-treatment is given to the hot-worked material at a temperature in the range from 300.degree. to 700.degree. C.
    Type: Grant
    Filed: February 24, 1998
    Date of Patent: March 23, 1999
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Kengo Mitose, Tatsuhiko Ueki
  • Patent number: 5850837
    Abstract: A device which is installed onto an ingrown nail of a human toe to correct the ingrown nail, includes a support member affixed to the ingrown nail, and a correcting member supported by the support member and effecting force on the ingrown nail toward the correcting direction for the ingrown portion of the nail. The correcting member may be formed of a superelastic material which is shape-memory-treated to memorize a first shape, and which is deformed to a second shape different from the first shape so as to be installed onto a surface of the ingrown nail of the human toe in the second shape.
    Type: Grant
    Filed: March 18, 1997
    Date of Patent: December 22, 1998
    Assignees: Furukawa Electric Co., Ltd., Furukawa Techno Material Co., Ltd.
    Inventors: Kaisuke Shiroyama, Tatsuhiko Ueki, George Murota
  • Patent number: 5641364
    Abstract: A method of manufacturing a high-temperature shape memory alloy includes the steps of cold-working a high-temperature shape memory alloy, in which a reverse martensite transformation start temperature (As) in a first heating after cold working reaches 350.degree. C. or above. Thereafter, the cold-worked alloy undergoes a first heat treatment for a period of time within the incubation time required for recrystallization or less, and at a temperature higher than a reverse martensite transformation finish temperature (Af). Finally, the resultant alloy is annealed with a second heat treatment, at a temperature which is not less than the plastic strain recovery temperature and not more than the recrystallization temperature. Specifically, the first heat treatment is performed for a period of three minutes or less at a temperature which exceeds 500.degree. C. and which is lower than the melting point of the alloy. The composition of the high-temperature shape memory alloy is Ti.sub.50 Ni.sub.50-x Pd.sub.
    Type: Grant
    Filed: October 27, 1995
    Date of Patent: June 24, 1997
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Dmitrii Victorovich Golberg, Kazuhiro Otsuka, Tatsuhiko Ueki, Hiroshi Horikawa, Kengo Mitose