Patents by Inventor Tatsumi Tsuchiya

Tatsumi Tsuchiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160230059
    Abstract: The present invention provides a haloolefin-based composition comprising a highly-stable haloolefin in which decomposition and oxidization are inhibited, and the haloolefin-based composition being used for at least one application selected from the group consisting of heat transfer media, refrigerants, foaming agents, solvents, cleaning agents, propellants, and fire extinguishers. The present invention relates to a haloolefin-based composition comprising a haloolefin and water and being used for at least one application selected from the group consisting of heat transfer media, refrigerants, foaming agents, solvents, cleaning agents, propellants, and fire extinguishers. The haloolefin-based composition comprising a haloolefin and water is used for at least one application selected from the group consisting of heat transfer media, refrigerants, foaming agents, solvents, cleaning agents, propellants, and fire extinguishers.
    Type: Application
    Filed: February 29, 2016
    Publication date: August 11, 2016
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Kazuhiro TAKAHASHI, Tatsumi TSUCHIYA, Yasufu YAMADA
  • Publication number: 20160121416
    Abstract: A solder ball bonding tool includes a nozzle having an inner bore having a plurality of columnar surfaces and interposed retention structures that are positioned within the nozzle to retain a solder ball therein. A projection or projected shape formed by intersecting the retention structures may be generally circular, having a diameter less than the diameter of the solder balls for which the retention structures are positioned to retain. The nozzle may comprise a cemented carbide having less than or equal to a cumulative 4.5% of cobalt and gold serving as a binder.
    Type: Application
    Filed: October 29, 2014
    Publication date: May 5, 2016
    Inventors: Kenichi Murata, Yusuke Matsumoto, Yuichi Mori, Eiki Oosawa, Tatsumi Tsuchiya, Tatsushi Yoshida
  • Patent number: 9303198
    Abstract: The present invention provides a stabilized refrigerant composition containing a hydrofluoropropene with low global warming potential (GWP) that can remain stable even in the presence of air (oxygen) for a long period of time. More specifically, the present invention provides a refrigerant composition containing a hydrofluoropropene and a stabilizer. The stabilizer is at least one member selected from the group consisting of alkylcatechols, alkoxyphenols, benzoquinones, phenothiazines, and phthalates.
    Type: Grant
    Filed: May 14, 2014
    Date of Patent: April 5, 2016
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Tatsumi Tsuchiya, Takashi Shibanuma, Yasufu Yamada, Hitomi Kuroki
  • Publication number: 20150211773
    Abstract: A principal object of the present invention is to provide a method for filling a refrigerant mixture. According to this method, when a non-azeotropic refrigerant mixture comprising HFC-32 and HFO-1234yf is transferred, changes in the composition that occur during the transfer can be made to fall within an acceptable range in terms of refrigerant properties.
    Type: Application
    Filed: September 4, 2013
    Publication date: July 30, 2015
    Inventors: Hitomi Kuroki, Tatsumi Tsuchiya, Yasufu Yamada, Takashi Shibanuma
  • Publication number: 20150184050
    Abstract: The present invention provides a highly stable HFO refrigerant composition for use in a vapor compression-type refrigeration system, having improved slidability for the sliding portions of the vapor compression-type refrigeration system. More specifically, the present invention provides an HFO refrigerant composition comprising at least one type of HFO refrigerant and a polymer of halogenated propene represented by C3HaFbClc (provided that a+b+c=6, a=an integer of 1 to 3, b=an integer of 3 to 5, and c=an integer of 0 to 1) that is an oligomer having a molecular weight of 200 to 900.
    Type: Application
    Filed: February 2, 2015
    Publication date: July 2, 2015
    Inventors: Tatsumi TSUCHIYA, Takashi SHIBANUMA
  • Patent number: 8980119
    Abstract: The present invention provides a highly stable HFO refrigerant composition for use in a vapor compression-type refrigeration system, having improved slidability for the sliding portions of the vapor compression-type refrigeration system. More specifically, the present invention provides an HFO refrigerant composition comprising at least one type of HFO refrigerant and a polymer of halogenated propene represented by C3HaFbClc (provided that a+b+c=6, a=an integer of 1 to 3, b=an integer of 3 to 5, and c=an integer of 0 to 1) that is an oligomer having a molecular weight of 200 to 900.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: March 17, 2015
    Assignee: Daikin Industries, Ltd.
    Inventors: Tatsumi Tsuchiya, Takashi Shibanuma
  • Patent number: 8881967
    Abstract: An apparatus for interconnecting two connection pads in a head-gimbal assembly. The apparatus includes a conveyer for conveying a metallic slug, and a nozzle for ejecting the metallic slug toward the two connection pads. The nozzle includes a receiving portion for receiving the metallic slug from the conveyer, and a straight guide disposed downstream of the receiving portion. The straight guide has a maximum inner diameter that is smaller than a minimum inner diameter of the receiving portion. The apparatus also includes a laser for applying a laser beam from an inlet side of the nozzle to the metallic slug as the metallic slug passes along a path that includes a first portion through said straight guide and a second portion between the straight guide and the two connection pads. The laser is configured to melt the metallic slug for attaching the metallic slug to the two connection pads.
    Type: Grant
    Filed: October 9, 2009
    Date of Patent: November 11, 2014
    Assignee: HGST Netherlands B.V.
    Inventors: Yuhsuke Matsumoto, Tatsumi Tsuchiya, Eiki Oosawa, Tatsushi Yoshida
  • Patent number: 8837261
    Abstract: Approaches to an electrical contact to electrically connect a laser module and a suspension that houses a head slider, in the context of a hard disk drive, involves a laser sub-mount electrical contact that includes a metal barrier layer underneath an electrode layer, where the barrier layer material has a lower heat transfer coefficient than the sub-mount material. Consequently, during the soldering process the diffusion of heat to the sub-mount is inhibited and the wettability of the solder is improved.
    Type: Grant
    Filed: August 27, 2013
    Date of Patent: September 16, 2014
    Assignee: HGST Netherlands B.V.
    Inventors: Kenichi Murata, Tatsumi Tsuchiya
  • Publication number: 20140248706
    Abstract: The present invention provides a stabilized refrigerant composition containing a hydrofluoropropene with low global warming potential (GWP) that can remain stable even in the presence of air (oxygen) for a long period of time. More specifically, the present invention provides a refrigerant composition containing a hydrofluoropropene and a stabilizer. The stabilizer is at least one member selected from the group consisting of alkylcatechols, alkoxyphenols, benzoquinones, phenothiazines, and phthalates.
    Type: Application
    Filed: May 14, 2014
    Publication date: September 4, 2014
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Tatsumi TSUCHIYA, Takashi SHIBANUMA, Yasufu YAMADA, Hitomi ARIMOTO
  • Patent number: 8593765
    Abstract: A head gimbal assembly having a stage fixed to a head-slider. A piezoelectric element which comprises; an upper surface, a first side surface, a second side surface, a lower surface, a first electrode, a second electrode, and a gap between the first and second electrodes on the lower surface, the piezoelectric element moving the stage by extension or contraction thereof according to a voltage applied to the first and second electrodes. A transmission wiring part which has a connection pad for the piezoelectric element. A cross-connector for physically and electrically cross-connecting the first electrode and the connection pad. An adhesive fixing part which is formed from an insulating adhesive and adhesively fixes the lower surface of the piezoelectric element to the transmission wiring part, between an end of the second electrode at the gap and the cross-connector.
    Type: Grant
    Filed: December 20, 2010
    Date of Patent: November 26, 2013
    Assignee: HGST Netherlands B.V.
    Inventors: Yoshio Uematsu, Tatsumi Tsuchiya, Tadaaki Tomiyama
  • Publication number: 20130256281
    Abstract: A solder-jet nozzle for laser-soldering head-connection pads of a head-stack assembly (HSA) for a hard-disk drive (HDD). The solder-jet nozzle includes a body, a central duct, and an outer surface of the body. The body includes a tip configured to deliver a solder ball in proximity to head-connection pads of a head-gimbal assembly (HGA) of the HSA. The central duct is configured to convey the solder ball to the tip. The outer surface of the body includes a first portion, and at least a first flat. The first portion substantially coincides with a conical surface of a cone with axis disposed about along the central axis of the body. The first flat, which is parallel to the central axis, is contiguous with the first portion, and intersects the conical surface of the cone. A laser-soldering tool and a method, for laser-soldering head-connection pads of the HSA are also provided.
    Type: Application
    Filed: March 30, 2012
    Publication date: October 3, 2013
    Inventors: Tatsumi Tsuchiya, Nobuyuki Hashi, Yusuke Matsumoto, Takuya Satoh
  • Publication number: 20130234062
    Abstract: The present invention provides a highly stable HFO refrigerant composition for use in a vapor compression-type refrigeration system, having improved slidability for the sliding portions of the vapor compression-type refrigeration system. More specifically, the present invention provides an HFO refrigerant composition comprising at least one type of HFO refrigerant and a polymer of halogenated propene represented by C3HaFbClc (provided that a+b+c=6, a=an integer of 1 to 3, b=an integer of 3 to 5, and c=an integer of 0 to 1) that is an oligomer having a molecular weight of 200 to 900.
    Type: Application
    Filed: November 29, 2011
    Publication date: September 12, 2013
    Applicant: Daikin Industries, Ltd.
    Inventors: Tatsumi Tsuchiya, Takashi Shibanuma
  • Patent number: 8496845
    Abstract: The present invention provides a refrigerant composition that is nonflammable, and ensures low LCCP and less burden on the environment. More specifically, the present invention relates a refrigerant composition containing difluoromethane (HFC32), pentafluoroethane (HFC125), and 2,3,3,3-tetrafluoropropene (HFO1234yf), the ratio of HFC32/HFC125/HFO1234yf being in a range surrounded by points (0/21/79 mass %), (16.6/25.3/58.1 mass %), and (0/28.4/71.6 mass %) in a ternary diagram of a refrigerant composition containing HFC32, HFC125, and HFO1234yf, and the composition essentially containing HFC32.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: July 30, 2013
    Assignee: Daikin Industries, Ltd.
    Inventors: Tatsumi Tsuchiya, Katsuki Fujiwara, Masahiro Noguchi, Yasufu Yamada
  • Patent number: 8477457
    Abstract: A head-gimbal assembly (HGA) with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge. The HGA includes a gimbal, a head-slider and a plurality of suspension-lead pads. The head-slider is coupled with the gimbal, and includes a plurality of head-slider pads. The plurality of suspension-lead pads is coupled with the plurality of head-slider pads by a plurality of solder bonds. A suspension-lead pad comprises a first lateral side, a second lateral side, a proximal side, disposed in proximity to a respective head-slider pad, and a distal side. A first width of the suspension-lead pad closer to the proximal side is substantially larger than a second width of the suspension-lead pad further from the proximal side than the first width. A disk drive including the HGA, and a head-slider with a head-slider pad having similar form to the suspension-lead pad are also provided.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: July 2, 2013
    Assignee: HGST Netherlands, B.V.
    Inventors: Yuhsuke Matsumoto, Tatsumi Tsuchiya, Eiki Oosawa, Tatsushi Yoshida
  • Patent number: 8427783
    Abstract: A head-gimbal assembly. The head-gimbal assembly includes a suspension, a microactuator disposed on the suspension, and a head-slider bonded to the microactuator. The head-gimbal assembly further includes a connection pad disposed on the suspension, a connection pad disposed on the microactuator and formed over an edge between a side surface and a top surface of the microactuator to have a bend portion with an obtuse angle, and a metallic interconnection joint for interconnecting the connection pad of the suspension with the connection pad of the microactuator.
    Type: Grant
    Filed: November 19, 2009
    Date of Patent: April 23, 2013
    Assignee: HGST Netherlands B.V.
    Inventors: Tatsumi Tsuchiya, Haruhide Takahashi, Akio Takatsuka, Hideto Imai, Toshiki Hirano
  • Publication number: 20130063839
    Abstract: A head-gimbal assembly (HGA) with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge. The HGA includes a gimbal, a head-slider and a plurality of suspension-lead pads. The head-slider is coupled with the gimbal, and includes a plurality of head-slider pads. The plurality of suspension-lead pads is coupled with the plurality of head-slider pads by a plurality of solder bonds. A suspension-lead pad comprises a first lateral side, a second lateral side, a proximal side, disposed in proximity to a respective head-slider pad, and a distal side. A first width of the suspension-lead pad closer to the proximal side is substantially larger than a second width of the suspension-lead pad further from the proximal side than the first width. A disk drive including the HGA, and a head-slider with a head-slider pad having similar form to the suspension-lead pad are also provided.
    Type: Application
    Filed: September 9, 2011
    Publication date: March 14, 2013
    Inventors: Yuhsuke Matsumoto, Tatsumi Tsuchiya, Eiki Oosawa, Tatsushi Yoshida
  • Patent number: 8318039
    Abstract: The present invention provides a non-flammable refrigerant, which is excellent in handleability while retaining the refrigerating capacity. Specifically, the present invention relates to a refrigerant composition comprising 36 to 50 mass % of 1,1,1,2-tetrafluoroethane (HFC134a) and 50 to 64 mass % of 2,3,3,3-tetrafluoropropene (HFO1234yf).
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: November 27, 2012
    Assignee: Daikin Industries, Ltd.
    Inventors: Takashi Shibanuma, Tatsumi Tsuchiya
  • Patent number: 8245749
    Abstract: A method for manufacturing a head-gimbal assembly. The head-gimbal assembly includes a head-slider bonded to a suspension. The method includes placing the head-slider and the suspension in a superposed manner with a photo-thermosetting adhesive applied between the head-slider and the suspension. The method also includes heating the suspension from a side of the suspension opposite to a side of the suspension in contact with the photo-thermosetting adhesive with a heated gas-stream. In addition, the method includes irradiating the photo-thermosetting adhesive with light at least partly in a time period during which the suspension is heated by the gas-stream.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: August 21, 2012
    Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
    Inventors: Hideto Imai, Tatsumi Tsuchiya, Eiki Oosawa, Naoki Suzuki
  • Publication number: 20110312101
    Abstract: The present invention provides a stabilized refrigerant composition containing a hydrofluoropropene with low global warming potential (GWP) that can remain stable even in the presence of air (oxygen) for a long period of time. More specifically, the present invention provides a refrigerant composition containing a hydrofluoropropene and a stabilizer. The stabilizer is at least one member selected from the group consisting of alkylcatechols, alkoxyphenols, benzoquinones, phenothiazines, and phthalates.
    Type: Application
    Filed: February 26, 2010
    Publication date: December 22, 2011
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Tatsumi Tsuchiya, Takashi Shibanuma, Yasufu Yamada, Hitomi Arimoto
  • Patent number: 7984545
    Abstract: Approaches for helping to decrease the amount of inactive gas necessary for reflow to interconnect connection terminals of a head slider and a suspension. Inactive gas is blown from a nozzle of a reflow apparatus toward interconnection joints of a head slider and a suspension. The head slider is bonded onto a gimbal tongue. The nozzle comprises a duct through which the inactive gas passes and a porous member fitted in an ejection outlet of the tube. Placing the porous member close to the head slider achieves effective reduction of oxygen concentration around solder balls.
    Type: Grant
    Filed: July 25, 2008
    Date of Patent: July 26, 2011
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Yuhsuke Matsumoto, Tatsumi Tsuchiya, Hideto Imai, Tamaki Ushimoto