Patents by Inventor Tatsuo Ito

Tatsuo Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6464814
    Abstract: A method for molding an end of a long resin molded article that is obtained by extrusion molding and has a design surface and an attachment surface extended in a longitudinal direction of the long resin molded article, and the attachment surface is attached to other parts. An end portion of the long resin molded article is heated so as to soften the end portion of the long resin molded article. The design surface of the heated end portion is pressed so as to stretch resin on a side of the design surface thereby forming an inclined surface on the end portion, whereby the end portion is inclined from the design surface at the end portion to said attachment surface at the end portion along said inclined surface. The attachment surface of the heated end portion is pressed so as to form a cavity on the attachment surface and stretch resin on a side of the attachment surface.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: October 15, 2002
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Yasunobu Teramoto, Shinichi Goto, Tatsuo Ito, Hiroshi Mukai, Hiroshi Iwasaki, Masahiro Nakatani
  • Patent number: 6400671
    Abstract: In a photodetector, the minimum size of the photodetection area for detecting a focus error signal from a light beam on the inner radius side of a hologram is made smaller than the minimum diameter of diffracted light beam spots (30, 31) for recording and reproduction, and when a CD is reproduced, a light beam close to the optical axis is made to significantly contribute to the focus error signal and the minimum size of the photodetection area for detecting the focus error signal from a light beam from the peripheral side of the hologram is made larger than the minimum diameter of diffracted light beam spots (130, 131) for recording and reproduction, whereby the focus error signal is made equal to the normal focus error signal when a DVD is reproduced, so that the focus offset variation caused when the base material thickness varies can be reduced.
    Type: Grant
    Filed: July 2, 2001
    Date of Patent: June 4, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideki Hayashi, Tatsuo Ito, Yoshiaki Komma, Hiroaki Yamamoto, Seiji Nishino
  • Publication number: 20020049638
    Abstract: This mechanism monitors status of use of consumable goods used in a printing device, applies a discount service in accordance with the status of use to the consumable goods at a predetermined Web sale, and pays compensation to a trader that is managing the predetermined Web sale.
    Type: Application
    Filed: June 28, 2001
    Publication date: April 25, 2002
    Inventor: Tatsuo Ito
  • Patent number: 6352207
    Abstract: In an expansion valve having a control mechanism with an airtight chamber, the airtight chamber is sealed by a steel ball joined into a filling hole in a metallic wall of the airtight chamber. The steel ball is fixed by resistance welding for sealing the filling hole. The diameter ratio between the inner diameter of the filling hole and the outer diameter of the spherical surface of the steel ball is set to a value falling in a range from 0.6 to 0.85.
    Type: Grant
    Filed: September 22, 2000
    Date of Patent: March 5, 2002
    Assignee: TGK Co., Ltd.
    Inventors: Satoshi Kawakami, Isao Sendo, Tatsuo Ito, Shigeyoshi Ueno
  • Publication number: 20010040853
    Abstract: In a photodetector, the minimum size of the photodetection area for detecting a focus error signal from a light beam on the inner radius side of a hologram is made smaller than the minimum diameter of diffracted light beam spots (30, 31) for recording and reproduction, and when a CD is reproduced, a light beam close to the optical axis is made to significantly contribute to the focus error signal and the minimum size of the photodetection area for detecting the focus error signal from a light beam from the peripheral side of the hologram is made larger than the minimum diameter of diffracted light beam spots (130, 131) for recording and reproduction, whereby the focus error signal is made equal to the normal focus error signal when a DVD is reproduced, so that the focus offset variation caused when the base material thickness varies can be reduced.
    Type: Application
    Filed: July 2, 2001
    Publication date: November 15, 2001
    Inventors: Hideki Hayashi, Tatsuo Ito, Yoshiaki Komma, Hiroaki Yamamoto, Seiji Nishino
  • Patent number: 6278670
    Abstract: In a photodetector, the minimum size of the photodetection area for detecting a focus error signal from a light beam on the inner radius side of a hologram is made smaller than the minimum diameter of diffracted light beam spots (30, 31) for recording and reproduction, and when a CD is reproduced, a light beam close to the optical axis is made to significantly contribute to the focus error signal and the minimum size of the photodetection area for detecting the focus error signal from a light beam from the peripheral side of the hologram is made larger than the minimum diameter of diffracted light beam spots (130, 131) for recording and reproduction, whereby the focus error signal is made equal to the normal focus error signal when a DVD is reproduced, so that the focus offset variation caused when the base material thickness varies can be reduced.
    Type: Grant
    Filed: October 27, 1999
    Date of Patent: August 21, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideki Hayashi, Tatsuo Ito, Yoshiaki Komma, Hiroaki Yamamoto, Seiji Nishino
  • Publication number: 20010002610
    Abstract: A method for molding an end of a long resin molded article is disclosed. The long resin molded article is obtained by extrusion molding and having a design surface and an attachment surface extended in a longitudinal direction of the long resin molded article, and the attachment surface is attached to other parts. An end portion of the long resin molded article is heated so as to soften the end portion of the long resin molded article. The design surface of the heated end portion is pressed so as to stretch resin on a side of the design surface thereby forming an inclined surface on the end portion, whereby the end portion is inclined from the design surface at the end portion to said attachment surface at the end portion along said inclined surface. And the attachment surface of the heated end portion is pressed so as to form a cavity on the attachment surface and stretch resin on a side of the attachment surface.
    Type: Application
    Filed: January 25, 2001
    Publication date: June 7, 2001
    Applicant: Toyoda Gosei Co., Ltd.
    Inventors: Yasunobu Teramoto, Shinichi Goto, Tatsuo Ito, Hiroshi Mukai, Hiroshi Iwasaki, Masahiro Nakatani
  • Patent number: 6072620
    Abstract: Microlenses 3a and 3b are formed on a first surface of a transparent substrate, and an output efficiency control device 2 which modulates a light amount of incident light is provided on a second surface opposing the first surface. Incident light 4 is made to be incident obliquely to an optical axis of the microlens 3a, to be focused on the output efficiency control device 2. The output efficiency control device 2 modulates a light amount of incident light and outputs the light as outgoing light 5 through the microlens 3b. Because of such a structure, the output efficiency control device 2 can be decreased in size, compared with a diameter of a beam and an aperture of a microlens.
    Type: Grant
    Filed: June 25, 1997
    Date of Patent: June 6, 2000
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Teruhiro Shiono, Michihito Ueda, Tatsuo Ito, Kazuo Yokoyama
  • Patent number: 5949570
    Abstract: The diffractive optical modulator of the invention includes: a plate having a portion functioning as a first electrode; a spacer layer formed on the plate; and a grating consisting of a plurality of beams having a portion functioning as a second electrode, both ends of the beams being supported on the spacer layer. In the diffractive optical modulator, by adjusting a voltage applied between the first electrode and the second electrode, a distance between the beams and the plate is varied, thereby controlling the diffraction efficiency. An insulating layer is further provided between the plate and the plurality of beams.
    Type: Grant
    Filed: May 1, 1997
    Date of Patent: September 7, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Teruhiro Shiono, Michihito Ueda, Tatsuo Ito, Kazuo Yokoyama, Shinichi Mizuguchi
  • Patent number: 5920418
    Abstract: The diffractive optical modulator of the invention includes: a plate having a portion functioning as a first electrode; a spacer layer formed on the plate; and a grating consisting of a plurality of beams having a portion functioning as a second electrode, both ends of the beams being supported on the spacer layer. In the diffractive optical modulator, by adjusting a voltage applied between the first electrode and the second electrode, a distance between the beams and the plate is varied, thereby controlling the diffraction efficiency. An insulating layer is further provided between the plate and the plurality of beams.
    Type: Grant
    Filed: June 20, 1995
    Date of Patent: July 6, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Teruhiro Shiono, Michihito Ueda, Tatsuo Ito, Kazuo Yokoyama, Shinichi Mizuguchi
  • Patent number: 5653803
    Abstract: One or a plurality of silicon growth layers are formed on both sides of a silicon base substrate wafer and the product is then divided, with the dividing plane in said silicon base substrate wafer parallel to the main surface, into two pieces to obtain two substrates used for manufacturing silicon semiconductor elements. Said dividing-in-half process is a process in which said silicon base substrate wafer portion is cut along a plane parallel to the main surface, or a process which includes said cutting process followed by a process of treating the cut-surface. Said process which cuts the silicon base substrate wafer portion is a process in which the wafers are cut one by one, or cut after a plurality of them are laminated.
    Type: Grant
    Filed: March 1, 1995
    Date of Patent: August 5, 1997
    Assignee: Shin-Etsu Handotai Co. Ltd.
    Inventor: Tatsuo Ito
  • Patent number: 5418889
    Abstract: A knowledge base generating system includes a knowledge base having a first knowledge base containing sets of causal relation knowledge describing cause-effect relations of events taking place within a target machine, and having a second knowledge base containing sets of membership knowledge describing a structure of members of the target machine, each event of the cause-effect relations having data to identify one of the members, so that the first and second knowledge bases have mutually retrievable data, a retrieval part for retrieving a number of first members in the second knowledge base, which members correspond to similar causal relation knowledge sets within the first knowledge base, a detection part for detecting whether or not there is a high-rank member in the second knowledge base, the high-rank member corresponding to each of the first members on the basis of the membership knowledge of the second knowledge base, and a commonizing part for generating a common causal relation knowledge set, corresp
    Type: Grant
    Filed: December 1, 1992
    Date of Patent: May 23, 1995
    Assignee: Ricoh Company, Ltd.
    Inventor: Tatsuo Ito
  • Patent number: 5416630
    Abstract: A circular arc illumination apparatus includes a light source section for emitting rays, a condensing optical system for condensing the rays emitted by the light source section, a rotating mirror driven by a motor and reflecting the condensed rays from the condensing optical system, and a circular arc-shaped bending mirror for reflecting the rays reflected by the rotating mirror toward a mask so that the rays become incident on the mask. The apparatus effectively utilizes light emitted by the light source section, exposes an object uniformly, and is practical and economical for exposing a large substrate.
    Type: Grant
    Filed: June 2, 1993
    Date of Patent: May 16, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tatsuo Ito, Toshiyuki Watanabe, Masaki Suzuki
  • Patent number: 5390044
    Abstract: A circular arc illumination apparatus includes a light source device, a condensing optical system for condensing rays emitted by the light source device, and a scanning optical system for transmitting the rays to an object to be scanned. The scanning optical system includes a driving device, a rotating mirror driven by the driving device, an angular velocity detecting device for detecting an angular velocity of the rotating mirror, a controller for controlling the driving device based on an angular velocity of the rotating mirror detected by the angular velocity detecting device so as to vary the angular velocity in one time scanning, and a circular arc-shaped bending mirror for reflecting scanning rays reflected by the rotating mirror to the object. The axis of the bending mirror is coincident with a rotary axis of the rotating mirror.
    Type: Grant
    Filed: June 2, 1993
    Date of Patent: February 14, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tatsuo Ito, Toshiyuki Watanabe, Masaki Suzuki
  • Patent number: 5232870
    Abstract: A bonded wafer enjoying high strength of bonding of component wafers thereof is produced by a method which comprises causing the surfaces for mutual attachment of two semiconductor wafers to be irradiated with an ultraviolet light in an atmosphere of oxygen immediately before the two semiconductor wafers are joined to each other. One of the two semiconductor wafers to be used for the bonded wafer optionally has an oxide film formed on one surface thereof. One of the component wafers of the bonded wafer is optionally polished until the component wafer is reduced to a thin film.
    Type: Grant
    Filed: September 4, 1991
    Date of Patent: August 3, 1993
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Tatsuo Ito, Yasuaki Nakazato
  • Patent number: 5181305
    Abstract: A process for the manufacture of slide fasteners from an elongate stringer chain is disclosed in which the stringer chain is maintained in tensionless suspension at predetermined locations along the path of its movement through various stages of production. A plurality of processing units are controlled so as to operate in synchronized relation to one of such units which has a slowest cycle of operation.
    Type: Grant
    Filed: June 5, 1991
    Date of Patent: January 26, 1993
    Assignee: Yoshida Kogyo K.K.
    Inventors: Masahide Ozaki, Masanori Uji, Makoto Yamazaki, Tatsuo Ito
  • Patent number: 5152857
    Abstract: In a method for preparing a substrate for semiconductor device, the substrate is prepared either by directly bonding a bonding wafer to a base wafer or by bonding the bonding wafer to the base wafer with an oxide film formed on at least the bonding surface of the bonding wafer or the bonding surface of the base wafer to make finished semiconductor devices with an SOI structure. Prior to the bonding operation, the bonding wafer and the base wafer are subjected to the steps of (1) making the diameter of the bonding wafer smaller than the diameter of the base wafer, (2) setting the beveling width of the back side (bonding side) of the bonding wafer at 50 microns or less, and (3) beveling the front side of said base wafer so that the bonding surface of the base wafer is equal in size to the bonding surface of the bonding wafer.
    Type: Grant
    Filed: March 21, 1991
    Date of Patent: October 6, 1992
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Tatsuo Ito, Atsuo Uchiyama, Masao Fukami
  • Patent number: 5138763
    Abstract: A method of and apparatus for manufacturing slide fasteners of selected product lengths from an elongate continuous stringer chain, the method comprising selecting predetermined fastener component parts from among a plurality of such respective component parts which differ in type, form, material and color, feeding and applying the selected parts one at a time to the stringer chain. The apparatus reducing the method to practice comprises operating units arranged to selectively feed and apply the component parts under computer program control.
    Type: Grant
    Filed: August 13, 1991
    Date of Patent: August 18, 1992
    Assignee: Yoshida Kogyo K.K.
    Inventors: Hiroshi Mizuno, Kazuki Kuse, Shunji Akashi, Hiroshi Yoshida, Yozo Okada, Tatsuo Ito
  • Patent number: 5103555
    Abstract: A method of and apparatus for manufacturing slide fasteners of selected product lengths from an elongate continuous stringer chain, the method comprising selecting predetermined fastener component parts from among a plurality of such respective component parts which differ in type, form, material and color, feeding and applying the selected parts one at a time to the stringer chain. The apparatus reducing the method to practice comprises operating units arranged to selectively feed and apply the component parts under computer program control.
    Type: Grant
    Filed: August 13, 1991
    Date of Patent: April 14, 1992
    Assignee: Yoshida Kogyo K.K.
    Inventors: Hiroshi Mizuno, Kazuki Kuse, Shunji Akashi, Hiroshi Yoshida, Yozo Okada, Tatsuo Ito
  • Patent number: 5077884
    Abstract: A method of and apparatus for manufacturing slide fasteners of selected product lengths from an elongate continuous stringer chain, the method comprising selecting predetermined fastener component parts from among a plurality of such respective component parts which differ in type, form, material and color, feeding and applying the selected parts one at a time to the stringer chain. The apparatus reducing the method to practice comprises operating units arranged to selectively feed and apply the component parts under computer program control.
    Type: Grant
    Filed: July 9, 1990
    Date of Patent: January 7, 1992
    Assignee: Yoshida Kogyo K.K.
    Inventors: Hiroshi Mizuno, Kazuki Kuse, Shunji Akashi, Hiroshi Yoshida, Yozo Okada, Tatsuo Ito