Patents by Inventor Tatsuo Kataoka

Tatsuo Kataoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100244281
    Abstract: Objects of the present invention is to provide a flexible printed wiring board which has a simple structure, which can be produced at low cost, and which can effectively dissipate heat generated by semiconductor chips, and to provide a semiconductor device employing the flexible printed wiring board. The flexible printed wiring board of the invention has an insulating substrate, and a wiring pattern formed of a conductor layer and provided on one surface of the insulating substrate, wherein the wiring pattern includes inner leads for mounting a semiconductor chip and outer leads for input and output wire connection, and a metal layer is adhered to the wiring pattern via an insulating adhesion layer.
    Type: Application
    Filed: March 30, 2010
    Publication date: September 30, 2010
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Katsuhiko HAYASHI, Tatsuo KATAOKA
  • Publication number: 20090314525
    Abstract: A process for producing a wiring board is provided, comprising allowing a wiring board-forming mold, which comprises a support base and a mold pattern that is formed in a protruded shape on one surface of the support base wherein the sectional width of the mold pattern on the support base side is larger than the sectional width thereof on the tip side in the same section of the mold pattern, to penetrate into a curing resin layer to transfer the mold pattern, curing the curing resin layer, releasing the laminate from the mold, depositing a conductive metal, and polishing the deposited metal layer that to form a depressed wiring pattern, and a wiring board produced by this process.
    Type: Application
    Filed: May 31, 2006
    Publication date: December 24, 2009
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Hitoshi Kajino, Takeo Taguchi, Kanji Sato, Masahito Ishii, Tatsuo Kataoka
  • Publication number: 20090317591
    Abstract: A metal composite laminate for producing a flexible wiring board a wiring-forming metal layer for forming a wiring pattern that is laminated on the front surface of a flexible insulating resin layer, a support metal layer that serves as a support is laminated on the back surface of the insulating resin layer. The total thickness (Wt) of the metal composite laminate; the thickness (W0) of the insulating resin layer; the mean surface roughness (Rz-1) of the wiring-forming metal layer facing the front surface of the insulating resin layer; and the mean surface roughness (Rz-2) of the support metal layer facing the back surface of the insulating resin layer are controlled.
    Type: Application
    Filed: September 13, 2007
    Publication date: December 24, 2009
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Tetsuro Sato, Makoto Yamagata, Noriaki Iwata, Toshiaki Ono, Yasuo Komoda, Tatsuo Kataoka, Shuji Chikujo, Naoaki Ogawa
  • Publication number: 20090183901
    Abstract: A wiring board includes an insulating substrate and a wiring pattern. The wiring pattern includes a main body and an upper end portion and is embedded in the insulating substrate while exposing at least the upper end portion on a surface of the insulating substrate. The upper end portion has a cross-sectional width smaller than that of a lower end portion of the wiring pattern embedded in the insulating substrate. The upper end portion is formed of a metal that is more noble than a metal of the main body of the wiring pattern. The wiring board having this structure achieves very high adhesion of the wiring pattern to the insulating layer.
    Type: Application
    Filed: August 9, 2007
    Publication date: July 23, 2009
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Tatsuo Kataoka, Hirokazu Kawamura
  • Patent number: 7523548
    Abstract: A process for producing a printed wiring board comprises the steps of depositing a base metal on at least one surface of an insulating film to form a base metal layer and further depositing copper or a copper alloy to form a conductive metal layer, then removing a surface metal layer, which is formed through the above step, by etching to form a wiring pattern, and then treating the base metal layer with a treating liquid capable of dissolving and/or passivating the metal that forms the base metal layer. The printed wiring board so provided comprises an insulating film and a wiring pattern formed on at least one surface of the insulating film, the wiring pattern including a base metal layer deposited on the insulating film surface and a conductive metal layer, the base metal layer for forming the wiring pattern protrudes in a widthwise direction more than the conductive metal layer for forming the wiring pattern.
    Type: Grant
    Filed: December 2, 2004
    Date of Patent: April 28, 2009
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tatsuo Kataoka, Yoshikazu Akashi, Yutaka Iguchi
  • Patent number: 7495177
    Abstract: A printed wiring board manufacturing process comprises forming a conductive metal layer on at least one surface of an insulating film with a sputtered metal layer in between, selectively etching the conductive metal layer and the sputtered metal layer to produce a wiring pattern, treating the laminated film with a first treatment liquid capable of dissolving nickel of the sputtered metal layer, and treating with a second treatment liquid capable of dissolving chrome of the sputtered metal layer and also capable of eliminating the sputtered metal layer in the insulating film to remove a superficial surface of the insulating film exposed from the wiring pattern together with the residual sputtered metals in the superficial surface. A printed wiring board comprises an insulating film and a wiring pattern, wherein the insulating film in an area exposed from the wiring pattern has a thickness smaller by 1 to 100 nm than that of an area under the wiring pattern.
    Type: Grant
    Filed: December 2, 2004
    Date of Patent: February 24, 2009
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tatsuo Kataoka, Yoshikazu Akashi, Yutaka Iguchi
  • Publication number: 20090044971
    Abstract: The printed wiring board includes an insulating base and a plurality of wirings formed on the surface of the insulating base, wherein the wiring circuit has a conductive undercoat layer formed on the surface of the insulating base, a Cu nodule layer formed on the upper surface of the undercoat layer, a cover plating layer formed on the upper surface of the Cu nodule layer and a first metal plating layer formed on the upper surface of the cover plating layer, and on the upper surface of the wiring circuit, a protruded and depressed surface attributable to protrusions and depressions of the upper surface of the Cu nodule layer is formed. The printed wiring board can be produced by depositing the above metal layers such as the Cu nodule layer with regulating a sidewall surface of a pattern formed from the photosensitive resin. Ruther conductive bonding is possible by the use of an adhesive only.
    Type: Application
    Filed: November 13, 2006
    Publication date: February 19, 2009
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Tatsuo Kataoka, Hirokazu Kawamura
  • Publication number: 20080236872
    Abstract: The printed wiring board of the present invention is a printed wiring board produced by selectively etching a base film having a base metal layer and a conductive metal layer, which are formed on an insulating film, through plural etching steps comprising a conductive metal etching step and a base metal etching step to form a wiring pattern and then bringing the base film having the thus formed wiring pattern into contact with a reducing aqueous solution containing a reducing substance, wherein the amount of a residual metal derived from the etching solution on the printed wiring board is not more than 0.05 ?g/cm2. According to the present invention, the metal derived from the etching solution is removed by the use of a reducing substance-containing solution. Therefore, the water rinsing step in the production process can be shortened, occurrence of migration attributable to the residual metal can be prevented, and a printed wiring board having high reliability can be efficiently produced.
    Type: Application
    Filed: June 3, 2005
    Publication date: October 2, 2008
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Tatsuo Kataoka, Yoshikazu Akashi, Yutaka Iguchi, Hiroaki Kurihara, Naoya Yasui
  • Publication number: 20070145584
    Abstract: The printed wiring board comprises, on at least one surface of an insulating film, a base metal layer and a conductive metal layer formed on the base metal layer, and is characterized in that in a section of the wiring board the bottom width of the conductive metal layer is smaller than the top width of the base metal layer. The circuit device comprises the printed wiring board and an electronic part mounted thereon. The process for producing a printed wiring board comprises bringing a base metal layer and a conductive metal layer into contact with an etching solution capable of dissolving the conductive metal to form a wiring pattern and then sequentially bringing the resultant into contact with a first treating solution capable of dissolving the metal for forming the base metal layer, a microetching solution capable of selectively dissolving the conductive metal and a second treating solution having a different chemical composition from the first treating solution in this order.
    Type: Application
    Filed: December 10, 2004
    Publication date: June 28, 2007
    Applicant: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tatsuo Kataoka, Yoshikazu Akashi, Yutaka Iguchi
  • Publication number: 20070111401
    Abstract: A printed wiring board manufacturing process comprises forming a conductive metal layer on at least one surface of an insulating film with a sputtered metal layer in between, selectively etching the conductive metal layer and the sputtered metal layer to produce a wiring pattern, treating the laminated film with a first treatment liquid capable of dissolving nickel of the sputtered metal layer, and treating with a second treatment liquid capable of dissolving chrome of the sputtered metal layer and also capable of eliminating the sputtered metal layer in the insulating film to remove a superficial surface of the insulating film exposed from the wiring pattern together with the residual sputtered metals in the superficial surface. A printed wiring board comprises an insulating film and a wiring pattern, wherein the insulating film in an area exposed from the wiring pattern has a thickness smaller by 1 to 100 nm than that of an area under the wiring pattern.
    Type: Application
    Filed: September 2, 2004
    Publication date: May 17, 2007
    Applicant: Mitsui Mining & Smelting Co., LTD
    Inventors: Tatsuo Kataoka, Yoshikazu Akashi, Yutaka Iguchi
  • Publication number: 20070101571
    Abstract: [Solution means] A process for producing a printed wiring board comprises the steps of depositing a base metal on at least one surface of an insulating film to form a base metal layer and further depositing copper or a copper alloy to form a conductive metal layer, then removing a surface metal layer, which is formed through the above step, by etching to form a wiring pattern, and then treating the base metal layer with a treating liquid capable of dissolving and/or passivating the metal that forms the base metal layer. The printed wiring board so provided comprises an insulating film and a wiring pattern formed on at least one surface of the insulating film, the wiring pattern including a base metal layer deposited on the insulating film surface and a conductive metal layer, the base metal layer for forming the wiring pattern protrudes in a widthwise direction more than the conductive metal layer for forming the wiring pattern.
    Type: Application
    Filed: December 2, 2004
    Publication date: May 10, 2007
    Applicant: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tatsuo Kataoka, Yoshikazu Akashi, Yutaka Iguchi
  • Publication number: 20070006904
    Abstract: A substrate cleaning system that cleans a glass substrate by supplying liquid and gas to spray nozzles and by spraying fluid, where the liquid and the gas are mixed in the spray nozzles, onto the substrate in order to effectively remove foreign objects attached on the end surface of substrate after performing mechanical cut-off or polishing treatment, the system has: liquid heating means for heating the liquid to be supplied to the spray nozzles to control the temperature of the liquid, in which the temperature of the liquid at the inlet of the spray nozzles is controlled at 40° C. to 100° C.
    Type: Application
    Filed: June 26, 2006
    Publication date: January 11, 2007
    Applicant: SPC ELECTRONICS CORPORATION
    Inventors: Takehiro Hagiwara, Tatsuo Kataoka, Seiji Noda, Takafumi Nakai
  • Patent number: 7060364
    Abstract: A film carrier tape for mounting electronic components or devices that excels in not only migration resistance but also adhesiveness of wiring to insulating film; and a process for producing the same. The film carrier tape for mounting electronic components or devices has seed layer comprising a zinc layer superimposed on a treated surface of insulating film and a nickel base metal layer superimposed on a surface of a zinc layer, or comprising a layer of alloy containing elemental nickel and elemental zinc in specified proportion, superimposed on a treated surface of insulating film). In the film carrier tape for mounting electronic components or devices, at least part of a region extending across a width of wiring from an edge side thereof to the treated surface of the insulating film may be continuously covered with a zinc coating layer comprising elemental zinc.
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: June 13, 2006
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tatsuo Kataoka, Yoshikazu Akashi
  • Publication number: 20060027912
    Abstract: A film carrier tape for mounting electronic components includes comprises an insulating film and, on the surface thereof, an inner connection terminal, an outer connection terminal and wiring for connecting these terminals, and further includes a solder resist layer covered in such a way that the connection terminals are exposed, and the tape secures an electrical connection of a connection terminal of an electronic component and the inner connection terminal by applying an ultrasonic wave on the inner connection terminal in mounting the electronic component. The wiring positioned from a part where the inner connection terminal is electrically connected with the connection terminal of the electronic component to the edge of the solder resist layer and wiring in a 1000 ?m length from the edge of the solder resist, which wiring is protected by the solder resist layer, are formed in an almost straight shape.
    Type: Application
    Filed: November 6, 2003
    Publication date: February 9, 2006
    Inventors: Tatsuo Kataoka, Hiroyuki Soutome
  • Patent number: 6955178
    Abstract: A substrate treatment apparatus includes a substrate heating device for maintaining a substrate at a temperature higher than room temperature, a wetting device for producing a wet ozone-containing gas by wetting an ozone-containing gas with a treatment solution, and a supply device for supplying the wet ozone-containing gas from the wetting device to a work object on a surface of the substrate. The supply device includes a gas disperser including apertures aligned in rows in a width direction of the work object. The apertures in adjacent rows are not aligned with each other in a direction perpendicular to the rows. At least one of the gas disperser and the substrate is movable in a direction perpendicular to the rows. A gas conduit connects the wetting device to the supply device. A wet ozone-containing gas heating device heats the wet ozone-containing gas to a temperature at least equal to the temperature of the substrate.
    Type: Grant
    Filed: July 25, 2003
    Date of Patent: October 18, 2005
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masaki Kuzumoto, Seiji Noda, Izumi Oya, Makoto Miyamoto, Hideo Horibe, Tatsuo Kataoka, Tetsuji Oishi
  • Publication number: 20040219341
    Abstract: A film carrier tape for mounting electronic components or devices that excels in not only migration resistance but also adhesiveness of wiring to insulating film; and a process for producing the same. The film carrier tape for mounting electronic components or devices has seed layer comprising a zinc layer superimposed on a treated surface of insulating film and a nickel base metal layer superimposed on a surface of a zinc layer, or comprising a layer of alloy containing elemental nickel and elemental zinc in specified proportion, superimposed on a treated surface of insulating film). In the film carrier tape for mounting electronic components or devices, at least part of a region extending across a width of wiring from an edge side thereof to the treated surface of the insulating film may be continuously covered with a zinc coating layer comprising elemental zinc.
    Type: Application
    Filed: December 23, 2003
    Publication date: November 4, 2004
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Tatsuo Kataoka, Yoshikazu Akashi
  • Publication number: 20040202958
    Abstract: A plating-pretreatment solution comprising an organic sulfonic acid, thiourea, fluoroboric acid and hypophosphorous acid and a plating-pretreatment method comprising contacting a film carrier tape in which a wiring pattern is formed on a surface of an insulating film with a plating-pretreatment solution comprising an organic sulfonic acid, thiourea, fluoroboric acid and hypophosphorous acid to remove metals remaining on the insulating film. According to the plating-pretreatment solution and the plating-pretreatment method, metals remaining on the surface of the insulating film exposed by etching are removed, and the occurrence of migration is prevented.
    Type: Application
    Filed: April 8, 2004
    Publication date: October 14, 2004
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Tatsuo Kataoka, Yoshikazu Akashi
  • Patent number: 6798048
    Abstract: A 2-metal layer TAB and a both-sided CSP.BGA tape having an insulating substrate and a wiring layer provided on at least both sides of the substrate, the substrate having evenly spaced sprocket holes on both width direction edges in the longitudinal direction thereof and also having through-holes formed with a punching press, and the through-holes being filled with a conductor by means of a punching press such that the conductor and the wiring layers are electrically connected, which is characterized by having round pilot holes between the sprocket holes formed in the longitudinal direction thereof; and a process of producing the same.
    Type: Grant
    Filed: May 13, 2002
    Date of Patent: September 28, 2004
    Assignees: Mitsui Mining & Smelting Company, Ltd., Suzuki Co., Ltd.
    Inventors: Akira Ichiryu, Tatsuo Kataoka, Hirokazu Kawamura, Katsuhiko Hayashi, Masahito Ishii
  • Patent number: 6715944
    Abstract: An apparatus for removing a photoresist film includes a substrate cassette for fixing a substrate having a surface covered with a photoresist film, an ozone feed tube for supplying ozone, a liquid feed tube for supplying a liquid photoresist film removing solution, and a processing tank for recovering and processing at least one of ozone and the liquid photoresist film removing solution, wherein the liquid photoresist film removing solution is supplied through the liquid feed tube as a liquid or mist, at least one of ozone and the photoresist film removing solution being continuously supplied.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: April 6, 2004
    Assignees: Mitsubishi Denki Kabushiki Kaisha, Shimada Rika Kougyo Kabushiki Kaisha
    Inventors: Izumi Oya, Seiji Noda, Makoto Miyamoto, Masaki Kuzumoto, Masashi Ohmori, Tatsuo Kataoka
  • Publication number: 20040026122
    Abstract: A printed circuit board comprising an insulating substrate, a via hole (16) formed in the insulating substrate, an implant material (15) filled in the via hole, and wiring patterns formed on the opposite surfaces of the substrates and electrically connected by the implant material, wherein the implant material is selected from a group consisting of acid-free copper, phosphorus-deoxidized copper and tough-pitch copper. Since the via hole comprises high-heat-resisting acid-free copper, phosphorus-deoxidized copper and tough-pitch copper, the printed circuit board is not likely to be deteriorated even when exposed, as is often the case, to a condition that heating/cooling between high temperatures and low temperatures is repeated, and can be used for an extended time while keeping an excellent heat resistance.
    Type: Application
    Filed: July 30, 2003
    Publication date: February 12, 2004
    Inventors: Katsuhiko Hayashi, Tatsuo Kataoka, Hirokazu Kawamura, Akira Ichiryu