Abstract: An electric compressor includes a compression mechanism, an electric motor and a housing. The compression mechanism draws, compresses and discharges refrigerant gas. The electric motor drives the compression mechanism. The housing accommodates the compression mechanism and the electric motor. A heat sink extends from the housing. An inverter is located in the housing. The inverter powers the electric motor. A heat sink cools the inverter. The heat sink is cooled by refrigerant gas. The heat generated by the inverter is therefore effectively reduced.

Abstract: A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality.

Abstract: A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

Abstract: A wire harness protector 21 is capable of holding a wire harness 23, and includes a grip portion 33, and the grip portion 33 is mounted on a mounting member (first link) 25 while being flexed. The wire harness protector further includes a cover (protector cover) 30 for preventing the flexing of the grip portion 33.

Abstract: A piezoelectric filter which is adapted to reduce its height and to electrically and mechanically protect the resonators thereof, and is easy to manufacture and assemble, wherein a plurality of resonators S1 through S3 and P1 through P3 are surrounded by respective frame-like spacers 2a, 2b, 2c; 22a, 22b, 22c and laid one on the other with intermediary printed circuit boards 3a, 3b; 23a, 23b interposed therebetween, a top printed circuit board 4; 24 are placed on the top, a bottom printed circuit board 5; 25 provided on the lower surface thereof with a plurality of connection electrodes 18a, 18b, 18c, 38a, 38b, 38c are placed on the bottom, the frame-like spacers, the top printed circuit board and the bottom printed circuit board are bonded together along the peripheral edges thereof, and the electrodes of the resonators are electrically connected to respective connection electrodes by way of conduction patterns 13a through 13f; 33a through 33f formed on the respective printed circuit boards to produce an int

Abstract: A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

Abstract: A paste for via-hole filling is provided, and the paste comprises at least (a) 30-70 volume % of conductive particles whose average diameter ranges from 0.5 to 20 .mu.m and whose specific surface area ranges from 0.05 to 1.5 m.sup.2 /g, and (b) 70-30 volume % of resin comprising at least 10 weight % of epoxy resin comprising at least one epoxy group per molecule, in which the total amount of a hydroxyl group, an amino group and a carboxyl group is not more than 5 mol % of the epoxy group, and the epoxy equivalent ranges from 100 to 350 g/eq. The conductive paste for filling via-holes and a printed circuit board comprising thereof can be used to provide an inner-via-hole connection between electrode layers without using a through-hole plating technique. The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener and a dispersant if necessary. The paste having low viscosity and low volatility is used to fill holes disposed in a laminated substrate.

Abstract: A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality. By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably.

Abstract: The invention related to a paste for via hole filling which enables inner via hole connection between electrode layers without employing through hole plating techniques, and a multi-layered printed circuit board using the same. The conductive paste composition of the invention comprises a) 70-90 wt % of copper particles of an average particle size of 0.5-8 .mu.m; b) 0.5-15 wt % of insulating particles of an average particle size of 8-20 .mu.m; and, c) 6-17 wt % of heat setting type liquid epoxy resin, in order to exhibit low viscosity and low volatility. The conductive paste is printed and filled into through holes passing through a laminated substrate which is provide with copper foils on both sides thereof, to form a printed circuit board in which the via holes are electrically connected after thermosetting.

Abstract: A corrugate tube with an inserted wiring harness is provided through an insertion hole of a protector body fitted in a fixing hole of a panel member, and fixed by a pawl provided at an end of a flexible arm projecting from a bottom of an arm accommodating cutout and shaped to be engageable with a trough between neighboring corrugates on the corrugate tube, permitting a selective one of small-diameter and large-diameter corrugate tubes to be fixed in the insertion hole, allowing the corrugate tube to be shifted in one direction.

Abstract: A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate.

Abstract: A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

Abstract: A multi-functional chip-type piezoelectric filter of a simple configuration comprises a multilayer structure which includes a plurality of piezoelectric substrates provided with oscillating sections having respective frequency response characteristics that are different from each other, a plurality of conductive terminals formed on the outer surface of the multilayer structure and connected to the respective oscillating sections of the piezoelectric substrates so that the oscillating sections may be selectively used.

Abstract: A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.multidot.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.multidot.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate.

Abstract: A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 / g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique. The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate.

Abstract: A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.multidot.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.multidot.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate.

Abstract: A ladder type piezoelectric filter of the present invention is made usable in high frequency ranges by employing a piezoelectric resonator having the second harmonic wave mode SM. A series resonator and a parallel resonator of the ladder type piezoelectric filter of the present invention are so arranged that center electrode regions and outer electrode regions are mutually polarized along opposite directions, and the center electrode regions are connected to the outer electrode regions, respectively.

Abstract: There is provided a ladder type electric filter having a pair of vertically arranged parallel resonators and a pair of series resonators arranged side by side above the parallel resonators and, at the same time, held free from degradation in the performance of the filter, wherein the abutting surfaces of the raised connecting sections of a connecting terminal member that are held in close contact with the respective lower surface-electrodes of the series resonators partly overlap with the abutting surface of the raised connecting section of an output terminal member that is held in close contact with the upper surface-electrode of the upper parallel resonator if viewed from above.

Abstract: A method of adjusting a frequency response in a ladder-type electric filter having a pair of parallel resonators and a pair of strip-shaped series resonators arranged in a predetermined manner to form a fundamental filter circuit in which at least one of corner portions of each of the strip-shaped series resonators is beveled without changing its length L to regulate its resonance frequency so that the device can be stored within a case without displacing it from its proper position and held in contact with a contact at its node of vibration.

Abstract: A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality.By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably.