Abstract: Provided is an inorganic solid electrolyte material including sulfide-based inorganic solid electrolyte particles. In a frequency distribution of circularity of the particles where the circularity of the particles in the material is plotted on a horizontal axis and a number-based frequency is plotted on a vertical axis, a 10% cumulative value D10 is 0.54 to 0.80. In addition, a number-based median size d50 of the particles in the material is 0.1 to 10 ?m.

Abstract: Provided is a sulfide-based inorganic solid electrolyte material including Li, P, and S as constituent elements, in which in a spectrum obtained by 31P-NMR measurement, when a total area of peaks derived from a PS4 structure is represented by 1, a total area of peaks derived from a P2S6 glass structure is 0.1 or more.

Abstract: Provided is a sulfide-based inorganic solid electrolyte material having lithium ionic conductivity, in which the sulfide-based inorganic solid electrolyte material has a particle shape, and when a mode diameter in a number average particle size distribution of the sulfide-based inorganic solid electrolyte material that is obtained from an observed image of a scanning electron microscope (SEM) is represented by Dm [?m] and a particle size corresponding to a cumulative frequency of 90% in the number average particle size distribution is represented by D90 [?m], a value of D90/Dm is 1.6 or more and 8.0 or less.

Abstract: Provided is a phosphorus sulfide composition for a sulfide-based inorganic solid electrolyte material, the phosphorus sulfide composition including P4S10 and P4S5, in which when a total content of P4S10, P4S5, P4S7, and P4S3 in the phosphorus sulfide composition is represented by 100 mass %, a content of P4S10 calculated from a solid 31P-NMR spectrum is 70 mass % or more and 99 mass % or less.

Abstract: The method of manufacturing a sulfide-based inorganic solid electrolyte material, including: (A) preparing a sulfide-based inorganic solid electrolyte material in a vitreous state; and (B) annealing the sulfide-based inorganic solid electrolyte material in the vitreous state using a heating unit. Step (B) includes a step (B1) of disposing the sulfide-based inorganic solid electrolyte material in the vitreous state in a heating space, a step (B2) of annealing the sulfide-based inorganic solid electrolyte material in the vitreous state disposed in the heating space while increasing a temperature of the heating unit from an initial temperature T0 to an annealing temperature T1, and a step (B3) of annealing the sulfide-based inorganic solid electrolyte material in the vitreous state disposed in the heating space at the annealing temperature T1, and a temperature increase rate from the initial temperature T0 to the annealing temperature T1 in the step (B2) is 2° C./min or higher.

Abstract: Provided is a lithium nitride composition for a sulfide-based inorganic solid electrolyte material including ?-lithium nitride, wherein in a spectrum obtained by X-ray diffraction in which a CuK? ray is used as a radiation source, when a diffraction intensity of a diffraction peak present at a position of a diffraction angle 2?=23.0±0.3° is represented by I? and a diffraction intensity of a diffraction peak present at a position of a diffraction angle 2?=32.0±0.3° is represented by I?, a value of I?/I? is 4.50 or lower.

Abstract: Provided is a diphosphorus pentasulfide composition for a sulfide-based inorganic solid electrolyte material, in which a molar ratio (S/P) of a content of sulfur (S) to a content of phosphorus (P) is 2.40 or higher and 2.49 or lower. In the diphosphorus pentasulfide composition for a sulfide-based inorganic solid electrolyte material, in a DSC curve of the diphosphorus pentasulfide composition obtained by measurement using a differential scanning calorimeter under conditions of a start temperature of 25° C., a measured temperature range of 30° C. to 350° C., a temperature increase rate of 5° C./min, and an argon atmosphere with a flow rate of 100 ml per minute, an endothermic peak is shown in a temperature range of 280° C. or higher and 300° C. or lower, and a half-width of the endothermic peak is 4.1° C. or higher.

Abstract: Provided is a method of manufacturing a sulfide-based inorganic solid electrolyte material including Li, P, and S as constituent elements, the method including: a preparation step of preparing a raw material inorganic composition (A) including at least lithium sulfide, phosphorus sulfide, and a crystal nucleating agent; and a vitrification step of mechanically processing the raw material inorganic composition (A) to vitrify the raw material inorganic composition (A).

Abstract: A solder ball bonding tool includes a nozzle having an inner bore having a plurality of columnar surfaces and interposed retention structures that are positioned within the nozzle to retain a solder ball therein. A projection or projected shape formed by intersecting the retention structures may be generally circular, having a diameter less than the diameter of the solder balls for which the retention structures are positioned to retain. The nozzle may comprise a cemented carbide having less than or equal to a cumulative 4.5% of cobalt and gold serving as a binder.

Abstract: A solder ball bonding tool includes a nozzle having an inner bore having a plurality of columnar surfaces and interposed retention structures that are positioned within the nozzle to retain a solder ball therein. A projection or projected shape formed by intersecting the retention structures may be generally circular, having a diameter less than the diameter of the solder balls for which the retention structures are positioned to retain. The nozzle may comprise a cemented carbide having less than or equal to a cumulative 4.5% of cobalt and gold serving as a binder.

Abstract: An apparatus for interconnecting two connection pads in a head-gimbal assembly. The apparatus includes a conveyer for conveying a metallic slug, and a nozzle for ejecting the metallic slug toward the two connection pads. The nozzle includes a receiving portion for receiving the metallic slug from the conveyer, and a straight guide disposed downstream of the receiving portion. The straight guide has a maximum inner diameter that is smaller than a minimum inner diameter of the receiving portion. The apparatus also includes a laser for applying a laser beam from an inlet side of the nozzle to the metallic slug as the metallic slug passes along a path that includes a first portion through said straight guide and a second portion between the straight guide and the two connection pads. The laser is configured to melt the metallic slug for attaching the metallic slug to the two connection pads.

Abstract: A head-gimbal assembly (HGA) with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge. The HGA includes a gimbal, a head-slider and a plurality of suspension-lead pads. The head-slider is coupled with the gimbal, and includes a plurality of head-slider pads. The plurality of suspension-lead pads is coupled with the plurality of head-slider pads by a plurality of solder bonds. A suspension-lead pad comprises a first lateral side, a second lateral side, a proximal side, disposed in proximity to a respective head-slider pad, and a distal side. A first width of the suspension-lead pad closer to the proximal side is substantially larger than a second width of the suspension-lead pad further from the proximal side than the first width. A disk drive including the HGA, and a head-slider with a head-slider pad having similar form to the suspension-lead pad are also provided.

Abstract: A head-gimbal assembly (HGA) with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge. The HGA includes a gimbal, a head-slider and a plurality of suspension-lead pads. The head-slider is coupled with the gimbal, and includes a plurality of head-slider pads. The plurality of suspension-lead pads is coupled with the plurality of head-slider pads by a plurality of solder bonds. A suspension-lead pad comprises a first lateral side, a second lateral side, a proximal side, disposed in proximity to a respective head-slider pad, and a distal side. A first width of the suspension-lead pad closer to the proximal side is substantially larger than a second width of the suspension-lead pad further from the proximal side than the first width. A disk drive including the HGA, and a head-slider with a head-slider pad having similar form to the suspension-lead pad are also provided.

Abstract: A method for connecting electrical parts The method includes retaining a piece of metal within a nozzle, supplying inert gas to the nozzle, and irradiating the retained piece of metal with a light source while the supplied inert gas flows from apertures in the nozzle. The metal is melted by the light source. The method also includes ejecting the melted metal from the nozzle by the supplied inert gas onto electrical parts.

Abstract: An apparatus for interconnecting two connection pads in a head-gimbal assembly. The apparatus includes a conveyer for conveying a metallic slug, and a nozzle for ejecting the metallic slug toward the two connection pads. The nozzle includes a receiving portion for receiving the metallic slug from the conveyer, and a straight guide disposed downstream of the receiving portion. The straight guide has a maximum inner diameter that is smaller than a minimum inner diameter of the receiving portion. The apparatus also includes a laser for applying a laser beam from an inlet side of the nozzle to the metallic slug as the metallic slug passes along a path that includes a first portion through said straight guide and a second portion between the straight guide and the two connection pads. The laser is configured to melt the metallic slug for attaching the metallic slug to the two connection pads.

Abstract: Embodiments of the invention provide a head gimbal assembly (HGA) provided with a solder ball connecting structure suitable for the re-utilization of a suspension assembly. In one embodiment, the HGA includes lead wires provided at front ends thereof with lead pads and also includes slider pads capable of being connected to the lead pads by solder ball bonding with the use of solder balls. Respective grooves formed in the surfaces of the slider pads inhibit the solder balls from rotating and moving over the surfaces of the slider pads and the lead pads before the radiation of a laser beam.

Abstract: Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.

Abstract: Embodiments of the invention correct the static attitude of a head gimbal assembly (HGA) with high accuracy. In one embodiment, a vector group that constitutes the shortest path from the initial attitude of the HGA to the final anticipatory attitude is formed. The vector group is formed of the plural displacement vectors that give a variety of variations in static attitude when unit shots of laser light are performed on the HGA. Displacement vectors are synthesized while the displacement vectors each giving the anticipatory attitude closest to a target attitude are being selected in order from the initial attitude, toward the target attitude. Unit shots equivalent to the number of displacement vectors are performed on irradiating positions related to the displacement vectors included in the vector group. The static attitude existing after the unit shots is measured, then the displacement vectors are corrected, and a vector group constituting the new shortest path is formed.

Abstract: Embodiments of the invention relate to making reconnection when a soldered connection fails in a head/slider used in a magnetic disk drive. In one embodiment, a solder mass deposited on a slider pad of a head/slider is separated from a lead pad and a solder ball connection is yet to be made between the slider pad and the lead pad. A shaping tip is heated to a temperature near a melting point of a solder. The shaping tip is moved in parallel with a surface of the slider pad toward the side of the lead pad to soften the solder mass. The solder mass is thereafter irradiated with a laser beam so as to form a solder fillet, thereby making a soldered connection between the lead pad and the slider pad.

Abstract: There are provided an inorganic compound-containing thermoplastic resin composition that practically retains various properties of a general-purpose resin such as mechanical properties and moldability and has excellent thermal conductivity, and a highly thermally conductive molded article molded using the resin composition. In a polymer alloy comprising a thermoplastic resin excluding a thermoplastic polyester resin, a thermoplastic polyester resin and a highly thermally conductive inorganic compound, the thermoplastic polyester resin forms a continuous phase and the highly thermally conductive inorganic compound is preferentially present in a phase other than the thermoplastic resin excluding a thermoplastic polyester resin. Therefore, the composition and the highly thermally conductive molded article molded using the resin composition can have a thermal conductivity improved only by adding a relatively small amount of the highly thermally conductive inorganic compound.