Patents by Inventor Tatsushi Yoshida

Tatsushi Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6355122
    Abstract: A set of bonding pads are ultrasonically connected to a set of leads. The bonding pads are formed on a predetermined plane of a slider held by a slider holder accessible to the recording plane of a disk in a disk drive. The leads are held by the slider holder and have joints that are formed so as to respectively face each of the bonding pads. A front end plane of a wedge working on the joints is tilted in a direction in which the first sides of the joints correspond to external connection sides. The ultrasonic connection is completed by pressing the joints of the leads against the faced boding pads.
    Type: Grant
    Filed: June 22, 2000
    Date of Patent: March 12, 2002
    Assignee: International Business Machines Corporation
    Inventors: Kenji Itoh, Naoki Kurosu, Yohtaroh Ichimura, Tatsushi Yoshida
  • Patent number: 6336581
    Abstract: A capillary tube for a solder ball connection device connects a first connection surface of a pad to a second connection surface of a pad with a solder ball. The first connection surface is formed at a slider held by a slider holder in a disk unit. The second connection surface is formed at an end of a lead wired to the slider holder. The capillary tube has a ball regulator with a substantially conic, hollow portion. The solder ball regulator has an opening at its top that opens to the tip of the hollow portion. The center axes of the hollow portion and the opening are common. The solder ball regulator also has a pair of projections along the center axis around the opening, where the projections face each other with the center axis therebetween. The projections regulate the movement of the solder ball. The tip of the hollow portion is tapered when viewed from a line connecting the pair of projections and the extreme tips of the tapered tip portions.
    Type: Grant
    Filed: June 19, 2000
    Date of Patent: January 8, 2002
    Assignee: International Business Machines Corporation
    Inventors: Tatsumi Tuchiya, Tatsushi Yoshida, Yasuhiro Mita, Tadaaki Tomiyama, Takao Kidachi, Surya Pattanaik
  • Publication number: 20010054225
    Abstract: A head gimbal assembly, which is a component of a hard disk drive, has a bending portion that has elasticity and is bent at a predetermined angle under an unloaded condition, and a slider is bonded to a holding portion thereof by mounting the head gimbal assembly on a bonding jig in a state in which the bending portion is stretched. When the head gimbal assembly is separated from the bonding jig after bonding, the bending portion is not restored freely, so that the head gimbal assembly is caught by the bonding jig during the separating process and a locked state is sometimes established.
    Type: Application
    Filed: June 12, 2001
    Publication date: December 27, 2001
    Applicant: International Business Machines Corporation
    Inventors: Yasuhiro Mita, Kohichiroh Naka, Takuya Satoh, Tatsumi Tsuchiya, Tatsushi Yoshida
  • Patent number: 6321974
    Abstract: A plurality of bonding pads formed on a slider are integrally joined to an elastic flexure for a disk drive suspension. The pads are ultrasonically bonded to the slider with leads that are held by the flexure. The bonding portions of the leads face and are pressed against the pads with ultrasonic waves. The leads are plastically deformed during these steps to prevent the flexure from being deformed after the ultrasonic bonding process.
    Type: Grant
    Filed: April 20, 2000
    Date of Patent: November 27, 2001
    Assignee: International Business Machines Corporation
    Inventors: Tatsumi Tsuchiya, Tatsushi Yoshida, Takuya Satoh, Akiko Hayashi
  • Patent number: 6052259
    Abstract: A head support arm of a disk drive device comprises; a front portion supporting a head/slider assembly, a rear portion pivotally mounted on a frame of the disk drive device, a bending portion between the front portion and the rear portion, a plurality of electrically conductive wires covered by a tube, and a first fixing position and a second fixing position symmetrically located on both sides of a center line of the head support arm at positions between the bending portion and the front portion, characterized in that the tube is attached to the head support arm between the bending portion and the rear portion, the plurality of electrically conductive wires extending from a front end of the tube on the side of the front portion of the head support arm extend over the bending portion and are divided into a first group and a second group, the first group of wires is fixed to the second fixing position.
    Type: Grant
    Filed: June 17, 1998
    Date of Patent: April 18, 2000
    Assignee: International Business Machines Corporation
    Inventors: Yasuhiro Mita, Tatsushi Yoshida, Hiromi Ishikawa, Tatsuya Tanaka, Hiroyasu Tsuchida, Takuya Satoh
  • Patent number: 5754370
    Abstract: The present invention provides a new tab structure for a head suspension assembly in a magnetic storage system. In the prior art method of assembly, a harness temporarily holds a wire assembly. The present invention eliminates the need for the harness, thereby reducing the number of parts and steps as well as improving productivity and quality. A flexure of a suspension assembly must be manufactured very precisely. The present invention provides a new tab structure either integral with or separate from the flexure. Wires bridge over to an extension on the tab structure at a predetermined distance from the end of the load beam. Positioning holes, using the extreme flatness of the tab structure, align the wires with the bonding pads of a head. The suspension assembly is subsequently bonded to the head, and the unwanted tab structure is removed to complete the head suspension assembly.
    Type: Grant
    Filed: July 11, 1997
    Date of Patent: May 19, 1998
    Assignee: International Business Machines Corporation
    Inventors: Tatsumi Tsuchiya, Seiji Nakagawa, Tatsushi Yoshida, Yasuhiro Mita
  • Patent number: 5258483
    Abstract: A polyarylate comprising units derived from an aromatic carboxylic acid compound and units derived from a bisphenol compound and containing an epoxy group. According to the process of the present invention, the polyarylate having epoxy group can be economically prepared. Since the polyarylate of the present invention has epoxy group, it has the reactivity with amino group, hydroxyl group, acid anhydride group, or the like. Therefore, the polyarylate is mixed with another polymer to give a polymer alloy or is utilized as the precursor of a graft-copolymer, utilizing the reactivity.
    Type: Grant
    Filed: April 22, 1991
    Date of Patent: November 2, 1993
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Tatsushi Yoshida, Shigemi Matsumoto, Masahiro Asada