Abstract: A testing apparatus which assures that a constant acceleration test and an AC continuous operation test can be simultaneously conducted on semiconductor devices to be tested. The testing apparatus includes a rotatable turntable with semiconductor devices to be tested mounted thereon, rotary terminals electrically connected to connection pins of the semiconductor devices mounted on the turntable and adapted to rotate together with the turntable, and stationary terminals adapted to intermittently or continuously slidably contact the rotary terminals while the turntable is rotated.

Abstract: A burn-in apparatus used in burn-in tests includes a burn-in test chamber for accommodating a plurality of semiconductor devices to be tested. Also, the burn-in apparatus includes measuring means for detecting electric characteristics of temperature sensors built in the respective semiconductor devices to individually measure junction temperatures of the semiconductor chips incorporated in the respective semiconductor devices, and laser beam irradiating means or electric heating members. The laser irradiating means or the heating members are controlled by control means, based on outputs of the measuring means. Thus, the junction temperatures are maintained in a set junction temperature range, and the screening accuracy can be improved.

Abstract: A testing apparatus which assures that a constant acceleration test and an AC continuous operation test can be simultaneously conducted on semiconductor devices to be tested. The testing apparatus includes a rotatable turntable with semiconductor devices to be tested mounted thereon, rotary terminals electrically connected to connection pins of the semiconductor devices mounted on the turntable and adapted to rotate together with the turntable, and stationary terminals adapted to intermittently or continuously slidably contact the rotary terminals while the turntable is rotated.

Abstract: A burn-in apparatus for use in burn-in tests includes a burn-in test chamber for accommodating a plurality of semiconductor devices to be tested. The burn-in apparatus further includes measuring means for detecting electric characteristics of temperature sensors built in semiconductor devices to measure junction temperatures of the semiconductor chips built in the semiconductor devices. Based on outputs of the measuring means, control means controls electric power feed amounts to the integrated circuits of the semiconductor chips and/or environmental temperatures in the burn-in test chambers. Thus, the junction temperatures are maintained in a set temperature range, and accuracy of screening tests can be improved.

Abstract: A burn-in apparatus for use in burn-in tests includes a burn-in test container for accommodating a plurality of semiconductor device. Also, the burn-in apparatus includes a measuring device for individually measuring junction temperatures of semiconductor chips of the respective semiconductor device by detecting electric characteristics of temperature sensors built in the semiconductor chips, and a temperature adjusting device for controlling amounts of heat radiation and conduction of the semiconductor chips. The temperature adjusting device, such as device for controlling air flow rates of air nozzles of the container, is controlled by control device on the basis of outputs of the measuring device. Thus, the junction temperatures can be kept within a predetermined temperature range to thereby improve the accuracy of screening tests.

Abstract: A burn-in apparatus used in burn-in tests includes a burn-in test chamber for accommodating a plurality of semiconductor devices to be tested. Also, the burn-in apparatus includes measuring devices for detecting electric characteristics of temperature sensors built in the respective semiconductor devices to individually measure junction temperatures of the semiconductor chips incorporated in the respective semiconductor devices, and laser beam irradiating mechanisms or electric heating members. The laser irradiating mechanisms or the heating members are controlled by control units, based on outputs of the measuring devices. Thus, the junction temperatures are maintained in a set junction temperature range, and the screening accuracy can be improved.

Abstract: A semiconductor device storage jig has a vessel which is made of material having a first melting point. The vessel has a recess filled with a conductive material, which is made of a metal having a second melting point lower than the first melting point. The conductive material is in a liquid state, and a member is electrically connected to the conductive material for grounding the conductive material.