Patents by Inventor Tatsuya Hitomi

Tatsuya Hitomi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090099318
    Abstract: To provide a polyamide resin excellent in lasting thermal stability and having a high biomass ratio. A polyamide resin comprising adipic acid units, pentamethylenediamine units and 6-aminocaproic acid units as constituents, wherein the weight ratio of the sum of the adipic acid units and the pentamethylenediamine units to the 6-aminocaproic acid units is 97:3 to 75:25. The pentamethylenediamine is preferably one produced from lysine using lysine decarboxylase, lysine decarboxylase-producing cells or a treated product of the cells.
    Type: Application
    Filed: May 10, 2007
    Publication date: April 16, 2009
    Applicant: MITSUBISHI CHEMICAL CORPORATION,
    Inventors: Masaaki Miyamoto, Tatsuya Hitomi
  • Publication number: 20070249783
    Abstract: A polyamide resin comprising a dicarboxylic acid constitutional unit comprising an adipic acid unit and a diamine constitutional unit comprising a pentamethylenediamine unit and a hexamethylenediamine unit wherein a weight ratio of the pentamethylenediamine unit to the hexamethylenediamine unit being in the range of 95:5 to 60:40; a vibration-welded molded product having an excellent vibration welding strength, a hinged molded product and a binding band having an excellent low-temperature toughness, and a filament having an excellent transparency which are obtained from the polyamide resin; and a hinged molded product comprising a polyamide resin constituted of an adipic acid unit and a pentamethylenediamine unit.
    Type: Application
    Filed: May 19, 2005
    Publication date: October 25, 2007
    Inventors: Masaaki Miyamoto, Tatsuya Hitomi, Yuuichi Nishida
  • Patent number: 6265081
    Abstract: The present invention relates to an integrally molded article of polyamide resin comprising at least one primary molded pieces made of a primary molding material and at least one secondary molded pieces made of a secondary molding material, and having a welded part, said secondary molding material being injection molded on the surface of said primary molded piece, thereby welding the secondary molded piece comprising the secondary molding material to said primary molded piece, and said primary and secondary molding materials each comprising 100 parts by weight of a polyamide resin and 0.05 to 10 parts by weight of nigrosine or a nigrosine derivative.
    Type: Grant
    Filed: June 4, 1999
    Date of Patent: July 24, 2001
    Assignee: Mitsubishi Engineering Plastics Corporation
    Inventors: Hiroshi Urabe, Hajime Oyama, Tatsuya Hitomi
  • Patent number: 5853831
    Abstract: The present invention relates to a vibration-molded hollow product comprising a polyamide resin composition which comprises(a) 40 to 89.97% by weight of a polyamide resin,(b) 10 to 59.97% by weight of a glass fiber, and(c) 0.03 to 10% by weight of a compound represented by the following formula (1) or formula (2).
    Type: Grant
    Filed: July 21, 1997
    Date of Patent: December 29, 1998
    Assignee: Mitsubishi Engineering-Plastics Corporation
    Inventors: Hiroshi Urabe, Hajime Oyama, Tatsuya Hitomi