Abstract: A light-emitting apparatus having an LED-mounting surface having an improved light reflective efficiency is provided. The light-emitting apparatus includes a board, a first reflective layer arranged on the board, a second reflective layer different from the first reflective layer, arranged at a position different from the position of the first reflective layer on the board, a first configuration configured by a first LED element mounted on the first reflective layer and a first phosphor-containing resin which protects the first LED element and transforms a wavelength of light emitted from the first LED element, and a second configuration configured by a second LED element mounted on the second reflective layer and a second phosphor-containing resin which protects the second LED element and transforms a wavelength of light emitted from the second LED element.

Abstract: A light-emitting apparatus is provided which can improve the reflectance of light in the emission wavelength region of the LED. The light-emitting apparatus includes a mount board constituted by a metal support, a circuit board provided with an opening and fixed onto the mount board, a multi-layered film containing silver as a light-reflecting material, the multi-layered film being stacked on the mount board exposed in the opening, exclusive of a portion of the mount board onto which the circuit board is fixed, and an LED element mounted on the multi-layered film.

Abstract: A ferrite magnet and a ferrite sintered magnet including a ferrite magnetic material are provided. A main phase of the ferrite magnetic material includes a ferrite phase having a hexagonal crystal structure, and metal element composition expressed by Ca1-w-x-yR wSr xBayFezMm wherein 0.25<w<0.5, 0.01<x<0.35, 0.0001<y<0.013, y<x, 8.7<z<9.9, 1.0<w/m<2.1, 0.017<m/z<0.055 and Si component is at least included as a sub-component, and wherein; when content y1 mass % of the Si component in the ferrite magnetic material, with respect to SiO2, is shown on Y-axis and a total content x1 of z and m is shown on X-axis, a relation between x1 and y1 is within a range surrounded by 4 points placed on X-Y coordinate having the X and Y axes.

Abstract: To provide an LED lighting apparatus and a method for manufacturing the same that can improve the bonding strength between an aluminum substrate and a printed wiring substrate. An LED lighting apparatus and a method for manufacturing the same, the LED lighting apparatus includes an aluminum substrate, a plurality of reflectivity-enhanced layers formed on the aluminum substrate, an LED device bonded on said plurality of reflectivity-enhanced layers, a printed wiring substrate bonded onto a region on the aluminum substrate other than a region where the plurality of reflectivity-enhanced layers are formed, a wire for connecting between the printed wiring substrate and the LED device, a frame member formed so as to surround said LED device, and a phosphor resin deposited over a region inside the frame member.

Abstract: A ferrite magnet and a ferrite sintered magnet including a ferrite magnetic material are provided. A main phase of the ferrite magnetic material includes a ferrite phase having a hexagonal crystal structure, and metal element composition expressed by Ca1-w-x-yR wSr xBayFezMm wherein 0.25<w<0.5, 0.01<x<0.35, 0.0001<y<0.013, y<x, 8.7<z<9.9, 1.0<w/m<2.1, 0.017<m/z<0.055 and Si component is at least included as a sub-component, and wherein; when content y1 mass % of the Si component in the ferrite magnetic material, with respect to SiO2, is shown on Y-axis and a total content x1 of z and m is shown on X-axis, a relation between x1 and y1 is within a range surrounded by 4 points placed on X-Y coordinate having the X and Y axes.

Abstract: A ferrite magnet and a ferrite sintered magnet including a ferrite magnetic material are provided. A main phase of the ferrite magnetic material includes a ferrite phase having a hexagonal crystal structure, and metal element composition expressed by Ca1-w-x-yR wSr xBayFezMm wherein 0.25<w<0.5, 0.01<x<0.35, 0.0001<y<0.013, y<x, 8.7<z<9.9, 1.0<w/m<2.1, 0.017<m/z<0.055 and Si component is at least included as a sub-component, and wherein; when content y1 mass % of the Si component in the ferrite magnetic material, with respect to SiO2, is shown on Y-axis and a total content x1 of z and m is shown on X-axis, a relation between x1 and y1 is within a range surrounded by 4 points placed on X-Y coordinate having the X and Y axes.

Abstract: A COF includes, in at least one embodiment, a heat dissipating material on a back surface of an insulating film. The heat dissipating material has a slit for reducing a degree of thermal expansion. Thus, at least one embodiment of the invention provides the COF in which deformation and disconnection of wiring are prevented.

Abstract: A source driver of a film package type including a film substrate; a semiconductor chip on a surface of the film substrate, the semiconductor chip having a plurality of terminals, the plurality of terminals including input terminals, output terminals, and third terminals; an input terminal wiring region for receiving first wiring lines which are connected to the input terminals; an output terminal wiring region for receiving second wiring lines which are connected to the output terminals; sprocket portions at opposite ends of the film substrate; and a heat conducting patterns for connecting the third terminals. This makes it possible to provide a source driver, a method for manufacturing the source driver, and a liquid crystal module, each of which can increase a heat dissipation amount.

Abstract: In a COF of an embodiment of the present invention, the smaller distance to edges of a heat-releasing member an area of the heat-releasing member has, the larger openings the area has. Accordingly, a volume per area (an area per length) of the heat-releasing member decreases toward the edges. The arrangement improves flexibility of the COF. This prevents a stress caused by bending the COF from concentrating at the edges. This makes it possible to prevent a line on an insulating film from being broken. Also, it becomes possible to prevent an anisotropic conductive resin from coming off which is used to bond the COF with a display panel in providing the COF in a display apparatus.

Abstract: A ferrite magnet and a ferrite sintered magnet including a ferrite magnetic material are provided. A main phase of the ferrite magnetic material includes a ferrite phase having a hexagonal crystal structure, and metal element composition expressed by Ca1-w-x-yR wSr xBayFezMm wherein 0.25<w<0.5, 0.01<x<0.35, 0.0001<y<0.013 , y<x, 8.7<z<9.9, 1.0<w/m<2.1, 0.017<m/z<0.055 and Si component is at least included as a sub-component, and wherein; when content y1 mass % of the Si component in the ferrite magnetic material, with respect to SiO2, is shown on Y-axis and a total content x1 of z and m is shown on X-axis, a relation between x1 and y1 is within a range surrounded by 4 points placed on X-Y coordinate having the X and Y axes.

Abstract: In one embodiment of the present invention, an IC chip mounting package is arranged such that an IC chip and a film base member are connected via an interposer, and a section in which the IC chip, the film base member, and the interposer are connected is sealed with sealing resin. The sealing resin is provided by potting sealing resin around the interposer via a potting nozzle, or is provided by potting the sealing resin around the IC chip, that is, via a device hole. Moreover, the sealing resin has a coefficient of linear expansion of not more than 80 ppm/° C., a viscosity of not less than 0.05 Pa·s but not more than 0.25 Pa·s, and also includes filler having a particle size of not more than 1 ?m.

Abstract: In one embodiment of the present invention, an IC chip mounting package includes a film base member and an IC chip connected via an interposer. Connecting terminals on the film base member side of the interposer are provided so as to have a pitch larger than that of connecting terminals of the IC. A device hole is opened to the film base member, and the IC chip is provided in the device hole. A distance between an inner lead leading end and a periphery of the device hole is set as not less than 10 ?m.

Abstract: A liquid crystal driver mounting package in accordance with an embodiment of the present invention contains a film base material and a liquid crystal driver connected to each other via an interposer. The liquid crystal driver includes first alignment marks on its face opposite the interposer. The interposer includes second alignment marks on its face opposite the liquid crystal driver. The first alignment marks and the second alignment marks are separated by about a distance which is in a tolerable range as a combining position where the liquid crystal driver and the interposer are attached when viewed from the normal of the face of the interposer opposite the liquid crystal driver. Thus, an IC chip (liquid crystal driver) package is provided which enables efficient positing of the IC chip and the interposer.

Abstract: In a COF of an embodiment of the present invention, the smaller distance to edges of a heat-releasing member an area of the heat-releasing member has, the larger openings the area has. Accordingly, a volume per area (an area per length) of the heat-releasing member decreases toward the edges. The arrangement improves flexibility of the COF. This prevents a stress caused by bending the COF from concentrating at the edges. This makes it possible to prevent a line on an insulating film from being broken. Also, it becomes possible to prevent an anisotropic conductive resin from coming off which is used to bond the COF with a display panel in providing the COF in a display apparatus.

Abstract: A method of timing control for servo-data detection in a disk drive. The method includes retrieving a plurality of servo sectors arranged discretely in a circumferential direction of a disk and measuring time intervals between servo sectors. The method also includes determining in which zone of a plurality of preset zones each of the measured time intervals is included. Moreover, the method also includes determining variations in time intervals from the zones of a plurality of previous time intervals, and modifying timing for servo-sector detection if variations in time intervals are within a preset range.

Abstract: In at least one embodiment, a source driver of a film package type, includes: a film substrate; a semiconductor chip on a surface of the film substrate, the semiconductor chip having a plurality of terminals each of which is connectable to an external member, the plurality of terminals including input terminals, output terminals, and third terminals; an input terminal wiring region for receiving first wiring lines which are connected to the input terminals, respectively, the input terminal region being provided on the surface of the film substrate; an output terminal wiring region for receiving second wiring lines which are connected to the output terminals, respectively, the output terminal wiring region being provided on the surface of the film substrate; and sprocket portions at opposite ends of the film substrate, each of the sprocket portions having a copper foil on the surface, and a string of holes, the input terminal wiring region and the output terminal wiring region being provided so as to extend to

Abstract: A COF includes, in at least one embodiment, a heat dissipating material on a back surface of an insulating film. The heat dissipating material has a slit for reducing a degree of thermal expansion. Thus, at least one embodiment of the invention provides the COF in which deformation and disconnection of wiring are prevented.