Abstract: In order to attain, in a semiconductor device in which a semiconductor element is mounted, formation of a mark of a relatively large size which is easily recognizable by the naked eye or a machine, and which can apply a code system containing enough amount of information for tracing a manufacturing history, a semiconductor device according to the present invention includes an interposer electrically connected to a semiconductor element, which semiconductor device has a mark for displaying at least predetermined information relevant to the semiconductor element.

Abstract: A liquid crystal driver mounting package in accordance with an embodiment of the present invention contains a film base material and a liquid crystal driver connected to each other via an interposer. The liquid crystal driver includes first alignment marks on its face opposite the interposer. The interposer includes second alignment marks on its face opposite the liquid crystal driver. The first alignment marks and the second alignment marks are separated by about a distance which is in a tolerable range as a combining position where the liquid crystal driver and the interposer are attached when viewed from the normal of the face of the interposer opposite the liquid crystal driver. Thus, an IC chip (liquid crystal driver) package is provided which enables efficient positing of the IC chip and the interposer.

Abstract: In one embodiment of the present invention, an IC chip mounting package includes a film base member and an IC chip connected via an interposer. Connecting terminals on the film base member side of the interposer are provided so as to have a pitch larger than that of connecting terminals of the IC. A device hole is opened to the film base member, and the IC chip is provided in the device hole. A distance between an inner lead leading end and a periphery of the device hole is set as not less than 10 ?m.

Abstract: A semiconductor device allowing for chip size reduction and thereby cost reduction without being restricted by a layout of bumps comprises a film substrate, an interposer substrate (3) made of silicon and mounted on the film substrate and a semiconductor element (2) mounted on the interposer substrate (3) in order to drive liquid crystals. The interposer substrate (3) includes a plurality of substrate projecting electrodes (5a, 5b, 5c) formed on its surface facing the semiconductor element (2), while the semiconductor element (2) includes a plurality of element projecting electrodes (4a, 4b, 4c) configured to be joined to the plurality of substrate projecting electrodes (5a, 5b, 5c), the plurality of element projecting electrodes (4a, 4b, 4c) being disposed throughout a surface of the semiconductor element (2).

Abstract: In one embodiment of the present invention, an IC chip mounting package is arranged such that an IC chip and a film base member are connected via an interposer, and a section in which the IC chip, the film base member, and the interposer are connected is sealed with sealing resin. The sealing resin is provided by potting sealing resin around the interposer via a potting nozzle, or is provided by potting the sealing resin around the IC chip, that is, via a device hole. Moreover, the sealing resin has a coefficient of linear expansion of not more than 80 ppm/° C., a viscosity of not less than 0.05 Pa·s but not more than 0.25 Pa·s, and also includes filler having a particle size of not more than 1 ?m.

Abstract: In a liquid crystal driver package (1a) of one embodiment of the present invention, a film base member (2) is connected to a liquid crystal driver (3) through an interposer substrate (4a). Film base member connecting terminals (13) of the interposer substrate (4a) are connected to terminals of on-film wires (5 and 6) of the film base member (2) with an anisotropic conductive adhesive. An insulating film (7) is formed at an edge section of the interposer substrate (4a) and a periphery section of the edge section. This arrangement prevents the on-film wires (5 and 6) from coming into direct contact with the interposer substrate (4a). Therefore, it becomes possible to provide an IC chip (liquid crystal driver) package in which short circuit does not occur between the on-film wires adjacent to each other.

Abstract: The semiconductor device of the invention has a heat spreader 9 mounted on a semiconductor element 5. The area of one surface of the heat spreader 9 closer to the semiconductor element 5 is generally equal to the area of one surface of the semiconductor element 5 closer to the heat spreader 9. With this structure, manufacturing cost of the semiconductor device can be reduced and moreover its reliability can be enhanced.

Abstract: A spring retainer for a clutch piston has a cylindrical through portion engaged with the shank of a clutch drum and abutting a snap ring at one end. A dish bearing portion is connected to a second end of the through portion and extends in a frusto-conical manner in an axial direction of the shank. In use, the dish bearing portion abuts a dish spring, and a clearance is maintained between the dish bearing portion and the snap ring.

Abstract: A layered electrophotographic photoconductor whose charge generation layer comprises a bisazo pigment selected from the group consisting of the bisazo pigments represented by the following general formula (I) and whose charge transport layer contains a charge transport material selected from the group consisting of the hydrazone compounds represented by the following general formula (2): ##STR1## wherein A represents --C.sub.6 H.sub.4 --Cl(o), --C.sub.6 H.sub.4 --Cl(m), --C.sub.6 H.sub.4 --Br(o), --C.sub.6 H.sub.4 --Br(m), --C.sub.6 H.sub.4 --F(o), --C.sub.6 H.sub.4 --F(m), --C.sub.6 H.sub.4 --F(p), or --C.sub.6 H.sub.4 --I(m), ##STR2## wherein R.sup.

Abstract: A layered electrophotographic photoconductor whose charge generation layer comprises a bisazo pigment selected from the group consisting of the bisazo pigments represented by formula (1) and whose charge transport layer contains a charge transport material selected from the group consisting of anthrancene compounds represented by formula (2) or from the group consisting of distyrylbenzene compounds represented by formula (3) ##STR1##