Abstract: A semiconductor device comprising: bonding pads formed in the first wiring layer; and first wirings and a second wiring formed in a second wiring layer provided one layer below the first wiring layer. Here, a power supply potential and a reference potential are to be supplied to each first wiring and the second wiring, respectively. Also, in transparent plan view, each of the first wirings is arranged next to each other, and is arranged at a first position of the second wiring layer, that is overlapped with the bonding region of the first bonding pad. Also, in transparent plan view, the second wiring is arranged at a second position of the second wiring layer, that is overlapped with a first region located between the first bonding pad and the second bonding pad. Further, a width of each first wiring is less than a width of the second wiring.

Abstract: An optical scanning device includes a housing, a transmissive member, a wire-shaped member, a driving portion, a cleaning holder, a cleaning member, a stopper, and a control portion. The control portion is capable of executing a cleaning mode including at least one of a forward travel operation of controlling the wire-shaped member to travel in a first direction so that the cleaning holder moves along the transmissive member and a backward travel operation of, after executing the forward travel operation, controlling the wire-shaped member to travel in a second direction so that the cleaning holder moves in an opposite direction to a direction of the forward travel operation. The control portion executes a load releasing operation of controlling the cleaning holder to move by a prescribed amount in an opposite direction to the direction of the forward travel operation or the direction of the backward travel operation.

Abstract: A pneumatic tyre includes a tread portion being provided with a land portion divided by a main groove extending continuously in a tyre circumferential direction. The land portion is provided with two or more sipes having a width less than 1.5 mm on a ground contacting surface of the land portion and two or more groove elements having a width equal to or more than 1.5 mm on the ground contacting surface. Lengths in a tyre axial direction of the groove elements are equal to or less than 15% of a maximum width in the tyre axial direction of the ground contacting surface of the land portion, and at least one of the sipes is in communication with one of the groove elements.

Abstract: An electric toothbrush includes a gyro sensor inside a main body. The gyro sensor detects an angular velocity of the main body and the main body includes a head portion, a neck portion, and a grip portion in a longitudinal axis direction. An angle formed by a longitudinal axis of the main body in a state that brush bristles of the head portion contact with a brushing site in a dentition with respect to the longitudinal axis of the main body in a state that the brush bristles of the head portion contact with a reference position in the dentition is obtained, based on an output from the gyro sensor. A corresponding point corresponding to the brushing site on an approximate curve that curves corresponding to the dentition is obtained based on the angle, and coordinates of the corresponding point are used as a translational position of the brushing site.

Abstract: A semiconductor device includes a substrate, a device layer, and a film. The substrate includes a first semiconductor element, and has a first surface, a second surface, and a side surface between the first surface and the second surface. The device layer includes a second semiconductor element electrically connected to the first semiconductor element, and is provided on the first surface of the substrate. The film includes a first film including a first region, a second region, and a third region. The substrate is positioned between the first region and the device layer in a first direction. The substrate is positioned between the second region and the third region in a second direction crossing the first direction. The first film fills the unevenness of the second surface and the side surface.

Abstract: A semiconductor device includes a base including interconnects, a first semiconductor chip including a first semiconductor element portion, and a second semiconductor chip including a second semiconductor element portion. The second semiconductor chip is electrically connected to the first semiconductor chip via at least one of the interconnects. The second semiconductor chip includes a first region, a first portion, and a second portion. The first region includes the second semiconductor element portion. The first portion is continuous with the first region. The second portion is continuous with the first region and is separated from the first portion in a second direction crossing a first direction. The first direction is from the base toward the first region. The second portion, the first portion, and at least a portion of the first semiconductor chip each is positioned between the base and the first region.

Abstract: To provide a method for manufacturing a rack that can reduce the manufacturing cost, the method comprises the following processes. An intermediate material 18a having a concave groove 42y in part in the radial direction of the outer circumferential surface that extends in the axial direction and is recessed inward in the radial direction is obtained. A plurality of rack teeth 10z are formed on an opposite surface to the concave groove 42y with respect to the radial direction of the outer circumferential surface of the intermediate material 18a by pressing the teeth-forming concave and convex section 28 that have a concave and convex configuration with respect to the axial direction in a state where the portions on both sides of the concave groove 42y of the outer circumferential surface of the intermediate material with respect to the circumferential direction are constrained and the inner surface of the concave groove 42y is not constrained.

Abstract: An information processing apparatus includes a weight setting unit configured to set a plurality of weights of a selection layer selected from a plurality of layers of a first neural network as a plurality of weights of a second neural network; a classification unit configured to classify each of the weights of the selection layer into a first group or a second group; a first determination unit configured to determine a first gradient for each weight of the first neural network, based on first training data; a second determination unit configured to determine a second gradient for weights belonging to the first group based on second training data; and an updating unit configured to update the weights belonging to the first group based on the first gradient and the second gradient, and updating the other weights based on the first gradient.

Abstract: An information processing apparatus includes an acquisition unit configured to acquire first training data that includes data and a label for target task learning, and second training data that includes data and a label for watermark detection, and a learning unit configured to generate a model parameter constituting a machine learning model for detecting a target task or a watermark based on the first training data and the second training data.

Abstract: A tyre comprises a tread portion comprising a shoulder main groove and a shoulder land region. The shoulder land region includes an outer region, a middle region, and an inner region. The shoulder land region is provided with a plurality of shoulder sipes having components in a tyre axial direction. A sipe ratio of the middle region is smaller than the sipe ratio of the outer region and the sipe ratio of the inner region.

Abstract: A dummy-light generating device includes a continuous wave (CW) light source that outputs CW light, a modulated-light generating unit that generates, using the CW light, first intensity-modulated light subjected to intensity modulation and second intensity-modulated light delayed by a half time of a modulation cycle of the first intensity-modulated light with respect to the first intensity-modulated light and having a polarization state e different from a polarization state e of the first intensity-modulated light, and a polarization combiner that performs polarization combination of the first intensity-modulated light and second intensity-modulated light and outputs light after the polarization combination as dummy light.

Abstract: A dummy-light generating device includes a continuous wave (CW) light source that outputs CW light, a modulated-light generating unit that generates, using the CW light, first intensity-modulated light subjected to intensity modulation and second intensity-modulated light delayed by a half time of a modulation cycle of the first intensity-modulated light with respect to the first intensity-modulated light and having a polarization state e different from a polarization state e of the first intensity-modulated light, and a polarization combiner that performs polarization combination of the first intensity-modulated light and second intensity-modulated light and outputs light after the polarization combination as dummy light.

Abstract: An object of the present invention is to improve the degree of freedom in the wiring design of a wiring substrate configuring a semiconductor device. Lands having an NSMD structure and a land-on-through-hole structure are arranged at positions not overlapping with a plurality of leads arranged on a chip loading surface of a wiring substrate in transparent plan view on the outer peripheral side of a mounting surface of the wiring substrate configuring a semiconductor device having a BGA package structure. On the other hand, land parts having the NSMD structure and to which lead-out wiring parts are connected are arranged at positions overlapping with the leads arranged on the chip loading surface of the wiring substrate in transparent plan view on the inner side than the group of lands in the mounting surface of the wiring substrate.

Abstract: A semiconductor device includes a base including interconnects, a first semiconductor chip including a first semiconductor element portion, and a second semiconductor chip including a second semiconductor element portion. The second semiconductor chip is electrically connected to the first semiconductor chip via at least one of the interconnects. The second semiconductor chip includes a first region, a first portion, and a second portion. The first region includes the second semiconductor element portion. The first portion is continuous with the first region. The second portion is continuous with the first region and is separated from the first portion in a second direction crossing a first direction. The first direction is from the base toward the first region. The second portion, the first portion, and at least a portion of the first semiconductor chip each is positioned between the base and the first region.