Abstract: In a system and method for scheduling the movement of wafers in a wafer-processing tool, the wafer-processing tool can include a load module, a wafer-transfer unit, a process module, and a scheduler. The scheduler can be configured to generate a schedule for the movement of wafers in the wafer-processing tool based on the duration of the operations to be performed by the wafer-transfer unit and the process module in processing the wafers.

Abstract: To a common transfer chamber 102 of a treatment system 100, a treatment chamber 104a of an etching system 104, treatment chambers 106a and 108a of first and second CVD systems 106 and 108, a cooling chamber (a post-treatment chamber) 110a of a cooling system 110, and first and second cassette chambers 112 and 114 are connected. In the common transfer chamber 102, a transport arm 118 and a positioning system 120 are arranged. When the treatment system 100 is restarted after being stopped during a treatment, wafers W are sequentially recovered into a cassette 116 on the basis of the control of an operation storage device, which stores therein the origin data and destination data of the wafers W. At this time, the wafers W heated to a very high temperature by a thin film deposition treatment are sequentially recovered into a cassette 116 after being cooled (post-treated), and other wafers W are sequentially recovered directly into the cassette 116.