Patents by Inventor Tatsuyuki Takeshita

Tatsuyuki Takeshita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing semiconductor device and semiconductor device
    Patent number: 7781262
    Abstract: The method of producing a semiconductor device in which chips are resin-molded, including steps of: preparing frames having front and back surfaces and die pads; preparing an insulation resin sheet having a first and a second surfaces; preparing a resin-sealing metal mold having cap pins; mounting the resin sheet inside the resin-sealing metal mold in such a manner that the second surface of the resin sheet contacts an inner bottom surface of the resin-sealing metal mold; mounting power chips on the surfaces of the die pads; positioning the frames on the first surface of the resin sheet in such a manner that the back surfaces of the die pads contact the first surface of the resin sheet; pressing the die pads toward the resin sheet using the cap pins and fixing the die pads; injecting a sealing resin in the resin-sealing metal mold and hardening the sealing resin; and removing the semiconductor device in which the power chips are molded with the sealing resin out from the resin-sealing metal mold.
    Type: Grant
    Filed: October 27, 2006
    Date of Patent: August 24, 2010
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kenichi Hayashi, Hisashi Kawafuji, Tatsuyuki Takeshita, Nobuhito Funakoshi, Hiroyuki Ozaki
  • Semiconductor device and method for producing the same
    Patent number: 7671453
    Abstract: A semiconductor device in which chips are resin-molded, including: frames having front and back surfaces and die pads; power chips mounted on the surfaces of the die pads; an insulation resin sheet having a first and a second surfaces which are opposed against each other, the resin sheet being disposed such that the back surfaces of the die pads contact the first surface of the resin sheet; and a mold resin applied on the first surface of the resin sheet so as to seal up the power chips. The thermal conductivity of the resin sheet is larger than that of the mold resin.
    Type: Grant
    Filed: September 22, 2004
    Date of Patent: March 2, 2010
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kenichi Hayashi, Hisashi Kawafuji, Tatsuyuki Takeshita, Nobuhito Funakoshi, Hiroyuki Ozaki, Kazuhiro Tada
  • Method for producing semiconductor device and semiconductor device
    Publication number: 20070042531
    Abstract: The method of producing a semiconductor device in which chips are resin-molded, including steps of: preparing frames having front and back surfaces and die pads; preparing an insulation resin sheet having a first and a second surfaces; preparing a resin-sealing metal mold having cap pins; mounting the resin sheet inside the resin-sealing metal mold in such a manner that the second surface of the resin sheet contacts an inner bottom surface of the resin-sealing metal mold; mounting power chips on the surfaces of the die pads; positioning the frames on the first surface of the resin sheet in such a manner that the back surfaces of the die pads contact the first surface of the resin sheet; pressing the die pads toward the resin sheet using the cap pins and fixing the die pads; injecting a sealing resin in the resin-sealing metal mold and hardening the sealing resin; and removing the semiconductor device in which the power chips are molded with the sealing resin out from the resin-sealing metal mold.
    Type: Application
    Filed: October 27, 2006
    Publication date: February 22, 2007
    Inventors: Kenichi Hayashi, Hisashi Kawafuji, Tatsuyuki Takeshita, Nobuhito Funakoshi, Hiroyuki Ozaki
  • Method for producing semiconductor device and semiconductor device
    Patent number: 7166926
    Abstract: The method of producing a semiconductor device in which chips are resin-molded, including steps of: preparing frames having front and back surfaces and die pads; preparing an insulation resin sheet having a first and a second surfaces; preparing a resin-sealing metal mold having cap pins; mounting the resin sheet inside the resin-sealing metal mold in such a manner that the second surface of the resin sheet contacts an inner bottom surface of the resin-sealing metal mold; mounting power chips on the surfaces of the die pads; positioning the frames on the first surface of the resin sheet in such a manner that the back surfaces of the die pads contact the first surface of the resin sheet; pressing the die pads toward the resin sheet using the cap pins and fixing the die pads; injecting a sealing resin in the resin-sealing metal mold and hardening the sealing resin; and removing the semiconductor device in which the power chips are molded with the sealing resin out from the resin-sealing metal mold.
    Type: Grant
    Filed: October 7, 2004
    Date of Patent: January 23, 2007
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kenichi Hayashi, Hisashi Kawafuji, Tatsuyuki Takeshita, Nobuhito Funakoshi, Hiroyuki Ozaki
  • Method for producing semiconductor device and semiconductor device
    Publication number: 20050082690
    Abstract: The method of producing a semiconductor device in which chips are resin-molded, including steps of: preparing frames having front and back surfaces and die pads; preparing an insulation resin sheet having a first and a second surfaces; preparing a resin-sealing metal mold having cap pins; mounting the resin sheet inside the resin-sealing metal mold in such a manner that the second surface of the resin sheet contacts an inner bottom surface of the resin-sealing metal mold; mounting power chips on the surfaces of the die pads; positioning the frames on the first surface of the resin sheet in such a manner that the back surfaces of the die pads contact the first surface of the resin sheet; pressing the die pads toward the resin sheet using the cap pins and fixing the die pads; injecting a sealing resin in the resin-sealing metal mold and hardening the sealing resin; and removing the semiconductor device in which the power chips are molded with the sealing resin out from the resin-sealing metal mold.
    Type: Application
    Filed: October 7, 2004
    Publication date: April 21, 2005
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kenichi Hayashi, Hisashi Kawafuji, Tatsuyuki Takeshita, Nobuhito Funakoshi, Hiroyuki Ozaki
  • Semiconductor device and method for producing the same
    Publication number: 20050067719
    Abstract: A semiconductor device in which chips are resin-molded, including: frames having front and back surfaces and die pads; power chips mounted on the surfaces of the die pads; an insulation resin sheet having a first and a second surfaces which are opposed against each other, the resin sheet being disposed such that the back surfaces of the die pads contact the first surface of the resin sheet; and a mold resin applied on the first surface of the resin sheet so as to seal up the power chips. The thermal conductivity of the resin sheet is larger than that of the mold resin.
    Type: Application
    Filed: September 22, 2004
    Publication date: March 31, 2005
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kenichi Hayashi, Hisashi Kawafuji, Tatsuyuki Takeshita, Nobuhito Funakoshi, Hiroyuki Ozaki, Kazuhiro Tada
  • Semiconductor device
    Patent number: D505400
    Type: Grant
    Filed: September 24, 2004
    Date of Patent: May 24, 2005
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hisashi Kawafuji, Tatsuyuki Takeshita