Semiconductor device

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Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a right side elevational view thereof; and,

FIG. 8 is an enlarged cross-sectional view thereof and, taken along line 8—8 of FIG. 2, with the internal system omitted.

Claims

The ornamental design for a semiconductor device, as shown and described.

Referenced Cited
U.S. Patent Documents
D394244 May 12, 1998 Majumdar et al.
D401912 December 1, 1998 Majumdar et al.
D418185 December 28, 1999 McCormick et al.
D448739 October 2, 2001 Iwasaki et al.
D448740 October 2, 2001 Iwasaki et al.
D472530 April 1, 2003 Iwasaki et al.
Foreign Patent Documents
098 288 601 June 1997 JP
106 57 0100 April 2000 JP
Patent History
Patent number: D505400
Type: Grant
Filed: Sep 24, 2004
Date of Patent: May 24, 2005
Assignee: Mitsubishi Denki Kabushiki Kaisha (Tokyo)
Inventors: Hisashi Kawafuji (Fukuoka), Tatsuyuki Takeshita (Fukuoka)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Attorney: Sughrue Mion, PLLC
Application Number: 29/213,816