Patents by Inventor Tay-Jian Liu

Tay-Jian Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED ILLUMINATING DEVICE AND LIGHT ENGINE THEREOF
    Publication number: 20100149799
    Abstract: An LED illuminating device includes an optical section at a bottom end thereof, an electrical section at a top end thereof and a heat dissipation section between the optical section and the electrical section. The optical section includes an LED emitter. The electrical section electrically connects with the LED emitter. The heat dissipation section includes an upper substrate, a lower substrate being parallel to and spaced from the upper substrate, a plurality of fins arranged between the upper and lower substrates and a heat pipe. The heat pipe includes an evaporating section connected to the lower substrate and a condensing section connected to the upper substrate. The LED emitter is attached to the lower substrate and thermally connects therewith. The heat pipe is transfers heat of the LED emitter from the lower substrate to the upper substrate.
    Type: Application
    Filed: June 8, 2009
    Publication date: June 17, 2010
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventor: TAY-JIAN LIU
  • LED ILLUMINATING DEVICE
    Publication number: 20100142199
    Abstract: An LED illuminating device includes a light-emitting module, a heat sink and an electrical module. The light-emitting module includes an elongated hollow light penetrable tube and a light source. The heat sink is received in and mounted to the light penetrable tube, and includes an elongated base and a plurality of fins. The light source is thermally attached to a bottom surface of the base. The base and an upper portion of the light penetrable tube cooperatively define a heat dissipation chamber. The fins are accommodated in the heat dissipation chamber. The light penetrable tube defines a plurality of air exchanging holes through the upper portion thereof communicating with the heat dissipation chamber. The electrical module includes at least one circuit board received in the heat dissipation chamber, and two end covers arranged at two ends of the light penetrable tube.
    Type: Application
    Filed: June 17, 2009
    Publication date: June 10, 2010
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventor: TAY-JIAN LIU
  • LED ILLUMINATING DEVICE AND LIGHT ENGINE THEREOF
    Publication number: 20100141108
    Abstract: An LED illuminating device includes an optical section, an electrical section, and a heat dissipation section. The heat dissipation section is provided with a heat sink and at least one heat pipe therein. The heat sink includes a metal tube, a plurality of metal fins extending radially and outwardly from the metal tube, and a heat-absorbing plate attached to a bottom of the metal tube. A chamber is axially recessed from a top of the metal tube to the heat-absorbing plate. The heat pipe includes an evaporating section and a condensing section. The evaporating section of the heat pipe is attached to an inner surface of the heat-absorbing plate. The condensing section of the heat pipe is attached to an inner circumferential surface of the metal tube. The light source is attached to an outer surface of the heat-absorbing plate.
    Type: Application
    Filed: June 3, 2009
    Publication date: June 10, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: TAY-JIAN LIU, FENG TIAN
  • LED ILLUMINATION DEVICE
    Publication number: 20100135015
    Abstract: An LED illumination device includes a light-emitting module, a heat sink and an electrical module. The light-emitting module includes a light source provided with a plurality of LEDs. The heat sink includes an elongated base and a plurality of fins extending from the base. The base has a top surface and an opposite bottom surface. The fins extend upwardly from the top surface of the base. The light source is thermally attached to the bottom surface of the base. The heat sink is provided with at least one receiving space at a top side thereof. The electrical module includes at least one circuit board and two end covers. The at least one circuit board is accommodated in the at least one receiving space of the heat sink. The two end covers are arranged at two opposite ends of the heat sink.
    Type: Application
    Filed: June 17, 2009
    Publication date: June 3, 2010
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventor: TAY-JIAN LIU
  • Heat pipe
    Patent number: 7726384
    Abstract: A heat pipe includes a hollow metal casing (100) and a honeycombed wick structure (200) arranged at an inner surface of the hollow metal casing. The wick structure includes a plurality of slices (210, 220) stacked together. Each of the slices has a plurality of pores therein and a plurality of protrusions (222) formed thereon along a longitudinal direction of the heat pipe to form a plurality of liquid channels (230) in the wick structure along the longitudinal direction of the heat pipe. Each liquid channel has alternate large and small sections (232, 231) along a length thereof.
    Type: Grant
    Filed: August 4, 2006
    Date of Patent: June 1, 2010
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Chuen-Shu Hou, Tay-Jian Liu, Chao-Nien Tung
  • LED illuminating device and light engine thereof
    Patent number: 7699501
    Abstract: An LED illuminating device includes an optical section (10), an electrical section (30), and a heat dissipation section (20) arranged between the optical section (10) and the electrical section (30). The heat dissipation section is provided with a heat dissipation device (200) which includes a heat sink (23), a mounting seat (24), and a heat pipe (22) connecting the mounting seat with the heat sink. The heat sink includes a solid base (231) and a plurality of fins (232) extending radially and outwardly from the base. The base is provided with a through hole (233). Alight source (11) is provided in the optical section and attached to the mounting seat. The heat pipe includes an evaporating portion (222) attached to the mounting seat, and a condensing portion (221) fittingly received in the through hole of the base.
    Type: Grant
    Filed: October 21, 2008
    Date of Patent: April 20, 2010
    Assignee: Foxconn Technology Co., Ltd.
    Inventor: Tay-Jian Liu
  • Performance testing apparatus for heat pipes
    Patent number: 7686504
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of a heat pipe requiring testing. A movable portion is capable of moving relative to the immovable portion and has a heating member therein for heating the evaporating section of the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe.
    Type: Grant
    Filed: August 23, 2006
    Date of Patent: March 30, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chuen-Shu Hou, Xiao-Long Li, Chao-Nien Tung
  • LED ILLUMINATING DEVICE
    Publication number: 20100060132
    Abstract: An LED illuminating device includes an optical part having a light source therein, an electrical part and a heat dissipation part. The electrical part includes a rear shell and a circuit board electrically connecting with the light source. The heat dissipation part includes a hollow front shell having a rear end secured with the rear shell, a heat sink and a cooling fan arranged in the front shell. The front shell defines a plurality of first and second air holes. The heat sink includes a solid base and a plurality of fins. The light source is thermally connected with the base. An airflow produced by the cooling fan is introduced into the front shell via the first air holes. The airflow flows then towards the heat sink and finally flows out of the front shell via the second air holes.
    Type: Application
    Filed: May 19, 2009
    Publication date: March 11, 2010
    Applicants: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Na Zhang
  • Performance testing apparatus for heat pipes
    Patent number: 7674037
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe to be tested. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: March 9, 2010
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun, Chuen-Shu Hou, Cheng-Hui Lin
  • Heat pipe
    Patent number: 7665508
    Abstract: A heat pipe includes a pipe containing phase changeable working media therein. A wick structure is located on an inner face of the pipe. A space is surrounded by the wick structure in the pipe. At least one muzzle with an inlet and an outlet is positioned inside the pipe; the inlet and the outlet are deferent in radius thereof.
    Type: Grant
    Filed: July 20, 2006
    Date of Patent: February 23, 2010
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chuen-Shu Hou, Chih-Hsien Sun
  • Solar air conditioning device
    Patent number: 7661422
    Abstract: A solar air conditioning device (100) comprises a solar collector assembly (30), an inlet assembly (10) at an entrance of the solar collector assembly, and an outlet assembly (50) at an exit of the solar collector assembly. The solar collector assembly includes a heat-absorbing set (31) and a transparent panel (38) being assembled to a top of the heat-absorbing set. The heat-absorbing set comprises a plurality of heat-absorbing units (32) engaged with each other. A distance between the inlet assembly and the outlet assembly is equal to a longitudinal length of single heat-absorbing unit. The heat-absorbing set defines an air channel with the transparent panel and a heat-absorbing channel below the air channel. The inlet and outlet assemblies are in fluidic communication with the heat-absorbing channel.
    Type: Grant
    Filed: December 26, 2007
    Date of Patent: February 16, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Xin-Jian Xiao
  • Cooling device incorporating boiling chamber
    Patent number: 7661463
    Abstract: A cooling device includes a boiling chamber containing working fluid therein. The chamber includes a bottom wall for contacting with a heat generating component and a cover hermetically connected with the bottom wall. The cover includes a top wall and a bulge formed at a periphery thereof. The bulge includes a pair of spaced side walls, one of the side walls connecting with the top wall and the other of the side walls connecting with the bottom wall. A buffering region is formed between the side walls, which is capable of absorbing agitation wave generated by boiling fluid to thereby allow the boiling fluid to be capabling of continuously and stably contacting with and exchanging heat from the top wall of the boiling chamber when the fluid boils. A heat sink is arranged on the cover of the boiling chamber for transferring heat from the boiling chamber to environment.
    Type: Grant
    Filed: June 24, 2005
    Date of Patent: February 16, 2010
    Assignee: Foxconn Technology Co., Ltd.
    Inventor: Tay-Jian Liu
  • Performance testing apparatus for heat pipes
    Patent number: 7648267
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member for heating an evaporating section of a heat pipe requiring test. The movable portion is movable relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached in the immovable portion and the movable portion for detecting temperature of the heat pipe.
    Type: Grant
    Filed: August 22, 2006
    Date of Patent: January 19, 2010
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chuen-Shu Hou, Chao-Nien Tung
  • LED ILLUMINATION DEVICE AND LIGHT ENGINE THEREOF
    Publication number: 20100002433
    Abstract: An LED illumination device includes a lampshade and a light engine arranged on the lampshade. The lampshade defines a room therein. The light engine includes a heat dissipation member, and a plurality of LEDs arranged on the heat dissipation member and received in the room of the lampshade. The heat dissipation member includes a heat pipe and a heat sink. The heat pipe forms a planar absorbing surface and a dissipating surface opposite to the absorbing surface. The absorbing surface of the heat pipe attaches to the LEDs to absorb heat therefrom. The heat sink includes a base attaching to the dissipating surface of the heat pipe to absorb heat of the heat pipe, and a plurality of fins extending from the base for dissipating heat absorbed from the heat pipe.
    Type: Application
    Filed: April 14, 2009
    Publication date: January 7, 2010
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventor: TAY-JIAN LIU
  • LED ILLUMINATION DEVICE
    Publication number: 20090323342
    Abstract: An LED illumination device includes a light source and a heat sink. The heat sink includes an elongated base and a plurality of fins extending from the base. The base has a heat-absorbing surface and an opposite heat-spreading surface. The fins extend upwardly from the heat-spreading surface. The light source is attached to the heat-absorbing surface, whereby heat generated by the light source is removed by the heat sink. The heat-absorbing surface is one of a convex surface and a concave surface, whereby light emitted from the light source is diverged or converged towards objects.
    Type: Application
    Filed: May 18, 2009
    Publication date: December 31, 2009
    Applicant: Foxconn Technology Co., Ltd.
    Inventor: Tay-Jian Liu
  • LED ILLUMINATION DEVICE
    Publication number: 20090323361
    Abstract: An LED illumination device includes a lamp housing, a heat sink, a cooling fan, and a light source. The heat sink, the cooling fan and the light source are received in the lamp housing. The heat sink includes a base and a plurality of fins extending from the base. The light source is attached to the base of the heat sink. The cooling fan causes ambient air to enter into the lamp housing and flow through the heat sink. A plurality of air-disturbing plates extends from the lamp housing towards the heat sink. The air-disturbing plates disturb the air in the lamp housing and guide the disturbed air into air passageways defined between adjacent fins of the heat sink.
    Type: Application
    Filed: May 18, 2009
    Publication date: December 31, 2009
    Applicant: Foxconn Technology Co., Ltd.
    Inventor: Tay-Jian Liu
  • Apparatus for simulation of heat generation of electronic components
    Patent number: 7637659
    Abstract: Disclosed is an apparatus (10) for simulation of heat generation of a heat-generating electronic component. The apparatus includes a heat-transfer simulation device (110), a base (120) and at least one supporting post (150). The base is made of a heat-insulation material, and defines therein a recess (122). The heat-transfer simulation device is used for simulating heat generation from a heat-generating electronic component. The supporting post supportively mounts the heat-transfer simulation device within the recess defined in the base. A method of evaluating heat removal capacity of a heat dissipation device is also disclosed based on this apparatus.
    Type: Grant
    Filed: July 7, 2006
    Date of Patent: December 29, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Shang-Chih Liang
  • Performance testing apparatus for heat pipes
    Patent number: 7637655
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion and slideably receives the movable portion therein for avoiding the movable portion from deviating from the immovable portion during movement of the movable portion relative the immovable portion. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe.
    Type: Grant
    Filed: July 19, 2006
    Date of Patent: December 29, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou
  • Method for making wick structure of heat pipe and powders for making the same
    Patent number: 7637982
    Abstract: A group of powders (40) for making a wick structure of a heat pipe includes main powders (50) and supplemental powders (60). The melting point of the supplemental powder is lower than that of the main powder. During a sintering process, the powders are filled in a casing of the heat pipe and have a eutectic reaction between the main powders and the supplemental powders to form the wick structure. The temperature for the eutectic reaction is lower than the melting temperature of the supplemental powders.
    Type: Grant
    Filed: June 15, 2006
    Date of Patent: December 29, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Chuen-Shu Hou, Tay-Jian Liu, Chao-Nien Tung
  • Performance testing apparatus for heat pipes
    Patent number: 7632010
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member located therein for heating an evaporating section of the heat pipe. The movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section therein. A positioning structure extends from the immovable portion toward the movable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable and movable portions for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement of the movable portion relative to the immovable portion.
    Type: Grant
    Filed: August 24, 2006
    Date of Patent: December 15, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chuen-Shu Hou, Xiao-Long Li, Chao-Nien Tung