Abstract: A method of releasing a selected light-emitting diode chip from a plurality of light-emitting diode chips each of which has a p-type electrode, an n-type electrode and a central portion between the p-type electrode and the n-type electrode, comprising steps of: providing a first substrate with the plurality of light-emitting diode chips bonded thereon and spaced from each other in a pitch; and applying a laser spot generated from a laser energy source to reduce a bonding force between the selected light-emitting diode chip and the first substrate, thereby making the selected light-emitting diode chip release from the first substrate; wherein the laser spot has a coverage over the p-type electrode and the n-type electrode of the selected light-emitting diode chip, and the coverage has a length less than the pitch.

Abstract: A chip-transferring system and a chip-transferring method are provided. The chip-transferring system includes a substrate-carrying module for carrying a chip-carrying structure, a chip-transferring module, and a system control module. The chip-carrying structure includes a circuit substrate for carrying a plurality of conductive materials, a plurality of micro heaters, and a micro heater control chip. The chip-transferring module is configured for transferring a chip onto two corresponding ones of the conductive materials, and the chip-transferring module includes a motion sensing chip. When chip movement information of the chip that is provided by the motion sensing chip is transmitted to the system control module, the micro heater control chip is configured to control a corresponding one of the micro heaters to start or stop heating the two corresponding conductive materials by control of the system control module according to the chip movement information of the chip.

Abstract: A method for transferring an electronic component includes the steps of: providing a carrier, wherein a surface of the carrier is loaded with an electronic component; providing a substrate; allowing a side of the substrate to face an electronic component-loaded side of the carrier, and maintaining an appropriate distance between the carrier and the substrate; providing an energy source for projecting an energy beam; splitting the energy beam into at least two sub-beams; focusing the at least two sub-beams, such that projection paths of the sub-beams are not parallel to each other; adjusting a distance between the carrier and the energy source as needed; and irradiating appropriate points on the electronic component-free side of the carrier with the at least two sub-beams to allow the electronic component to be separated from the carrier and transferred to the substrate.

Abstract: A board, including a first pad area, a second pad area, a first micro heater, a second micro heater, a first heater terminal pad, a second heater terminal pad, and a third heater terminal pad, is provided. The first pad area and the second pad area respectively include at least one pad. The first micro heater and the second micro heater are respectively disposed corresponding to the first pad area and the second pad area. The first heater terminal pad and the second heater terminal pad form a loop with the first micro heater by being electrically connected to an outside, so that the first micro heater generates heat. The second heater terminal pad and the third heater terminal pad form another loop with the second micro heater by being electrically connected to the outside, so that the second micro heater generates heat. A circuit board and a fixture are also provided.

Abstract: An electronic element soldering method includes providing a substrate, wherein the substrate has a to-be-soldered position, placing an electronic device including an electronic element, a heating element, and a parallel-connected circuit on the to-be-soldered position of the substrate, adding a solder between the electronic element of the electronic device and the to-be-soldered position of the substrate, applying a heating current into the parallel-connected circuit of the electronic device to allow the heating element of the parallel-connected circuit to generate a thermal energy for melting the solder, thereby securing the electronic element on the to-be-soldered position of the substrate via the solder that is melted, applying a breaking current that is larger than the heating current into the parallel-connected circuit to allow an open to occur in a parallel branch corresponding to the heating element of the parallel-connected circuit, and stopping the breaking current.

Abstract: A device for transferring electronic component, comprising: an energy source used to project an energy beam; a first frame used to carry a carrier loaded with electronic component; a second frame used to carry a substrate for receiving the aforesaid electronic component; a beam splitting element arranged between the first frame and the energy source; and a focusing device arranged between the first frame and the beam splitting element. The present invention also relates to a method of transferring electronic component. The device for transferring electronic component and the method for transferring electronic component of the present invention can be applied in the manufacturing process of display.

Abstract: A board, including a first pad area, a second pad area, a first micro heater, a second micro heater, a first heater terminal pad, a second heater terminal pad, and a third heater terminal pad, is provided. The first pad area and the second pad area respectively include at least one pad. The first micro heater and the second micro heater are respectively disposed corresponding to the first pad area and the second pad area. The first heater terminal pad and the second heater terminal pad form a loop with the first micro heater by being electrically connected to an outside, so that the first micro heater generates heat. The second heater terminal pad and the third heater terminal pad form another loop with the second micro heater by being electrically connected to the outside, so that the second micro heater generates heat. A circuit board and a fixture are also provided.

Abstract: A board, including a pad layer, a micro heater layer, and an insulating layer which are laminated, is provided. The pad layer includes a pad. The micro heater layer includes a micro heater. The micro heater is disposed corresponding to the pad. The insulating layer is located between the pad layer and the micro heater layer. A resistance value of the micro heater ranges from 10 ? to 500 ?. A circuit board is also provided.

Abstract: A method of releasing a selected light-emitting diode chip from a plurality of light-emitting diode chips each of which has a p-type electrode, an n-type electrode and a central portion between the p-type electrode and the n-type electrode, comprising steps of: providing a first substrate with the plurality of light-emitting diode chips bonded thereon and spaced from each other in a pitch; and applying a laser spot generated from a laser energy source to reduce a bonding force between the selected light-emitting diode chip and the first substrate, thereby making the selected light-emitting diode chip release from the first substrate; wherein the laser spot has a coverage over the p-type electrode and the n-type electrode of the selected light-emitting diode chip, and the coverage has a length less than the pitch.

Abstract: A micro heater chip, a wafer-level electronic chip assembly and a chip assembly stacking system are provided. The chip assembly stacking system includes a plurality of wafer-level electronic chip assemblies stacked on top of one another and electrically connected with each other. Each wafer-level electronic chip assembly includes a wafer-level electronic chip and a micro heater chip disposed on the wafer-level electronic chip. The micro heater chip includes a heating structure and an insulative structure disposed between the heating structure and the wafer-level electronic chip. The heating structure includes a carrier body, at least one micro heater disposed on or inside the carrier body, and a plurality of conductive connection layers passing through the carrier body. The insulative structure includes an insulative body disposed between the heating structure and the wafer-level electronic chip, and a plurality of conductive material layers passing through the insulative body.

Abstract: An LED chip structure, a chip transferring system and a chip transferring method are provided. The chip transferring system includes a liquid receiving tank, an electromagnetic field generating module and a connection layer removing module. A plurality of LED chip structures are randomly distributed in the liquid substance of the liquid receiving tank. The electromagnetic field generating module movably is disposed inside or removed from the liquid receiving tank. The connection layer removing module is disposed above the circuit substrate. Each of the LED chip structures includes an LED chip, a removable connection layer and a magnetic material layer. The LED chip structure can be transferred from the liquid receiving tank onto a circuit substrate by the electromagnetic field generating module, and the magnetic material layer can be separated from the LED chip while the removable connection layer is removed by the connection layer removing module.

Abstract: A chip-transferring system and a chip-transferring method are provided. The chip-transferring system includes a substrate-carrying module for carrying a chip-carrying structure, a chip-transferring module, and a system control module. The chip-carrying structure includes a circuit substrate for carrying a plurality of conductive materials, a plurality of micro heaters, and a micro heater control chip. The chip-transferring module is configured for transferring a chip onto two corresponding ones of the conductive materials, and the chip-transferring module includes a motion sensing chip. When chip movement information of the chip that is provided by the motion sensing chip is transmitted to the system control module, the micro heater control chip is configured to control a corresponding one of the micro heaters to start or stop heating the two corresponding conductive materials by control of the system control module according to the chip movement information of the chip.

Abstract: A chip-carrying structure and a chip-bonding method are provided. The chip-carrying structure includes a circuit substrate for carrying a plurality of conductive materials, a plurality of micro heaters disposed on or inside the circuit substrate, and a micro heater control chip electrically connected to the micro heaters. Therefore, when a chip is disposed on two corresponding ones of the conductive materials, the micro heater control chip is configured to control a corresponding one of the micro heaters to start or stop heating the two corresponding conductive materials according to chip movement information of the chip.

Abstract: A film structure, a chip carrier assembly, and a chip carrier device are provided. The film structure includes a film and a plurality of micro-heaters. In which, the film is applied on a substrate, and the plurality of micro-heaters is disposed on top of the film or in the film. The chip carrier assembly includes a circuit substrate and the film structure. In which, the circuit substrate carries a plurality of chips. The chip carrier device includes the chip carrier assembly and a suction unit. In which, the suction unit is arranged above the chip carrier assembly to attach on and transfer the plurality of chips to the circuit substrate. The chips are disposed on the circuit substrate through solder balls, and the micro-heaters heat the solder balls that are in contact with the chips.

Abstract: A wafer-grade LED detection device and a wafer-grade LED detection method are provided. The wafer-grade LED detection device includes a light-generating module for providing a first light beam that passes through an LED wafer to be converted into a second light beam, a light-filtering module adjacent to the LED wafer for receiving the second light beam that passes through the light-filtering module to be converted into a third light beam, and a light-detecting module adjacent to the light-filtering module for receiving and detecting the third light beam. A wavelength range of the second light beam is restricted by the light-filtering module, so that a wavelength range of the third light beam is smaller than the wavelength range of the second light beam. When the third light beam is received by the light-detecting module, the light-detecting module can detect the third light beam for obtaining relevant information.

Abstract: A method of manufacturing a red light-emitting chip carrying structure is provided. The method includes providing a red LED wafer including a wafer base, a plurality of porous connection layers, and a plurality of red LED chips; placing the red LED chips on a chip carrying substrate; projecting a laser light beam onto the porous connection layers or the chip carrying substrate; and then removing the wafer base and a removal part of each of the porous connection layers so as to leave a residual part of each of the porous connection layers on a corresponding one of the red LED chips. Therefore, the red LED chips can be transferred from the red LED wafer to a chip adhesive layer of the chip carrying substrate or a plurality of conductive soldering materials on the chip carrying substrate.

Abstract: An LED chip structure, a chip transferring system and a chip transferring method are provided. The chip transferring system includes a liquid receiving tank, an electromagnetic field generating module and a connection layer removing module. A plurality of LED chip structures are randomly distributed in the liquid substance of the liquid receiving tank. The electromagnetic field generating module movably is disposed inside or removed from the liquid receiving tank. The connection layer removing module is disposed above the circuit substrate. Each of the LED chip structures includes an LED chip, a removable connection layer and a magnetic material layer. The LED chip structure can be transferred from the liquid receiving tank onto a circuit substrate by the electromagnetic field generating module, and the magnetic material layer can be separated from the LED chip while the removable connection layer is removed by the connection layer removing module.

Abstract: An LED chip initial structure, a substrate structure for carrying the LED chip initial structure, a chip transferring method using the LED chip initial structure, and an LED image display device manufactured by the LED chip transferring method are provided. The LED chip initial structure includes an LED chip main body and a conductive electrode. One of a top side and a bottom side of the LED chip main body is a temporary electrodeless side, another one of the top side and the bottom side of the LED chip main body is a connecting electrode side, and the temporary electrodeless side has an unoccupied surface. The conductive electrode is disposed on the connecting electrode side of the LED chip main body so as to electrically connect to the LED chip main body. The LED chip initial structure is adhered to a hot-melt material through the conductive electrode.

Abstract: An LED wafer, an LED wafer detection device and an LED wafer detection method are provided. The LED wafer includes a wafer base, a plurality of LED chips, a plurality of positive test circuit layers, a plurality negative test circuit layers, a plurality of positive test contacts, and a plurality of negative test contacts. Each LED chip has a positive contact and a negative contact respectively electrically connected to the corresponding positive test circuit layer and the corresponding negative test circuit layer. The positive test contacts are respectively electrically connected to the positive test circuit layers, and the negative test contacts are respectively electrically connected to the negative test circuit layers. Whereby, when inputting an electric current into the positive test contacts, and then outputting the electric current from the negative test contacts, each LED chip is excited to generate a light source.

Abstract: A micro heater chip, a wafer-level electronic chip assembly and a chip assembly stacking system are provided. The chip assembly stacking system includes a plurality of wafer-level electronic chip assemblies stacked on top of one another and electrically connected with each other. Each wafer-level electronic chip assembly includes a wafer-level electronic chip and a micro heater chip disposed on the wafer-level electronic chip. The micro heater chip includes a heating structure and an insulative structure disposed between the heating structure and the wafer-level electronic chip. The heating structure includes a carrier body, at least one micro heater disposed on or inside the carrier body, and a plurality of conductive connection layers passing through the carrier body. The insulative structure includes an insulative body disposed between the heating structure and the wafer-level electronic chip, and a plurality of conductive material layers passing through the insulative body.