Abstract: A nonvolatile memory structure includes a semiconductor substrate having thereon a first oxide define (OD) region, a second OD region and a third OD region arranged in a row. The first, second, and third OD regions are separated from one another by an isolation region. The isolation region includes a first intervening isolation region between the first OD region and the second OD region, and a second intervening isolation region between the second OD region and the third OD region. A select gate transistor is formed on the first OD region. A floating gate transistor is formed on the second OD region. The floating gate transistor is serially coupled to the select gate transistor. The floating gate transistor includes a floating gate that is completely overlapped with the underlying second OD region and is partially overlapped with the first and second intervening isolation regions.

Abstract: The invention provides a nonvolatile memory apparatus. The nonvolatile memory apparatus comprises a plurality of memory cells and a signal generator. The memory cells are arranged in an array, and each of the memory cells has a control gate terminal, a floating gate, a source line terminal, a bit-line terminal, a selected gate terminal and a word-line terminal. The signal generator is coupled to the memory cells. When the nonvolatile memory apparatus executes a programming operation, the signal generator provides a programming signal to the control gate terminals of a plurality of inhibited memory cells among the memory cells. Wherein, the programming signal is a pulse signal with a direct-current (DC) offset voltage.

Abstract: An erasable programmable single-poly nonvolatile memory includes a substrate structure; a floating gate transistor having a floating gate, a gate oxide layer under the floating gate, and a channel region, wherein the channel region is formed in a N-well region; and an erase gate region, wherein the floating gate is extended to and is adjacent to the erase gate region and the erase gate region comprises a n-type source/drain region connected to an erase line voltage and a P-well region. The N-well and P-well region are formed in the substrate structure. The gate oxide layer comprises a first portion above the channel region of the floating gate transistor and a second portion above the erase gate region, and a thickness of the first portion of the gate oxide layer is different from a thickness of the second portion of the gate oxide layer.

Abstract: A nonvolatile memory structure includes a semiconductor substrate having thereon a first oxide define (OD) region, a second OD region and a third OD region arranged in a row. The first, second, and third OD regions are separated from one another by an isolation region. The isolation region includes a first intervening isolation region between the first OD region and the second OD region, and a second intervening isolation region between the second OD region and the third OD region. A select gate transistor is formed on the first OD region. A floating gate transistor is formed on the second OD region. The floating gate transistor is serially coupled to the select gate transistor. The floating gate transistor includes a floating gate that is completely overlapped with the underlying second OD region and is partially overlapped with the first and second intervening isolation regions.

Abstract: The present invention provides a method of fabricating an erasable programmable single-poly nonvolatile memory, comprising the steps of: defining a first area and a second area in a first type substrate; forming a second type well region in the first area; forming a first gate oxide layer and a second gate oxide layer covering a surface of the first area, wherein the second gate oxide layer extends to and is adjacent to the second area; forming a DDD region in the second area; etching a portion of the second gate oxide layer above the second area; forming two polysilicon gates covering the first and the second gate oxide layers; and defining a second type doped region in the DDD region and defining first type doped regions in the second type well region.

Abstract: An erasable programmable single-poly nonvolatile memory includes a floating gate transistor having a floating gate, a gate oxide layer under the floating gate, and a channel region; and an erase gate region, wherein the floating gate is extended to and is adjacent to the erase gate region. The gate oxide layer comprises a first portion above the channel region of the floating gate transistor and a second portion above the erase gate region, and a thickness of the first portion of the gate oxide layer is different from a thickness of the second portion of the gate oxide layer.

Abstract: The present invention provides method of fabricating an erasable programmable single-poly nonvolatile memory, comprising steps of: defining a first area and a second area in a first type substrate; forming a second type well region in the first area; forming a first gate oxide layer and a second gate oxide layer covered on a surface of the first area, wherein the second gate oxide layer is extended to and is adjacent to the second area; forming a DDD region in the second area; etching a portion of the second gate oxide layer above the second area; forming two polysilicon gates covered on the first and the second gate oxide layers; and defining a second type doped region in the DDD region and a first type doped regions in the second type well region.

Abstract: An erasable programmable single-poly nonvolatile memory includes a substrate structure; a floating gate transistor having a floating gate, a gate oxide layer under the floating gate, and a channel region, wherein the channel region is formed in a N-well region; and an erase gate region, wherein the floating gate is extended to and is adjacent to the erase gate region and the erase gate region comprises a n-type source/drain region connected to an erase line voltage and a P-well region. The N-well and P-well region are formed in the substrate structure. The gate oxide layer comprises a first portion above the channel region of the floating gate transistor and a second portion above the erase gate region, and a thickness of the first portion of the gate oxide layer is different from a thickness of the second portion of the gate oxide layer.

Abstract: An erasable programmable single-poly nonvolatile memory includes a substrate structure; a first PMOS transistor comprising a select gate, a first source/drain region, and a second source/drain region, wherein the select gate is connected to a select gate voltage, and the first source/drain region is connected to a source line voltage; a second PMOS transistor comprising the second source/drain region, a third source/drain region, and a floating gate, wherein the third source/drain region is connected to a bit line voltage and the first, second and third source/drain regions are constructed in a N-well region; and an erase gate region adjacent to the floating gate, wherein the erase gate region comprises a n-type source/drain region connected to an erase line voltage and a P-well region; wherein the N-well region and the P-well region are formed in the substrate structure.

Abstract: The invention provides a nonvolatile memory apparatus. The nonvolatile memory apparatus comprises a plurality of memory cells and a signal generator. The memory cells are arranged in an array, and each of the memory cells has a control gate terminal, a floating gate, a source line terminal, a bit-line terminal, a selected gate terminal and a word-line terminal. The signal generator is coupled to the memory cells. When the nonvolatile memory apparatus executes a programming operation, the signal generator provides a programming signal to the control gate terminals of a plurality of inhibited memory cells among the memory cells. Wherein, the programming signal is a pulse signal with a direct-current (DC) offset voltage.

Abstract: An erasable programmable single-poly nonvolatile memory includes a first PMOS transistor comprising a select gate, a first p-type doped region, and a second p-type doped region, wherein the select gate is connected to a select gate voltage, and the first p-type doped region is connected to a source line voltage; a second PMOS transistor comprising the second p-type doped region, a third p-type doped region, and a floating gate, wherein the third p-type doped region is connected to a bit line voltage; and an erase gate region adjacent to the floating gate, wherein the erase gate region is connected to an erase line voltage.

Abstract: The present invention provides method of fabricating an erasable programmable single-poly nonvolatile memory, comprising steps of: defining a first area and a second area in a first type substrate; forming a second type well region in the first area; forming a first gate oxide layer and a second gate oxide layer covered on a surface of the first area, wherein the second gate oxide layer is extended to and is adjacent to the second area; forming a DDD region in the second area; etching a portion of the second gate oxide layer above the second area; forming two polysilicon gates covered on the first and the second gate oxide layers; and defining a second type doped region in the DDD region and a first type doped regions in the second type well region.

Abstract: An erasable programmable single-poly nonvolatile memory includes a floating gate transistor having a floating gate, a gate oxide layer under the floating gate, and a channel region; and an erase gate region, wherein the floating gate is extended to and is adjacent to the erase gate region. The gate oxide layer comprises a first portion above the channel region of the floating gate transistor and a second portion above the erase gate region, and a thickness of the first portion of the gate oxide layer is different from a thickness of the second portion of the gate oxide layer.

Abstract: A semiconductor memory device includes a substrate, and a trench formed in the substrate. First and second floating gates, each associated with corresponding first and second memory cells, extend into the trench. Since the trench can be made relatively deep, the floating gates may be made relatively large while the lateral dimensions of the floating gates remains small. Moreover, the insulator thickness between the floating gate and a sidewall of the trench where a channel region is formed can be made relatively thick, even though the lateral extent of the memory cell is reduced. A programming gate extends into the trench between the first and second floating gates, and is shared, along with a source region, by the two memory cells.

Abstract: The non-volatile memory cell includes a coupling device and a first select transistor. The coupling device is formed in a first conductivity region. The first select transistor is serially connected to a first floating gate transistor and a second select transistor, all formed in a second conductivity region. An electrode of the coupling device and a gate of the first floating gate transistor are a monolithically formed floating gate; wherein the first conductivity region and the second conductivity region are formed in a third conductivity region; wherein the first conductivity region, the second conductivity region, and the third conductivity region are wells.

Abstract: A memory cell includes a semiconductor substrate; and a first, a second, and a third transistor. The first transistor includes a first dielectric over the semiconductor substrate; and a first floating gate over the first dielectric. The second transistor is electrically coupled to the first transistor and includes a second dielectric over the semiconductor substrate; and a second floating gate over the second dielectric. The first and the second floating gates are electrically disconnected. The memory cell further includes a first capacitor; a second capacitor electrically coupled to the first capacitor; a third capacitor; a fourth capacitor electrically coupled to the third capacitor, wherein each of the first, the second, the third and the fourth capacitors includes the semiconductor substrate as one of the capacitor plates. The third transistor is a selector of the memory cell and is electrically coupled to the first and the second transistors.

Abstract: A programmable non-volatile memory (PNVM) device and method of forming the same compatible with CMOS logic device processes to improve a process flow, the PNVM device including a semiconductor substrate active area; a gate dielectric on the active area; a floating gate electrode on the gate dielectric; an inter-gate dielectric disposed over the floating gate electrode; and, a control gate damascene electrode extending through a dielectric insulating layer in electrical communication with the inter-gate dielectric, the control gate damascene electrode disposed over an upper portion of the floating gate electrode.

Abstract: An array of memory cells arranged in a plurality of rows and a plurality of columns are provided. The array includes a first program line in a first direction, wherein the first program line is connected to program gates of memory cells in a first row of the array; a first erase line in the first direction, wherein the first erase line is connected to erase gates of the memory cells in the first row of the array; and a first word-line in the first direction, wherein the first word-line is connected to word-line nodes of the memory cells in the first row of the array.

Abstract: A system and method provides an improved source-coupling ratio in flash memories. In one embodiment, a flash memory cell system with high source-coupling ratio includes at least a conventional floating gate device having a floating gate, a drain and a source. The floating gate is formed over a first junction for charging the floating gate by electron injection from the source to the floating gate and at least a first dielectric is layered on top of the floating gate to form a second junction. At least a first polycrystalline silicon is layered on top of the first dielectric, the first polycrystalline silicon electrically connected to the source. Electron tunneling provided through the second junction to the floating gate charges the floating gate, thereby increasing the source-coupling ratio of the floating gate and increasing the efficiency of storing electrical charge.

Abstract: A memory cell includes a semiconductor substrate; and a first, a second, and a third transistor. The first transistor includes a first dielectric over the semiconductor substrate; and a first floating gate over the first dielectric. The second transistor is electrically coupled to the first transistor and includes a second dielectric over the semiconductor substrate; and a second floating gate over the second dielectric. The first and the second floating gates are electrically disconnected. The memory cell further includes a first capacitor; a second capacitor electrically coupled to the first capacitor; a third capacitor; a fourth capacitor electrically coupled to the third capacitor, wherein each of the first, the second, the third and the fourth capacitors includes the semiconductor substrate as one of the capacitor plates. The third transistor is a selector of the memory cell and is electrically coupled to the first and the second transistors.