Patents by Inventor Te-Shun LEE

Te-Shun LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210362211
    Abstract: An example system includes a first stamping portion having a first surface to form a corresponding stamped surface on a metal component to be stamped, and a second stamping portion having a second surface, the second surface to oppose the first surface of the first stamping portion during stamping of the metal component. The second surface includes a metal flow receiving feature, the metal flow receiving feature including a non-flat surface to attenuate an amount of metal flowing therein during stamping of the metal component between the first stamping portion and the second stamping portion.
    Type: Application
    Filed: July 2, 2018
    Publication date: November 25, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chao-Hung Lin, Te-Shun Lee, Kuan-Ting Wu, Chia-Cheng Wei
  • Publication number: 20180250858
    Abstract: Various examples provide a mold including a molding component and a supplementary component. The molding component may have a cavity, to enable a molten material to fill into the molding component to form an object. The supplementary component may include a bypass having a first opening located at a first position of the molding component and a second opening located at a second position of the molding component. The molten material may flow from the first position to the second position via the molding component, flow from the first opening to the second opening via the bypass and fill into the second position of the molding component through the second opening.
    Type: Application
    Filed: November 3, 2015
    Publication date: September 6, 2018
    Inventors: Chao-Hung LIN, Wei-Feng YEN, Guess WEI, Te-Shun LEE