STAMPING PORTIONS HAVING METAL FLOW RECEIVING FEATURES
An example system includes a first stamping portion having a first surface to form a corresponding stamped surface on a metal component to be stamped, and a second stamping portion having a second surface, the second surface to oppose the first surface of the first stamping portion during stamping of the metal component. The second surface includes a metal flow receiving feature, the metal flow receiving feature including a non-flat surface to attenuate an amount of metal flowing therein during stamping of the metal component between the first stamping portion and the second stamping portion.
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Many devices include components that are manufactured in a variety of manners. For example, certain devices or components are formed of plastic using injection molding, while others may be formed of a metal that may be forged, machined, or otherwise shaped. The method of forming the component may be selected based on such factors as strength or surface shape desired.
For a more complete understanding of various examples, reference is now made to the following description taken in connection with the accompanying drawings in which:
Various mechanisms may be used for forming different components or devices. For metal components, certain features can be achieved through stamping of a metal component. Stamping can often result in defects on the surface of a component. The defects can include significant non-uniformity of the stamped surface. For certain components and materials, the non-uniformity of the surface can, in turn, result in non-uniformity in color or appearance of the surface. Further, for certain components, the non-uniformity may be significantly noticeable to the touch by a user.
In various examples described herein, metal components may be stamped to form a desired shape or feature. For example, the body of a laptop computer may have a cover with features which can be stamped. In one example, a laptop cover is provided with a recess to allow a user to insert a finger to open the cover. In various examples, stamping systems allow improved stamping of metal components, such as laptop covers, with reduced surface defects. In this regard, an example stamping system includes a first stamping portion provided with a first surface having a shape which corresponds to the desired shape of the component to be stamped, such as a flat shape for the finger recess of the laptop cover. A second stamping portion is provided with a second surface to oppose the first surface. The metal component to be stamped may be positioned between the first stamping portion and the second stamping portion, with the portion of the metal component to have the desired shape positioned between the first surface and the second surface. The second surface is provided with a metal flow receiving feature which includes a non-flat surface. The non-flat surface allows the amount of metal to flow into the metal flow receiving feature to be attenuated during stamping of the metal component between the first stamping portion and the second stamping portion. For example, a stamping force may be adjusted to cause an optimal amount of metal to flow into the metal flow receiving feature to provide a substantially defect-free stamped surface on the metal component. In various examples, the non-flat surface of the metal flow receiving feature may include various shapes such as an arc or a sawtooth pattern.
Referring first to
The second stamping portion 120 is provided with a second surface 122 to oppose the first surface 112 of the first stamping portion 110 during stamping of the metal component, with the metal component being positioned between the first surface 112 of the first stamping portion 110 and the second surface 122 of the second stamping portion 120. In various examples, the second surface 122 of the second stamping portion 120 includes a metal flow receiving feature 124. The metal flow receiving feature 124 includes a non-flat surface to attenuate an amount of metal flowing therein during stamping of the metal component between the first stamping portion 110 and the second stamping portion 120. In this regard, the first surface 112 of the first stamping portion 110 produces a desired shape, while any variations in the amount of metal that is flowed as a result of the stamping is attenuated on the opposite side of the metal component. In some examples, the amount of metal flowing into the metal flow receiving feature 124 can vary based on the stamping pressure, while the first surface 112 of the first stamping portion produces a consistent amount of flow on the stamped side of the metal component.
The first stamping portion 110 and the second stamping portion 120 of the example system 100 may be formed of any of a variety of materials. In one example, the first stamping portion 110 and the second stamping portion 120 are each formed of steel. Generally, the first stamping portion 110 and the second stamping portion 120 may be formed of a material having a hardness that is greater than the hardness of the metal component to be stamped.
Referring now to
As with the example system 100 of
The second stamping portion 220 is provided with a second surface 222, and the metal component 230 is positioned between the first surface 212 of the first stamping portion 210 and the second surface 222 of the second stamping portion 220. As noted above, the metal component 230 includes a stamped surface 232 to be stamped. As illustrated in
In the example system 200 of
Referring now to
Referring first to
Referring now to
Referring now to
In this regard, the non-linear or non-flat surface of the metal flow receiving feature 224 provides regions in which excess metal can flow during stamping. Similarly, the non-flat surface can accommodate varying amounts of metal flowing with variations in stamping pressure. For example, once a minimum level of stamping is achieved to sufficiently form the stamped surface 232 of the metal component 230, additional stamping pressure may result in additional metal flowing into the non-flat metal flow receiving feature 224 while maintaining the desired stamped surface 232. Thus, the non-stamped surface 234 of the metal component may or may not significantly match the second surface 222 of the second stamping portion 220.
Referring first to
The second stamping portion 620 is provided with a second surface 622, and the metal component 630 is positioned between the first surface 612 of the first stamping portion 610 and the second surface 622 of the second stamping portion 620. The metal component includes a stamped surface 632 facing the first surface 612 of the first stamping portion 610 and a non-stamped surface 634, opposite the stamped surface 632, and facing the second surface 622 of the second stamping portion 620.
In the example system 600 of
Referring next to
The second stamping portion 720 is provided with a second surface 722, and the metal component 730 is positioned between the first surface 712 of the first stamping portion 710 and the second surface 722 of the second stamping portion 720. The metal component includes a stamped surface 732 facing the first surface 712 of the first stamping portion 710 and a non-stamped surface 734 opposite the stamped surface 732 and facing the second surface 722 of the second stamping portion 720.
In the example system 700 of
Referring now to
The example method 800 further includes stamping the metal component between the first stamping portion and the second stamping portion (block 820). As described above, the stamping includes flowing material from the metal component into the metal flow receiving feature. In this regard, the metal flow receiving feature can absorb imperfections, thus allowing the stamped surface to be substantially defect-free.
The foregoing description of various examples has been presented for purposes of illustration and description. The foregoing description is not intended to be exhaustive or limiting to the examples disclosed, and modifications and variations are possible in light of the above teachings or may be acquired from practice of various examples. The examples discussed herein were chosen and described in order to explain the principles and the nature of various examples of the present disclosure and its practical application to enable one skilled in the art to utilize the present disclosure in various examples and with various modifications as are suited to the particular use contemplated. The features of the examples described herein may be combined in all possible combinations of methods, apparatus, modules, systems, and computer program products.
It is also noted herein that while the above describes examples, these descriptions should not be viewed in a limiting sense. Rather, there are several variations and modifications which may be made without departing from the scope as defined in the appended claims.
Claims
1. A system, comprising:
- a first stamping portion having a first surface to form a corresponding stamped surface on a metal component to be stamped; and
- a second stamping portion having a second surface, the second surface to oppose the first surface of the first stamping portion during stamping of the metal component,
- wherein the second surface includes a metal flow receiving feature, the metal flow receiving feature including a non-flat surface to attenuate an amount of metal flowing therein during stamping of the metal component between the first stamping portion and the second stamping portion.
2. The system of claim 1, wherein the first stamping portion and the second stamping portion have a hardness greater than a hardness of the metal component.
3. The system of claim 1, wherein the metal flow receiving feature includes at least one of a curved surface, a wave formation or a sawtooth formation.
4. The system of claim 3, wherein the first surface of the first stamping portion includes a substantially flat portion.
5. A system, comprising:
- a first stamping portion having a first surface, the flat surface having a substantially flat portion;
- a second stamping portion having a second surface; and
- a metal component positioned between the first surface of the first stamping portion and the second surface of the second stamping portion, the metal component having a stamped surface facing the first surface of the first stamping portion, the metal component having a non-stamped surface opposite the stamped surface and facing the second surface of the second stamping portion,
- wherein the second surface of the second stamping portion includes a metal flow receiving feature, the metal flow receiving feature including a non-flat surface.
6. The system of claim 5, wherein the first stamping portion and the second stamping portion have a hardness greater than a hardness of the metal component.
7. The system of claim 5, wherein the metal flow receiving feature includes at least one of a curved surface, a wave formation or a sawtooth formation.
8. The system of claim 5, wherein the first surface of the first stamping portion includes a substantially flat portion.
9. The system of claim 5, wherein the metal component is a surface of an electronic device.
10. The system of claim 9, wherein the stamped surface includes a finger recess for the surface of the electronic device.
11. A method, comprising:
- positioning a metal component between a first stamping portion and a second stamping portion, the metal component having a stamped surface to be stamped and a non-stamped surface opposite the stamped surface, the first stamping portion having a first surface facing the stamped surface of the metal component, the second stamping portion having a second surface facing the non-stamped surface of the metal component, the second surface of the second stamping portion including a metal flow receiving feature;
- stamping the metal component between the first stamping portion and the second stamping portion, the stamping including flowing material from the metal component into the metal flow feature.
12. The method of claim 11, wherein the first stamping portion and the second stamping portion have a hardness greater than a hardness of the metal component.
13. The method of claim 11, wherein the first surface of the first stamping portion includes a substantially flat portion.
14. The method of claim 11, wherein the first surface of the first stamping portion includes a substantially flat portion.
15. The method of claim 11, wherein the stamped surface of the metal component includes a finger tab for a surface of an electronic device.
Type: Application
Filed: Jul 2, 2018
Publication Date: Nov 25, 2021
Applicant: Hewlett-Packard Development Company, L.P. (Spring, TX)
Inventors: Chao-Hung Lin (Taipei City), Te-Shun Lee (Taipei City), Kuan-Ting Wu (Taipei City), Chia-Cheng Wei (Taipei City)
Application Number: 16/982,683