Patents by Inventor Tea-In AN

Tea-In AN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11781371
    Abstract: Proposed is a flexible cover window for a flexible display, the flexible cover window including: a first window made of glass and provided on an upper part of a first surface of the flexible display; a second window made of glass and provided on an upper part of a second surface of the flexible display; and a folding part provided between the first window and the second window by corresponding to a folding area of the display and filled with a transparent resin material, wherein a transparent resin layer is provided on a total surface of each of the first window and the second window by continuing to the folding part filled with the transparent resin material, and a chamfer part is provided on each of an end part of the first window and an end part of the second window, which are adjacent to the folding part.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: October 10, 2023
    Inventors: Deok Young Park, Jae Young Hwang, Hak Chul Kim, Kukhyun Sunwoo, Tea Joo Ha
  • Patent number: 11780771
    Abstract: Proposed is a flexible cover window having a folding part, the cover window being a glass-based cover window for a flexible display and including: a plane part provided by corresponding to a plane area of the display, and a folding part provided by continuing to the plane part, by corresponding to a folding area of the display, and by being slimmed to be thinner than the plane part, wherein a depth of layer (DOL) of the plane part is larger than a depth of layer (DOL) of the folding part.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: October 10, 2023
    Inventors: Deok Young Park, Jae Young Hwang, Hak Chul Kim, Kukhyun Sunwoo, Tea Joo Ha
  • Publication number: 20230317569
    Abstract: In some examples, a semiconductor package comprises a die pad, a semiconductor die on the die pad, and a mold compound covering the die pad and the semiconductor die. The semiconductor package includes a conductive component including a roughened surface, the roughened surface having a roughness ranging from an arithmetic mean surface height (SA) of 1.4 to 3.2. The mold compound is coupled to the roughened surface. The semiconductor package includes a bond wire coupling the semiconductor die to the roughened surface. The bond wire is directly coupled to the roughened surface without a precious metal positioned therebetween.
    Type: Application
    Filed: June 5, 2023
    Publication date: October 5, 2023
    Inventors: Yee Gin TEA, Chong Han LIM
  • Patent number: 11776946
    Abstract: A method of manufacturing a package-on-package device includes a bonding step carried out by a bonding apparatus including a pressing member and a light source that produces a laser beam. A bottom package including a lower substrate, lower solder balls alongside an edge of the lower substrate, and a lower chip on a center of the lower substrate is provided, the bottom package is bonded to an interposer substrate having upper solder balls aligned with the lower solder balls, and a top package having an upper substrate and an upper chip on the upper substrate is bonded to the interposer substrate. While the interposer substrate is disposed on the bottom package, the pressing member presses the interposer substrate against the bottom package, and the laser beam adheres the lower solder balls to the upper solder balls.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: October 3, 2023
    Inventors: Junho Cho, Ohchul Kwon, Seungjin Cheon, Tea-Geon Kim, Bubryong Lee, Junglae Jung
  • Patent number: 11765847
    Abstract: Disclosed are a flexible cover window and a method of manufacturing the same. A glass-based flexible cover window includes planar portions formed so as to correspond to planar regions of a flexible display and a folding portion formed so as to be connected to the planar portions, the folding portion being formed so as to correspond to a folding region of the flexible display, wherein the folding portion including a shock compensation pattern unit, and the shock compensation pattern unit has cylindrical patterns.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: September 19, 2023
    Inventors: Kukhyun Sunwoo, Tea Joo Ha, Jong In Park, Jung Seok Woo
  • Publication number: 20230279091
    Abstract: The present invention relates to antibody molecules and functional fragments thereof, capable of binding to tumor necrosis factor alpha (TNF?), to processes for their production, and to their therapeutic uses.
    Type: Application
    Filed: October 3, 2022
    Publication date: September 7, 2023
    Applicant: Tillotts Pharma AG
    Inventors: Tea GUNDE, Sebastian MEYER, Esther Maria FURRER
  • Publication number: 20230272059
    Abstract: The present invention relates to antibody molecules and functional fragments thereof, capable of binding to tumor necrosis factor alpha (TNF?), to processes for their production, and to their therapeutic uses.
    Type: Application
    Filed: August 18, 2022
    Publication date: August 31, 2023
    Applicant: Tillotts Pharma AG
    Inventors: Tea GUNDE, Sebastian Meyer, Esther Maria Furrer
  • Publication number: 20230275623
    Abstract: The present disclosure relates to a radio transmission or reception apparatus and a beam forming method thereof. The apparatus according to the present disclosure comprises: an array antenna for forming multiple beams having different directivities so as to transmit or receive signals through the multiple beams; a digital unit for synthesizing an orthogonal polarization pair so as to generate multi-beam signals for forming the multiple beams; and an RF unit for frequency-converting the multi-beam signals so as to output each of the frequency converted multi-beam signals to the array antenna.
    Type: Application
    Filed: May 3, 2023
    Publication date: August 31, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Young Chan MOON, Joon Hyong SHIM, Min Seon YUN, Tea Youl OH
  • Patent number: 11743135
    Abstract: Some embodiments provide a novel method for receiving a plurality of attribute sets from a set of host computers, each attribute set associated with a group of one or more flows that is created by using a key to associate individual flows into the group of flows. The appliance, in some embodiments, merges two identified attribute sets into one merged attribute set and analyzes the merged attribute set to identify a set of properties of the flows in the groups of flows associated with the two attribute sets. In some embodiments, a visualization process includes identifying machines as members of groups and identifying machines that are connected. The visualization process, in some embodiments, also generates a graphical user interface that can be used to select groups of machines, domains, or individual machines and displays contextual attributes relevant to the selected group, domain, or machine.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: August 29, 2023
    Assignee: VMWARE, INC.
    Inventors: Rajiv Mordani, Shankar Vilayannur, Suresh Nagar, Ashish Patel, Vinith Podduturi, Tea Liukkonen-Olmiala, Vaishnavi Ramamoorthy, Ashish Shendure
  • Publication number: 20230269896
    Abstract: Proposed are a hybrid flexible cover window and a method of manufacturing the same. The hybrid flexible cover window includes a flat portion formed on a flat area of a flexible display and a folding portion which is formed in succession to the flat portion and formed in a folding area of the flexible display. The hybrid flexible cover window includes a substrate, a transparent polyimide layer formed on the glass substrate, and an adhesive buffer layer formed between the glass substrate and the TPI layer, in which the TPI layer has a UV cut-off wavelength of less than 380 nm.
    Type: Application
    Filed: February 8, 2023
    Publication date: August 24, 2023
    Applicant: UTI INC.
    Inventors: Kukhyun SUNWOO, Tea Joo HA, Hee Jun AHN, Seok Pil JIN, Jae Suk OH, Joo Seok LEE
  • Patent number: 11735103
    Abstract: An analog front-end includes a (1-1)-th charge amplifier configured to differentially amplify a first and second sensing signals provided to a (1-1)-th input terminal and a (1-2)-th input terminal, respectively, and output a (1-1)-th differential signal. A (1-2)-th charge amplifier is configured to differentially amplify the second sensing signal and a third sensing signal provided to a (1-3)-th input terminal and a (1-4)-th input terminal, respectively, and output a (1-2)-th differential signal. A second charge amplifier is configured to differentially amplify the (1-1)-th differential signal and the (1-2)-th differential signal provided to a (2-1)-th input terminal and a (2-2)-th input terminal, respectively, and output a (2-1)-th differential signal and a (2-2)-th differential signal. A demodulation circuit is configured to filter the (2-1)-th differential signal and the (2-2)-th differential signal and output demodulated differential signals.
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: August 22, 2023
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Kyung Tea Park, Ji Woong Kim, Hyung Gun Ma, Seong An Park, Seong Joo Lee, Tae Hun Lee, Sang Hyun Heo
  • Patent number: 11715678
    Abstract: In some examples, a semiconductor package comprises a die pad, a semiconductor die on the die pad, and a mold compound covering the die pad and the semiconductor die. The semiconductor package includes a conductive component including a roughened surface, the roughened surface having a roughness ranging from an arithmetic mean surface height (SA) of 1.4 to 3.2. The mold compound is coupled to the roughened surface. The semiconductor package includes a bond wire coupling the semiconductor die to the roughened surface. The bond wire is directly coupled to the roughened surface without a precious metal positioned therebetween.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: August 1, 2023
    Assignee: Texas Instruments Incorporated
    Inventors: Yee Gin Tea, Chong Han Lim
  • Publication number: 20230203162
    Abstract: The present invention relates to a multispecific antibody comprising two antibody-based binding domains, which specifically binds to mesothelin (MSLN-BD); and at least one antibody-based binding domain, which specifically binds to CD3 (CD3-BD); wherein said multispecific antibody does not comprise an immunoglobulin Fc region polypeptide, and wherein each of said MSLN-BD binds to mesothelin (MSLN) with a monovalent dissociation constant (KD) in the range of from 0.5 to 20 nM, when measured by SPR. The present invention further relates to nucleic acid sequence(s) encoding said multispecific antibody, vector(s) comprising aid nucleic acid sequence(s), host cell(s) comprising said nucleic acid sequence(s) or said vector(s), and a method of producing said multispecific antibody. Additionally, the present invention relates to pharmaceutical compositions comprising said multispecific antibody and methods of use thereof.
    Type: Application
    Filed: May 28, 2021
    Publication date: June 29, 2023
    Inventors: Peter LICHTLEN, David URECH, Christian HESS, Tea GUNDE, Alexandre SIMONIN, Stefan WARMUTH, Matthias BROCK, Bithi CHATTERJEE, Maria JOHANSSON, Daniel SNELL
  • Patent number: 11684890
    Abstract: Provided are a methane-selective composite membrane comprising: a UiO-66 type organic-inorganic composite nanoporous material, a MIL-100 type organic-inorganic composite nanoporous material, or a ZIF-8 type organic-inorganic composite nanoporous material to which a methane-selective functional group is introduced for selectively separating methane from a gas mixture containing methane/nitrogen, a use thereof, and a method of preparing the same.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: June 27, 2023
    Assignee: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY
    Inventors: Jeong Hoon Kim, Chang In Kong, Yang No Yun, Su Young Moon, Bong Jun Chang, Bo Ryoung Park, Youn-Sang Bae, Tea-Hoon Kim
  • Publication number: 20230192897
    Abstract: The present invention relates to a multispecific antibody comprising at least one CD137 binding domain and at least one PDL1 binding domain, and pharmaceutical compositions and methods of use thereof. The present invention further relates to a nucleic acid encoding said multispecific antibody, a vector comprising said nucleic acid, a host cell comprising said nucleic acid or said vector, and a method of producing said multispecific antibody.
    Type: Application
    Filed: October 9, 2018
    Publication date: June 22, 2023
    Inventors: David URECH, Tea GUNDE, Sebastian MEYER, Matthias BROCK, Christian HESS, Alexandre SIMONIN, Stefan WARMUTH
  • Patent number: 11682152
    Abstract: Collaborative art and communication platform provides a single platform where artists can collaborate, in real-time or near-real-time, on works of art. The platform's communication functionalities enable efficient and cost-effective communication between artists, whether artists are working together on a piece of art, coordinating a potential project, critiquing works of art on the platform, or discussing art in general. The platform enables artists to create and share works of art to all platform users.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: June 20, 2023
    Assignee: ISCRIBBLE, INC.
    Inventor: Téa Blumer
  • Patent number: 11678452
    Abstract: A cover window is provided, and more particularly, a flexible glass-based cover window for a flexible display is provided, the cover window including: a folding part slimmed by corresponding to a folding area of the display, and a boundary part provided on opposite ends of the folding part, the boundary part having a thickness gradually becoming larger from the folding part and continuing to a plane area of the cover window, wherein inclination of the boundary part is 1 to 10° relative to the folding part.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: June 13, 2023
    Inventors: Deok Young Park, Jae Young Hwang, Hak Chul Kim, Kukhyun Sunwoo, Tea Joo Ha
  • Publication number: 20230152922
    Abstract: A sensor device of the present invention includes first sensors; second sensors forming capacitance with the first sensors; a multi-frequency generator generating a first frequency signal and a second frequency signal having different frequencies; a sensor transmitter supplying first driving signals based on the first frequency signal to first sensors of a first group among the first sensors, supplying second driving signals based on the second frequency signal to first sensors of a second group among the first sensors, and simultaneously supplying the first driving signals and the second driving signals; and a sensor receiver simultaneously receiving sensing signals from the second sensors.
    Type: Application
    Filed: June 27, 2022
    Publication date: May 18, 2023
    Inventors: Keum Dong JUNG, Ji Woong KIM, Hyung Gun MA, Kyung Tea PARK, Moon Jae JEONG, Sang Hyun HEO
  • Patent number: 11649343
    Abstract: Components of medical devices include polypropylene-poly(ethylene oxide) amphiphilic graft copolymers (PP-g-PEO) in their base polymer formulations. The base polymeric formulations comprise at least a polymer or co-polymer of propylene. These components are suitable for solvent-bonding with other components and enhance bond strength of the medical devices.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: May 16, 2023
    Assignee: Becton, Dickinson and Company
    Inventors: Jianbin Zhang, Theresa Hermel-Davidock, Edward Bryan Coughlin, Tea Datashvili
  • Patent number: 11649341
    Abstract: Components of medical devices include polyethylene-poly(ethylene oxide) amphiphilic graft copolymers (PE-g-PEO) in their base polymer formulations. The base polymeric formulations comprise at least a polymer or co-polymer of ethylene. These components are suitable for solvent-bonding with other components and enhance bond strength of the medical devices.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: May 16, 2023
    Assignee: Becton, Dickinson and Company
    Inventors: Jianbin Zhang, Theresa Hermel-Davidock, Edward Bryan Coughlin, Tea Datashvili