Patents by Inventor Tejpal Singh

Tejpal Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12011296
    Abstract: Systems and methods are provided for implanting an implantable cardiac monitor. An insertion system includes an implantable cardiac monitor (ICM). An insertion housing comprises a passage extending from a first end of the insertion housing to a second end of the insertion housing. The passage configured to receive the obturator and a receptacle in communication with the passage and an external environment. The receptacle configured to receive the ICM. An obturator is configured to move within the passage when the obturator is moved relative to the insertion housing. The obturator has a channel forming section at a distal end thereof and a motion limiter is provided on at least one of the shaft and the insertion housing.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: June 18, 2024
    Assignee: Pacesetter, Inc.
    Inventors: Li Jin, Gene A. Bornzin, Zoltan Somogyi, Alex Soriano, Jake Singer, Tejpal Singh, Wenbo Hou, Julie Prillinger, Armando M. Cappa, Mitch Goodman, Tracee Eidenschink
  • Publication number: 20240156388
    Abstract: Systems and methods described herein improve visibility of P-waves of an EGM or ECG signal segment to be displayed on a display screen. There is a determination of whether relatively small features, including the P-waves, of the ECG or EGM signal segment would be difficult to visualize if an original signal segment range of the ECG or EGM signal segment were caused to be displayed on the display screen. In response to determining that the relatively small features of the ECG or EGM signal segment would be difficult to visualize, a portion of the EGM or ECG signal segment is displayed on the display screen in a manner that magnifies the P-waves of the EGM or ECG signal segment compared to if an entirety of the EGM or ECG signal segment within the original signal segment range were instead caused to be displayed on the display screen.
    Type: Application
    Filed: October 19, 2023
    Publication date: May 16, 2024
    Applicant: Pacesetter, Inc.
    Inventors: Fujian Qu, Praveen Gopalakrishna, Tejpal Singh
  • Publication number: 20240156387
    Abstract: Systems and methods described herein improve visibility of features (e.g., P-waves) of a physiologic signal segment (e.g., an EGM or ECG signal segment) to be displayed within a display band having a specified height between an upper and a lower boundary of the display band. The physiologic signal segment is divided into sub-segments, for each of which a sub-segment minimum peak amplitude and maximum peak amplitude are determined. Based thereon, a new minimum peak amplitude and a new maximum peak amplitude are determined and used to determine a new display range. A portion of the physiologic signal segment that is within the new display range is caused to be display, within the display band having the specified height, such that the upper boundary of the display band corresponds to the new maximum peak amplitude, and the lower boundary of the display band corresponds to the new minimum peak amplitude.
    Type: Application
    Filed: September 5, 2023
    Publication date: May 16, 2024
    Applicant: Pacesetter, Inc.
    Inventors: Fujian Qu, Praveen Gopalakrishna, Tejpal Singh
  • Publication number: 20240098818
    Abstract: A method and device for managing establishment of a communications link between an external instrument (EI) and an implantable medical device (IMD) are provided. The method stores, in a memory in at least one of the IMD or the EI, a base scanning schedule that defines a pattern for scanning windows over a scanning state. The method enters the scanning state during which a receiver scans for advertisement notices during the scanning windows. At least a portion of the scanning windows are grouped in a first segment of the scanning state. The method stores, in the memory, a scan reset pattern for restarting the scanning state. Further, the method automatically restarts the scanning state based on the scan reset pattern to form a pseudo-scanning schedule that differs from the base scanning schedule and establishes a communication session between the IMD and the EI.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Yongjian Wu, Jyoti Bhayana, Chao-Wen Young, Tejpal Singh, Samir Shah
  • Patent number: 11899615
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Grant
    Filed: January 27, 2023
    Date of Patent: February 13, 2024
    Assignee: Intel Corporation
    Inventors: Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati, Tejpal Singh, Ankush Varma, Mahesh K. Kumashikar, Srikanth Nimmagadda, Carleton L. Molnar, Vedaraman Geetha, Jeffrey D. Chamberlain, William R. Halleck, George Z Chrysos, John R. Ayers, Dheeraj R. Subbareddy
  • Patent number: 11896831
    Abstract: Methods and devices for managing establishment of a communications link between an external instrument (EI) and an implantable medical device (IMD) are provided. The methods and devices comprise storing, in memory in at least one of the IMD or the EI an advertising schedule defining a pattern for advertisement notices. The advertisement notices are distributed un-evenly and separated by unequal advertisement intervals. The method transmits, from a transmitter in at least one of the IMD or the EI the advertisement notices. The advertisement notices are distributed as defined by the advertising schedule. The method establishes a communication session between the IMD and the EI.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: February 13, 2024
    Assignee: Pacesetter, Inc.
    Inventors: Yongjian Wu, Samir Shah, Heidi Hellman, Reza Shahandeh, Tejpal Singh, Youjing Huang, Chao-Wen Young
  • Patent number: 11871463
    Abstract: A method and device for managing establishment of a communications link between an external instrument (EI) and an implantable medical device (IMD) are provided. The method stores, in a memory in at least one of the IMD or the EI, a base scanning schedule that defines a pattern for scanning windows over a scanning state. The method enters the scanning state during which a receiver scans for advertisement notices during the scanning windows. At least a portion of the scanning windows are grouped in a first segment of the scanning state. The method stores, in the memory, a scan reset pattern for restarting the scanning state. Further, the method automatically restarts the scanning state based on the scan reset pattern to form a pseudo-scanning schedule that differs from the base scanning schedule and establishes a communication session between the IMD and the EI.
    Type: Grant
    Filed: October 25, 2022
    Date of Patent: January 9, 2024
    Assignee: Pacesetter, Inc.
    Inventors: Yongjian Wu, Jyoti Bhayana, Chao-Wen Young, Tejpal Singh, Samir Shah
  • Patent number: 11800593
    Abstract: Systems and methods for managing bi-directional communication between an external device (ED) and an implantable medical device (IMD) are provided. The method comprises receiving an active ED configuration and a request for communications parameters to be used with the active ED configuration. The method further comprises identifying a pre-existing configuration, from a collection of pre-existing configurations that match the active ED configuration, the collection of pre-existing configurations having an associated collection of predefined parameter sets. The method further determines a resultant parameter set from the collection of predefined parameter sets based on the pre-existing configuration identified and returns the resultant parameter set in connection with the request, the resultant parameter set to be utilized by the ED for bi-directional communication with the IMD.
    Type: Grant
    Filed: December 20, 2022
    Date of Patent: October 24, 2023
    Assignee: Pacesetter, Inc.
    Inventors: Taral Oza, Gabriel A. Mouchawar, Samir Shah, Tejpal Singh, John Stockton
  • Patent number: 11734174
    Abstract: Described is an low overhead method and apparatus to reconfigure a pair of buffered interconnect links to operate in one of these three modes—first mode (e.g., bandwidth mode), second mode (e.g., latency mode), and third mode (e.g., energy mode). In bandwidth mode, each link in the pair buffered interconnect links carries a unique signal from source to destination. In latency mode, both links in the pair carry the same signal from source to destination, where one link in the pair is “primary” and other is called the “assist”. Temporal alignment of transitions in this pair of buffered interconnects reduces the effective capacitance of primary, thereby reducing delay or latency. In energy mode, one link in the pair, the primary, alone carries a signal, while the other link in the pair is idle. An idle neighbor on one side reduces energy consumption of the primary.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: August 22, 2023
    Assignee: Intel Corporation
    Inventors: Huichu Liu, Tanay Karnik, Tejpal Singh, Yen-Cheng Liu, Lavanya Subramanian, Mahesh Kumashikar, Sri Harsha Choday, Sreenivas Subramoney, Kaushik Vaidyanathan, Daniel H. Morris, Uygar E. Avci, Ian A. Young
  • Publication number: 20230197676
    Abstract: A microelectronic assembly is provided, comprising: a first integrated circuit (IC) die having a first connection to a first serializer/deserializer (SERDES) circuit and a second connection to a second SERDES circuit; a second IC die having the first SERDES circuit; and a third IC die having the second SERDES circuit, in which the first IC die is in a first layer, the second IC die and the third IC die are in a second layer not coplanar with the first layer, the first layer and the second layer are coupled by interconnects having a pitch of less than 10 micrometers between adjacent ones of the interconnects, and the first SERDES circuit and the second SERDES circuit are coupled by a conductive pathway.
    Type: Application
    Filed: December 21, 2021
    Publication date: June 22, 2023
    Applicant: Intel Corporation
    Inventors: Gerald S. Pasdast, Adel A. Elsherbini, Nevine Nassif, Carleton L. Molnar, Vivek Kumar Rajan, Peipei Wang, Shawna M. Liff, Tejpal Singh, Johanna M. Swan
  • Publication number: 20230169032
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Application
    Filed: January 27, 2023
    Publication date: June 1, 2023
    Inventors: NEVINE NASSIF, YEN-CHENG LIU, KRISHNAKANTH V. SISTLA, GERALD PASDAST, SIVA SOUMYA EACHEMPATI, TEJPAL SINGH, ANKUSH VARMA, MAHESH K. KUMASHIKAR, SRIKANTH NIMMAGADDA, CARLETON L. MOLNAR, VEDARAMAN GEETHA, JEFFREY D. CHAMBERLAIN, WILLIAM R. HALLECK, GEORGE Z. CHRYSOS, JOHN R. AYERS, DHEERAJ R. SUBBAREDDY
  • Publication number: 20230121218
    Abstract: Systems and methods for managing bi-directional communication between an external device (ED) and an implantable medical device (IMD) are provided. The method comprises receiving an active ED configuration and a request for communications parameters to be used with the active ED configuration. The method further comprises identifying a pre-existing configuration, from a collection of pre-existing configurations that match the active ED configuration, the collection of pre-existing configurations having an associated collection of predefined parameter sets. The method further determines a resultant parameter set from the collection of predefined parameter sets based on the pre-existing configuration identified and returns the resultant parameter set in connection with the request, the resultant parameter set to be utilized by the ED for bi-directional communication with the IMD.
    Type: Application
    Filed: December 20, 2022
    Publication date: April 20, 2023
    Inventors: Taral Oza, Gabriel A. Mouchawar, Samir Shah, Tejpal Singh, John Stockton
  • Patent number: 11586579
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: February 21, 2023
    Assignee: Intel Corporation
    Inventors: Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati, Tejpal Singh, Ankush Varma, Mahesh K. Kumashikar, Srikanth Nimmagadda, Carleton L. Molnar, Vedaraman Geetha, Jeffrey D. Chamberlain, William R. Halleck, George Z. Chrysos, John R. Ayers, Dheeraj R. Subbareddy
  • Publication number: 20230039943
    Abstract: A method and device for managing establishment of a communications link between an external instrument (EI) and an implantable medical device (IMD) are provided. The method stores, in a memory in at least one of the IMD or the EI, a base scanning schedule that defines a pattern for scanning windows over a scanning state. The method enters the scanning state during which a receiver scans for advertisement notices during the scanning windows. At least a portion of the scanning windows are grouped in a first segment of the scanning state. The method stores, in the memory, a scan reset pattern for restarting the scanning state. Further, the method automatically restarts the scanning state based on the scan reset pattern to form a pseudo-scanning schedule that differs from the base scanning schedule and establishes a communication session between the IMD and the EI.
    Type: Application
    Filed: October 25, 2022
    Publication date: February 9, 2023
    Inventors: Yongjian Wu, Jyoti Bhayana, Chao-Wen Young, Tejpal Singh, Samir Shah
  • Patent number: 11564278
    Abstract: Systems and methods for managing bi-directional communication between an external device (ED) and an implantable medical device (IMD) are provided. The method comprises receiving an active ED configuration and a request for communications parameters to be used with the active ED configuration. The method further comprises identifying a pre-existing configuration, from a collection of pre-existing configurations that match the active ED configuration, the collection of pre-existing configurations having an associated collection of predefined parameter sets. The method further determines a resultant parameter set from the collection of predefined parameter sets based on the pre-existing configuration identified and returns the resultant parameter set in connection with the request, the resultant parameter set to be utilized by the ED for bi-directional communication with the IMD.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: January 24, 2023
    Assignee: Pacesetter, Inc.
    Inventors: Taral Oza, Gabriel A. Mouchawar, Samir Shah, Tejpal Singh, John Stockton
  • Patent number: 11516860
    Abstract: A method and device for managing establishment of a communications link between an external instrument (EI) and an implantable medical device (IMD) are provided. The method stores, in a memory in at least one of the IMD or the EI, a base scanning schedule that defines a pattern for scanning windows over a scanning state. The method enters the scanning state during which a receiver scans for advertisement notices during the scanning windows. At least a portion of the scanning windows are grouped in a first segment of the scanning state. The method stores, in the memory, a scan reset pattern for restarting the scanning state. Further, the method automatically restarts the scanning state based on the scan reset pattern to form a pseudo-scanning schedule that differs from the base scanning schedule and establishes a communication session between the IMD and the EI.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: November 29, 2022
    Assignee: Pacesetter, Inc.
    Inventors: Yongjian Wu, Jyoti Bhayana, Chao-Wen Young, Tejpal Singh, Samir Shah
  • Publication number: 20220184404
    Abstract: Methods and devices for managing establishment of a communications link between an external instrument (EI) and an implantable medical device (IMD) are provided. The methods and devices comprise storing, in memory in at least one of the IMD or the EI an advertising schedule defining a pattern for advertisement notices. The advertisement notices are distributed un-evenly and separated by unequal advertisement intervals. The method transmits, from a transmitter in at least one of the IMD or the EI the advertisement notices. The advertisement notices are distributed as defined by the advertising schedule. The method establishes a communication session between the IMD and the EI.
    Type: Application
    Filed: March 7, 2022
    Publication date: June 16, 2022
    Applicant: Pacesetter, Inc.
    Inventors: Yongjian Wu, Samir Shah, Heidi Hellman, Reza Shahandeh, Tejpal Singh, Youjing Huang, Chao-Wen Young
  • Patent number: 11336559
    Abstract: Embodiments herein may relate to a processor package with a substrate and a multi-chip processor coupled with the substrate. The multi-chip processor may include a dual-sided interconnect structure coupled with a first chip, a second chip, and a third chip. The first chip may be communicatively coupled with the second chip by an on-chip communication route. Likewise, the second chip may be communicatively coupled with the first chip by an on-chip communication route. Additionally, the first chip may be communicatively coupled with the third chip by a fast-lane communication route. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: May 17, 2022
    Assignee: Intel Corporation
    Inventors: Adel A. Elsherbini, Tejpal Singh, Shawna M. Liff, Gerald S. Pasdast, Johanna M. Swan
  • Patent number: 11298552
    Abstract: Methods and devices for managing establishment of a communications link between an external instrument (EI) and an implantable medical device (IMD) are provided. The methods and devices comprise storing, in memory in at least one of the IMD or the EI an advertising schedule defining a pattern for advertisement notices. The advertisement notices are distributed un-evenly and separated by unequal advertisement intervals. The method transmits, from a transmitter in at least one of the IMD or the EI the advertisement notices. The advertisement notices are distributed as defined by the advertising schedule. The method establishes a communication session between the IMD and the EI.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: April 12, 2022
    Assignee: Pacesetter, Inc.
    Inventors: Yongjian Wu, Samir Shah, Heidi Hellman, Reza Shahandeh, Tejpal Singh, Youjing Huang, Chao-Wen Young
  • Patent number: 11294850
    Abstract: In one embodiment, a system on chip includes: a plurality of intellectual property (IP) agents formed on a semiconductor die; a mesh interconnect formed on the semiconductor die to couple the plurality of IP agents, and a plurality of mesh stops each to couple one or more of the plurality of IP agents to the mesh interconnect. The mesh interconnect may be formed of a plurality of rows each having one of a plurality of horizontal interconnects and a plurality of columns each having one of a plurality of vertical interconnects;, where at least one of the plurality of rows includes an asymmetrical number of mesh stops. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: April 5, 2022
    Assignee: Intel Corporation
    Inventors: Brinda Ganesh, Yen-Cheng Liu, Swadesh Choudhary, Tejpal Singh, Pradeep Prabhakaran, Monam Agarwal