Patents by Inventor Tejpal Singh

Tejpal Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11256657
    Abstract: In one embodiment, an apparatus includes an interconnect to couple a plurality of processing circuits. The interconnect may include a pipe stage circuit coupled between a first processing circuit and a second processing circuit. This pipe stage circuit may include: a pipe stage component having a first input to receive a signal via the interconnect and a first output to output the signal; and a selection circuit having a first input to receive the signal from the first output of the pipe stage component and a second input to receive the signal via a bypass path, where the selection circuit is dynamically controllable to output the signal received from the first output of the pipe stage component or the signal received via the bypass path. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: February 22, 2022
    Assignee: Intel Corporation
    Inventors: Tejpal Singh, Yedidya Hilewitz, Ankush Varma, Yen-Cheng Liu, Krishnakanth V. Sistla, Jeffrey Chamberlain
  • Publication number: 20220050805
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Application
    Filed: October 28, 2021
    Publication date: February 17, 2022
    Inventors: NEVINE NASSIF, YEN-CHENG LIU, KRISHNAKANTH V. SISTLA, GERALD PASDAST, SIVA SOUMYA EACHEMPATI, TEJPAL SINGH, ANKUSH VARMA, MAHESH K. KUMASHIKAR, SRIKANTH NIMMAGADDA, CARLETON L. MOLNAR, VEDARAMAN GEETHA, JEFFREY D. CHAMBERLAIN, WILLIAM R. HALLECK, GEORGE Z. CHRYSOS, JOHN R. AYERS, DHEERAJ R. SUBBAREDDY
  • Patent number: 11224087
    Abstract: Systems and methods for managing bi-directional communication between an external device (ED) and an implantable medical device (IMD) are provided. The method comprises receiving an active ED configuration and a request for communications parameters to be used with the active ED configuration. The method further comprises identifying a pre-existing configuration, from a collection of pre-existing configurations that match the active ED configuration, the collection of pre-existing configurations having an associated collection of predefined parameter sets. The method further determines a resultant parameter set from the collection of predefined parameter sets based on the pre-existing configuration identified and returns the resultant parameter set in connection with the request, the resultant parameter set to be utilized by the ED for bi-directional communication with the IMD.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: January 11, 2022
    Assignee: PACESETTER, INC.
    Inventors: Taral Oza, Gabriel A. Mouchawar, Samir Shah, Tejpal Singh, John Stockton
  • Publication number: 20210315031
    Abstract: A method and device for managing establishment of a communications link between an external instrument (EI) and an implantable medical device (IMD) are provided. The method stores, in a memory in at least one of the IMD or the EI, a base scanning schedule that defines a pattern for scanning windows over a scanning state. The method enters the scanning state during which a receiver scans for advertisement notices during the scanning windows. At least a portion of the scanning windows are grouped in a first segment of the scanning state. The method stores, in the memory, a scan reset pattern for restarting the scanning state. Further, the method automatically restarts the scanning state based on the scan reset pattern to form a pseudo-scanning schedule that differs from the base scanning schedule and establishes a communication session between the IMD and the EI.
    Type: Application
    Filed: April 2, 2020
    Publication date: October 7, 2021
    Inventors: Yongjian Wu, Jyoti Bhayana, Chao-Wen Young, Tejpal Singh, Samir Shah
  • Publication number: 20210089448
    Abstract: Described is an low overhead method and apparatus to reconfigure a pair of buffered interconnect links to operate in one of these three modes—first mode (e.g., bandwidth mode), second mode (e.g., latency mode), and third mode (e.g., energy mode). In bandwidth mode, each link in the pair buffered interconnect links carries a unique signal from source to destination. In latency mode, both links in the pair carry the same signal from source to destination, where one link in the pair is “primary” and other is called the “assist”. Temporal alignment of transitions in this pair of buffered interconnects reduces the effective capacitance of primary, thereby reducing delay or latency. In energy mode, one link in the pair, the primary, alone carries a signal, while the other link in the pair is idle. An idle neighbor on one side reduces energy consumption of the primary.
    Type: Application
    Filed: September 19, 2019
    Publication date: March 25, 2021
    Applicant: Intel Corporation
    Inventors: Huichu Liu, Tanay Karnik, Tejpal Singh, Yen-Cheng Liu, Lavanya Subramanian, Mahesh Kumashikar, Sri Harsha Chodav, Sreenivas Subramoney, Kaushik Vaidyanathan, Daniel H. Morris, Uygar E. Avci, Ian A. Young
  • Publication number: 20200334196
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Application
    Filed: June 30, 2020
    Publication date: October 22, 2020
    Inventors: NEVINE NASSIF, YEN-CHENG LIU, KRISHNAKANTH V. SISTLA, GERALD PASDAST, SIVA SOUMYA EACHEMPATI, TEJPAL SINGH, ANKUSH VARMA, MAHESH K. KUMASHIKAR, SRIKANTH NIMMAGADDA, CARLETON L. MOLNAR, VEDARAMAN GEETHA, JEFFREY D. CHAMBERLAIN, WILLIAM R. HALLECK, GEORGE Z. CHRYSOS, JOHN R. AYERS, DHEERAJ R. SUBBAREDDY
  • Patent number: 10795853
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Grant
    Filed: September 30, 2017
    Date of Patent: October 6, 2020
    Assignee: Intel Corporation
    Inventors: Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati, Tejpal Singh, Ankush Varma, Mahesh K. Kumashikar, Srikanth Nimmagadda, Carleton L. Molnar, Vedaraman Geetha, Jeffrey D. Chamberlain, William R. Halleck, George Z. Chrysos, John R. Ayers, Dheeraj R. Subbareddy
  • Publication number: 20200311018
    Abstract: In one embodiment, an apparatus includes an interconnect to couple a plurality of processing circuits. The interconnect may include a pipe stage circuit coupled between a first processing circuit and a second processing circuit. This pipe stage circuit may include: a pipe stage component having a first input to receive a signal via the interconnect and a first output to output the signal; and a selection circuit having a first input to receive the signal from the first output of the pipe stage component and a second input to receive the signal via a bypass path, where the selection circuit is dynamically controllable to output the signal received from the first output of the pipe stage component or the signal received via the bypass path. Other embodiments are described and claimed.
    Type: Application
    Filed: March 26, 2019
    Publication date: October 1, 2020
    Inventors: Tejpal Singh, Yedidya Hilewitz, Ankush Varma, Yen-Cheng Liu, Krishnakanth V. Sistla, Jeffrey Chamberlain
  • Patent number: 10639482
    Abstract: A method and device for managing establishment of a communications link between an external instrument (EI) and an implantable medical device (IMD) are provided. The method stores, in a memory in at least one of the IMD or the EI, a base scanning schedule that defines a pattern for scanning windows over a scanning state. The method enters the scanning state during which a receiver scans for advertisement notices during the scanning windows. At least a portion of the scanning windows are grouped in a first segment of the scanning state. The method stores, in the memory, a scan reset pattern for restarting the scanning state. Further, the method automatically restarts the scanning state based on the scan reset pattern to form a pseudo-scanning schedule that differs from the base scanning schedule and establishes a communication session between the IMD and the EI.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: May 5, 2020
    Assignee: PACESETTER, INC.
    Inventors: Yongjian Wu, Jyoti Bhayana, Chao-Wen Young, Tejpal Singh, Samir Shah
  • Publication number: 20200084822
    Abstract: Systems and methods for managing bi-directional communication between an external device (ED) and an implantable medical device (IMD) are provided. The method comprises receiving an active ED configuration and a request for communications parameters to be used with the active ED configuration. The method further comprises identifying a pre-existing configuration, from a collection of pre-existing configurations that match the active ED configuration, the collection of pre-existing configurations having an associated collection of predefined parameter sets. The method further determines a resultant parameter set from the collection of predefined parameter sets based on the pre-existing configuration identified and returns the resultant parameter set in connection with the request, the resultant parameter set to be utilized by the ED for bi-directional communication with the IMD.
    Type: Application
    Filed: November 13, 2019
    Publication date: March 12, 2020
    Inventors: Taral Oza, Gabriel A. Mouchawar, Samir Shah, Tejpal Singh, John Stockton
  • Publication number: 20200067816
    Abstract: Embodiments herein may relate to a processor package with a substrate and a multi-chip processor coupled with the substrate. The multi-chip processor may include a dual-sided interconnect structure coupled with a first chip, a second chip, and a third chip. The first chip may be communicatively coupled with the second chip by an on-chip communication route. Likewise, the second chip may be communicatively coupled with the first chip by an on-chip communication route. Additionally, the first chip may be communicatively coupled with the third chip by a fast-lane communication route. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: August 21, 2018
    Publication date: February 27, 2020
    Applicant: Intel Corporation
    Inventors: Adel A. Elsherbini, Tejpal Singh, Shawna M. Liff, Gerald S. Pasdast, Johanna M. Swan
  • Patent number: 10517134
    Abstract: Systems and methods for managing bi-directional communication between an external device (ED) and an implantable medical device (IMD) are provided. The method comprises receiving an active ED configuration and a request for communications parameters to be used with the active ED configuration. The method further comprises identifying a pre-existing configuration, from a collection of pre-existing configurations that match the active ED configuration, the collection of pre-existing configurations having an associated collection of predefined parameter sets. The method further determines a resultant parameter set from the collection of predefined parameter sets based on the pre-existing configuration identified and returns the resultant parameter set in connection with the request, the resultant parameter set to be utilized by the ED for bi-directional communication with the IMD.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: December 24, 2019
    Assignee: PACESETTER, INC.
    Inventors: Taral Oza, Gabriel A. Mouchawar, Samir Shah, Tejpal Singh, John Stockton
  • Publication number: 20190321646
    Abstract: Methods and devices for managing establishment of a communications link between an external instrument (EI) and an implantable medical device (IMD) are provided. The methods and devices comprise storing, in memory in at least one of the IMD or the EI an advertising schedule defining a pattern for advertisement notices. The advertisement notices are distributed un-evenly and separated by unequal advertisement intervals. The method transmits, from a transmitter in at least one of the IMD or the EI the advertisement notices. The advertisement notices are distributed as defined by the advertising schedule. The method establishes a communication session between the IMD and the EI.
    Type: Application
    Filed: July 3, 2019
    Publication date: October 24, 2019
    Inventors: Yongjian Wu, Samir Shah, Heidi Hellman, Reza Shahandeh, Tejpal Singh, Youjing Huang, Chao-Wen Young
  • Patent number: 10449372
    Abstract: Methods and devices for managing establishment of a communications link between an external instrument (EI) and an implantable medical device (IMD) are provided. The methods and devices comprise storing, in memory in at least one of the IMD or the EI an advertising schedule defining a pattern for advertisement notices. The advertisement notices are distributed un-evenly and separated by unequal advertisement intervals. The method transmits, from a transmitter in at least one of the IMD or the EI the advertisement notices. The advertisement notices are distributed as defined by the advertising schedule. The method establishes a communication session between the IMD and the EI.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: October 22, 2019
    Assignee: Pacesetter, Inc.
    Inventors: Yongjian Wu, Samir Shah, Heidi Hellman, Reza Shahandeh, Tejpal Singh, Youjing Huang, Chao-Wen Young
  • Publication number: 20190227979
    Abstract: In one embodiment, a system on chip includes: a plurality of intellectual property (IP) agents formed on a semiconductor die; a mesh interconnect formed on the semiconductor die to couple the plurality of IP agents, and a plurality of mesh stops each to couple one or more of the plurality of IP agents to the mesh interconnect. The mesh interconnect may be formed of a plurality of rows each having one of a plurality of horizontal interconnects and a plurality of columns each having one of a plurality of vertical interconnects;, where at least one of the plurality of rows includes an asymmetrical number of mesh stops. Other embodiments are described and claimed.
    Type: Application
    Filed: March 29, 2019
    Publication date: July 25, 2019
    Inventors: Brinda Ganesh, Yen-Cheng Liu, Swadesh Choudhary, Tejpal Singh, Pradeep Prabhakaran, Monam Agarwal
  • Patent number: 10362629
    Abstract: Systems and methods are provided for establishing a bi-directional communication link with an implantable medical device. The systems and methods include an implantable medical device (IMD) and an external instrument configured to establish a wireless bi-directional communication link there between over a wireless protocol. The wireless bi-directional communication link is established based on a scanning interval. The external instrument includes one or more processors electrically coupled to a radio frequency (RF) circuit and a memory device. The one or more processors are configured to define the scanning interval based on an advertising schedule received from the IMD.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: July 23, 2019
    Assignee: Pacesetter, Inc.
    Inventors: Heidi Hellman, Tejpal Singh, Yongjian Wu, Reza Shahandeh, Youjing Huang, Chao-Wen Young
  • Patent number: 10193826
    Abstract: A shared mesh comprises a mesh station. The mesh station is used to couple to at least a first core component and a second core component. The mesh station includes a logic unit. The mesh station is shared by at least the first core component and the second core component. A memory is coupled to the mesh station.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: January 29, 2019
    Assignee: INTEL CORPORATION
    Inventors: Bahaa Fahim, Yen-Cheng Liu, Chung-Chi Wang, Donald C. Soltis, Jr., Terry C. Huang, Tejpal Singh, Bongjin Jung, Nazar Syed Haider
  • Publication number: 20180332653
    Abstract: Systems and methods for managing bi-directional communication between an external device (ED) and an implantable medical device (IMD) are provided. The method comprises receiving an active ED configuration and a request for communications parameters to be used with the active ED configuration. The method further comprises identifying a pre-existing configuration, from a collection of pre-existing configurations that match the active ED configuration, the collection of pre-existing configurations having an associated collection of predefined parameter sets. The method further determines a resultant parameter set from the collection of predefined parameter sets based on the pre-existing configuration identified and returns the resultant parameter set in connection with the request, the resultant parameter set to be utilized by the ED for bi-directional communication with the IMD.
    Type: Application
    Filed: May 4, 2018
    Publication date: November 15, 2018
    Inventors: Taral Oza, Gabriel A. Mouchawar, Samir Shah, Tejpal Singh, John Stockton
  • Publication number: 20180295667
    Abstract: Systems and methods are provided for establishing a bi-directional communication link with an implantable medical device. The systems and methods include an implantable medical device (IMD) and an external instrument configured to establish a wireless bi-directional communication link there between over a wireless protocol. The wireless bi-directional communication link is established based on a scanning interval. The external instrument includes one or more processors electrically coupled to a radio frequency (RF) circuit and a memory device. The one or more processors are configured to define the scanning interval based on an advertising schedule received from the IMD.
    Type: Application
    Filed: June 8, 2018
    Publication date: October 11, 2018
    Inventors: Heidi Hellman, Tejpal Singh, Yongjian Wu, Reza Shahandeh, Youjing Huang, Chao-Wen Young
  • Patent number: 10021733
    Abstract: Systems and methods are provided for establishing a bi-directional communication link with an implantable medical device. The systems and methods include an implantable medical device (IMD) and an external instrument configured to establish a wireless bi-directional communication link there between over a wireless protocol. The wireless bi-directional communication link is established based on a scanning interval. The external instrument includes one or more processors electrically coupled to a radio frequency (RF) circuit and a memory device. The one or more processors are configured to define the scanning interval based on an advertising schedule received from the IMD.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: July 10, 2018
    Assignee: Pacesetter, Inc.
    Inventors: Heidi Hellman, Tejpal Singh, Yongjian Wu, Reza Shahandeh, Youjing Huang, Chao-Wen Young