Abstract: A method includes: receiving a packet in an optical domain, the packet including a data payload and a routing header indicative of a routing sequence for the data payload; reading a first bit of the routing header to make a routing decision for the data payload; stripping the first bit of the routing header in the optical domain to generate an updated routing header; and routing the data payload and the updated routing header based on the routing decision.

Abstract: A network packaging system can include a circuit board that includes a chip located substantially in a center of the board. A backplane is in communication with the chip and located along on a first edge of the circuit board. A plurality of connector ports are arranged along the perimeter of at least two other edges of the circuit board. A plurality of traces connects the plurality of connector ports to the chip. A support structure houses one or more circuit boards, with at least two sidewall surfaces of the support structure extending substantially orthogonal to and coextensive with each of the at least two edges of the circuit board. The support structure includes a plurality of apertures extending through the one or more surfaces spatially aligned with each of the plurality of connector ports.

Abstract: One example includes an apparatus that includes a plurality of input/output (I/O) ports and a body portion. The plurality of I/O ports can be arranged at a plurality of peripheral surfaces of the body portion. The body portion includes a solid dielectric material having a substantially constant index of refraction. The body portion also includes parallel planar surfaces spaced apart by and bounded by the plurality of peripheral surfaces. The solid dielectric material in the body portion can be writable via a laser-writing process to form an optical waveguide extending between a set of the plurality of I/O ports.

Abstract: One example includes an optical fiber interface. The interface includes a first substrate comprising a pair of opposing surfaces. The substrate includes an opening extending therethrough that defines an inner periphery. One surface of the opposing surfaces of the first substrate can be configured to be bonded to a given surface of a second substrate. The interface also includes a plurality of optical fibers secured to the other opposing surface of the first substrate and extending inwardly from a plurality of surfaces of the inner periphery at fixed locations to align the set of optical fibers to optical inputs/outputs (I/O) of an optical system chip that is coupled to the given surface of the second substrate and received through the opening.

Abstract: One example includes an optical interconnect device. The optical interconnect device includes a plurality of optical fiber ports coupled to a body portion. The optical interconnect device also includes a plurality of optical fibers that are secured within the body portion. A first portion of the plurality of optical fibers can extend from a first of the plurality of optical fiber ports to a second of the plurality of optical fiber ports, and a second portion of the plurality of optical fibers can extend from the first of the plurality of optical fiber ports to a third of the plurality of optical fiber ports.

Abstract: One example includes an apparatus that includes a plurality of input/output (I/O) ports and a body portion. The plurality of I/O ports can be arranged at a plurality of peripheral surfaces of the body portion. The body portion includes a solid dielectric material having a substantially constant index of refraction. The body portion also includes parallel planar surfaces spaced apart by and bounded by the plurality of peripheral surfaces. The solid dielectric material in the body portion can be writable via a laser-writing process to form an optical waveguide extending between a set of the plurality of I/O ports.

Abstract: One example includes an apparatus that includes a plurality of input/output (I/O) ports and a body portion. The plurality of I/O ports can be arranged at a plurality of peripheral surfaces of the body portion. The body portion includes a solid dielectric material having a substantially constant index of refraction. The body portion also includes parallel planar surfaces spaced apart by and bounded by the plurality of peripheral surfaces. The solid dielectric material in the body portion can be writable via a laser-writing process to form an optical waveguide extending between a set of the plurality of I/O ports.

Abstract: One example includes an optical port-shuffling module. The module includes a plurality of inputs to receive a respective plurality of optical signals. The module also includes a plurality of outputs to provide the respective plurality of optical signals from the optical port-shuffling module. The module further includes a plurality of total-internal-reflection (TIR) mirrors arranged in optical paths of at least a portion of the plurality of optical signals to reflect the at least a portion of the plurality of optical signals to at least a portion of the plurality of outputs to shuffle the plurality of optical signals between the plurality of inputs and the plurality of outputs.

Abstract: One example includes an apparatus that includes a plurality of input/output (I/O) ports and a body portion. The plurality of I/O ports can be arranged at a plurality of peripheral surfaces of the body portion. The body portion includes a solid dielectric material having a substantially constant index of refraction. The body portion also includes parallel planar surfaces spaced apart by and bounded by the plurality of peripheral surfaces. The solid dielectric material in the body portion can be writable via a laser-writing process to form an optical waveguide extending between a set of the plurality of I/O ports.

Abstract: One example includes an optical port-shuffling module. The module includes a plurality of inputs to receive a respective plurality of optical signals. The module also includes a plurality of outputs to provide the respective plurality of optical signals from the optical port-shuffling module. The module further includes a plurality of total-internal-reflection (TIR) mirrors arranged in optical paths of at least a portion of the plurality of optical signals to reflect the at least a portion of the plurality of optical signals to at least a portion of the plurality of outputs to shuffle the plurality of optical signals between the plurality of inputs and the plurality of outputs.

Abstract: One example includes an optical interconnect device. The optical interconnect device includes a plurality of optical fiber ports coupled to a body portion. The optical interconnect device also includes a plurality of optical fibers that are secured within the body portion. A first portion of the plurality of optical fibers can extend from a first of the plurality of optical fiber ports to a second of the plurality of optical fiber ports, and a second portion of the plurality of optical fibers can extend from the first of the plurality of optical fiber ports to a third of the plurality of optical fiber ports.

Abstract: One example includes an optical fiber interface. The interface includes a first substrate comprising a pair of opposing surfaces. The substrate includes an opening extending therethrough that defines an inner periphery. One surface of the opposing surfaces of the first substrate can be configured to be bonded to a given surface of a second substrate. The interface also includes a plurality of optical fibers secured to the other opposing surface of the first substrate and extending inwardly from a plurality of surfaces of the inner periphery at fixed locations to align the set of optical fibers to optical inputs/outputs (I/O) of an optical system chip that is coupled to the given surface of the second substrate and received through the opening.

Abstract: A network packaging system can include a circuit board that includes a chip located substantially in a center of the board. A backplane is in communication with the chip and located along on a first edge of the circuit board. A plurality of connector ports are arranged along the perimeter of at least two other edges of the circuit board. A plurality of traces connects the plurality of connector ports to the chip. A support structure houses one or more circuit boards, with at least two sidewall surfaces of the support structure extending substantially orthogonal to and coextensive with each of the at least two edges of the circuit board. The support structure includes a plurality of apertures extending through the one or more surfaces spatially aligned with each of the plurality of connector ports.

Abstract: Methods and apparatus for optical architectures are disclosed. An optical architecture includes first and second riser cards and first and second components carried by the first and second riser cards respectively. The optical architecture also includes a first matrix to fan-out a multi-bit optical input signal into first and second outbound signals, and first and second fiber optic cables to carry the first and second outbound signals to the first and second riser cards, respectively.

Abstract: An array of light beam emitter sections comprises: a substrate having a surface divided into an array of sections; and a grouping of light emitters disposed at each surface section and configured to emit light beams at different emission angles with respect to the surface. Also disclosed is apparatus for establishing optical communication channels between the array of light beam emitter sections and an array of light detectors. Further disclosed is a method of establishing optical communication channels between the array of light emitter sections and the array of light detectors by mapping at least one light emitter of each grouping with a light detector of the detector array to establish optical communication channels between the arrays based on the mappings.

Abstract: Methods and apparatus for optical architectures are disclosed. An optical architecture includes first and second riser cards and first and second components carried by the first and second riser cards respectively. The optical architecture also includes a first matrix to fan-out a multi-bit optical input signal into first and second outbound signals, and first and second fiber optic cables to carry the first and second outbound signals to the first and second riser cards, respectively.

Abstract: Systems are provided having, for example, at least first and second processing units, an optical bus system coupled to the at least first and second processing units, and an optical bus controller coupled to the optical bus system. The optical bus system includes a plurality of optical switches and each optical switch includes, for example, at least a first switch state for directing light in at least a first direction and a second switch state for directing light in at least a second direction. Methods for optical bus communication are also provided.

Abstract: A controllable optical ring resonator, a photonic system and a method of controlling an optical ring resonator employ control electrodes periodically spaced apart along a closed loop optical path of an optical waveguide. The controllable optical ring resonator includes the optical waveguide and a plurality of the periodically spaced control electrodes. The photonic system includes an input optical waveguide segment and the controllable optical ring resonator adjacent and optically coupled to the segment. The method includes providing the plurality of periodically spaced control electrodes, providing an optical signal within the optical path, and addressing one or more of the control electrodes to interact with the optical signal within the optical path.

Abstract: In one embodiment, an assembly having a first board, a second board, a fiber bundle, and at least one movable stage is provided. The fiber bundle has a first end and a second end, and the first end of the fiber bundle is attached to the first board first face. The movable stage has a second optical array provided thereon or therein. The movable stage is disposed on the second board such that the at least one motor steers the movable stage. The movable stage is steered such that the second optical array is aligned with the second end of the fiber bundle in a desired manner.

Abstract: Various embodiments of the present invention are directed to micro-electro-mechanical systems and photonic interconnects employing micro-electro-mechanical systems. One micro-electro-mechanical system embodiment of the present invention includes a lens structure and an actuator. The lens structure includes a substantially transparent membrane having a flexible, curved surface, and a reservoir holding fluid that is fluidly coupled to the membrane. The actuator system is operably coupled to the reservoir in order to exert pressure on the fluid to change the curvature of the membrane and the focal point of the lens structure.