Abstract: A micro-structured atomic source system is described herein. One system includes a silicon substrate, a dielectric diaphragm, wherein the dielectric diaphragm includes a heater configured to heat an atomic source substance, an intermediary material comprising a chamber configured to receive the atomic source substance, and a guide material configured to direct a flux of atoms from the atomic source substance.

Abstract: Apparatuses and systems for a die-integrated aspheric mirror are described herein. One apparatus includes an ion trap die including a number of ion locations and an aspheric mirror integrated with the ion trap die.

Abstract: Apparatuses and systems for a die-integrated aspheric mirror are described herein. One apparatus includes an ion trap die including a number of ion locations and an aspheric mirror integrated with the ion trap die.

Abstract: A micro-structured atomic source system is described herein. One system includes a silicon substrate, a dielectric diaphragm, wherein the dielectric diaphragm includes a heater configured to heat an atomic source substance, an intermediary material comprising a chamber configured to receive the atomic source substance, and a guide material configured to direct a flux of atoms from the atomic source substance.

Abstract: Apparatuses and systems for a die-integrated aspheric mirror are described herein. One apparatus includes an ion trap die including a number of ion locations and an aspheric mirror integrated with the ion trap die.

Abstract: A micro-structured atomic source system is described herein. One system includes a silicon substrate, a dielectric diaphragm, wherein the dielectric diaphragm includes a heater configured to heat an atomic source substance, an intermediary material comprising a chamber configured to receive the atomic source substance, and a guide material configured to direct a flux of atoms from the atomic source substance.

Abstract: A ring laser gyroscope comprises a block defining a hermetically sealed cavity for a ring laser formed when a lasing medium disposed within the cavity is excited. A cathode and an anode are attached to the block at two fill positions comprised within the cavity, and exposed to the lasing medium such that the lasing medium is ionized when a high voltage pulse is supplied across cathode and anode. At least two RF electrodes are attached to the block, positioned on opposing sides to generate a capacitive discharge for the purpose of keeping the lasing medium excited. The gyro comprises a matching circuit to tune the frequency of a radio frequency (RF) signal generated by a RF power source before the RF signal is sent to the electrodes. The matching circuit is coupled to the RF electrodes via respective lead wires, and comprises an element matching network.

Abstract: A micro-structured atomic source system is described herein. One system includes a silicon substrate, a dielectric diaphragm, wherein the dielectric diaphragm includes a heater configured to heat an atomic source substance, an intermediary material comprising a chamber configured to receive the atomic source substance, and a guide material configured to direct a flux of atoms from the atomic source substance.

Abstract: A micro-structured atomic source system is described herein. One system includes a silicon substrate, a dielectric diaphragm, wherein the dielectric diaphragm includes a heater configured to heat an atomic source substance, an intermediary material comprising a chamber configured to receive the atomic source substance, and a guide material configured to direct a flux of atoms from the atomic source substance.

Abstract: Apparatuses and systems for a die-integrated aspheric mirror are described herein. One apparatus includes an ion trap die including a number of ion locations and an aspheric mirror integrated with the ion trap die.

Abstract: A micro-structured atomic source system is described herein. One system includes a silicon substrate, a dielectric diaphragm, wherein the dielectric diaphragm includes a heater configured to heat an atomic source substance, an intermediary material comprising a chamber configured to receive the atomic source substance, and a guide material configured to direct a flux of atoms from the atomic source substance.

Abstract: A ring laser gyroscope comprises a block defining a hermetically sealed cavity for a ring laser formed when a lasing medium disposed within the cavity is excited. A cathode and an anode are attached to the block at two fill positions comprised within the cavity, and exposed to the lasing medium such that the lasing medium is ionized when a high voltage pulse is supplied across cathode and anode. At least two RF electrodes are attached to the block, positioned on opposing sides to generate a capacitive discharge for the purpose of keeping the lasing medium excited. The gyro comprises a matching circuit to tune the frequency of a radio frequency (RF) signal generated by a RF power source before the RF signal is sent to the electrodes. The matching circuit is coupled to the RF electrodes via respective lead wires, and comprises an element matching network.

Abstract: Systems and methods for a dual purpose getter container are provided. In certain embodiments, an atomic sensor device comprises a sensor body, the sensor body enclosing an atomic sensor; a getter container coupled to an opening in the sensor body, wherein a first opening in the getter container is coupled to the opening in the sensor body; and a second opening located on the getter container, wherein gas within the sensor body can pass through the second opening. Further, the device may include a getter enclosed within the getter container, the getter coating surfaces of the getter container, such that gas within the sensor body can enter the getter container and contact the getter.

Abstract: One embodiment is directed towards a physics package of an atomic sensor. The physics package includes a frame composed of metal and including a plurality of slender support members extending between one another in a three dimensional structure. The support members define boundaries between adjacent apertures defined in the frame. The plurality of support members include a plurality of mounting surfaces adjacent to the apertures. The physics package also includes a plurality of panes attached to the mounting surfaces of the frame. The plurality of panes cover the apertures such that the frame and the plurality of panes define a vacuum chamber and provide three light paths that cross within the vacuum chamber at 90 degree angles with respect to one another. The physics package also includes a chamber evacuation structure for evacuating the vacuum chamber.

Abstract: Systems for determining differential and average temperatures from resistive temperature devices are provided. In one embodiment, a device comprises a bridge network including a first node and second node, wherein the first node receives a constant current from a current source; a first branch coupled between a first node and a second node, the first branch including a first temperature sensing element of a first resistive temperature device; a second branch coupled in parallel with the first branch between the first node and the second node, the second branch including a second temperature sensing element of a second resistive temperature device; a first output that provides a signal representing a difference between a voltage developed across the first temperature sensing element and a voltage developed across the second temperature sensing element; and a second output that provides a signal representing a voltage developed across first node and the second node.

Abstract: A temperature sensor package includes a temperature sensor having a first side and a second side, wherein the first side of the temperature sensor includes an active region configured for coupling with a target area for temperature measurement of an object. The temperature sensor package further includes a circuit board having a first side and a second side, the first side of the circuit board coupled to the second side of the temperature sensor, wherein the circuit board provides thermal insulation between the active region of the temperature sensor and an environment on the second side of the circuit board.

Abstract: Embodiments of the present invention provide improved systems and methods for external frit mounted components on a sensor device. In one embodiment, a method for fabricating a sensor device comprises securing at least one component stack on a sensor body over at least one opening in the sensor body, wherein the at least one component stack comprises a plurality of components and applying a frit to the plurality of components in the at least one component stack and the sensor body. The method further comprises heating the frit, the at least one component stack, and the sensor body such that the frit melts and cooling the frit, the at least one component stack, and the sensor body such that the at least one component stack is secured to the sensor body.

Abstract: A method of forming a physics package for an atomic sensor comprises providing an expendable support structure having a three-dimensional configuration, providing a plurality of optical panels, and assembling the optical panels on the expendable support structure such that edges of adjacent panels are aligned with each other. The edges of adjacent panels are sealed together to form a physics block having a multifaced geometric configuration. The expendable support structure is then removed while leaving the physics block intact.

Abstract: A vacuum chamber assembly includes a vacuum chamber containing a reactive material, an inlet fill tube fixedly attached to the vacuum chamber, and an outlet fill tube fixedly attached to the vacuum chamber. The inlet fill tube has a first vacuum tight seal and the outlet fill tube has a second vacuum tight seal.

Abstract: A method of forming a physics package for an atomic sensor comprises providing an expendable support structure having a three-dimensional configuration, providing a plurality of optical panels, and assembling the optical panels on the expendable support structure such that edges of adjacent panels are aligned with each other. The edges of adjacent panels are sealed together to form a physics block having a multifaced geometric configuration. The expendable support structure is then removed while leaving the physics block intact.