Abstract: A method of forming a physics package for an atomic sensor comprises providing a plurality of panels, with each of the panels having multiple edges, and assembling the panels in a three-dimensional multi-faced geometric configuration such that the edges of adjacent panels are aligned with each other. A sol-gel material is applied to the edges of the panels, and the sol-gel material is cured to hermetically seal adjacent panels together.

Abstract: Embodiments of the present invention provide improved systems and methods for external frit mounted components on a sensor device. In one embodiment, a method for fabricating a sensor device comprises securing at least one component stack on a sensor body over at least one opening in the sensor body, wherein the at least one component stack comprises a plurality of components and applying a frit to the plurality of components in the at least one component stack and the sensor body. The method further comprises heating the frit, the at least one component stack, and the sensor body such that the frit melts and cooling the frit, the at least one component stack, and the sensor body such that the at least one component stack is secured to the sensor body.

Abstract: A temperature sensor package includes a temperature sensor having a first side and a second side, wherein the first side of the temperature sensor includes an active region configured for coupling with a target area for temperature measurement of an object. The temperature sensor package further includes a circuit board having a first side and a second side, the first side of the circuit board coupled to the second side of the temperature sensor, wherein the circuit board provides thermal insulation between the active region of the temperature sensor and an environment on the second side of the circuit board.

Abstract: Systems for determining differential and average temperatures from resistive temperature devices are provided. In one embodiment, a device comprises a bridge network including a first node and second node, wherein the first node receives a constant current from a current source; a first branch coupled between a first node and a second node, the first branch including a first temperature sensing element of a first resistive temperature device; a second branch coupled in parallel with the first branch between the first node and the second node, the second branch including a second temperature sensing element of a second resistive temperature device; a first output that provides a signal representing a difference between a voltage developed across the first temperature sensing element and a voltage developed across the second temperature sensing element; and a second output that provides a signal representing a voltage developed across first node and the second node.

Abstract: A vacuum chamber assembly includes a vacuum chamber containing a reactive material, an inlet fill tube fixedly attached to the vacuum chamber, and an outlet fill tube fixedly attached to the vacuum chamber. The inlet fill tube has a first vacuum tight seal and the outlet fill tube has a second vacuum tight seal.

Abstract: Methods for the introduction of a reactive material into a vacuum chamber while minimizing or eliminating the simultaneous introduction of contaminating materials or substances. As a result, contaminating materials and substances that can interfere with any measurements or other processes that occur in the vacuum chamber are minimized or eliminated.

Abstract: Methods for the introduction of a reactive material into a vacuum chamber while minimizing or eliminating the simultaneous introduction of contaminating materials or substances. As a result, contaminating materials and substances that can interfere with any measurements or other processes that occur in the vacuum chamber are minimized or eliminated.