Abstract: [Object] To provide an optical connector and an optical connector set which are excellent in environment resistance and suitable for the use in medical instruments, an image pickup unit and an image pickup system that use the optical connector, and an optical transmission module. [Solving Means] An optical connector according to the present technology includes a lens support, a fiber ferrule, a lens, and a lens retainer. The lens support includes a through-hole. An optical fiber is connected to the fiber ferrule. The fiber ferrule is press-fitted in the through-hole. The lens is inserted into the through-hole. The lens retainer is press-fitted in the lens support and sandwiches the lens between the lens retainer and the fiber ferrule.

Abstract: [Object] To provide an optical connector and an optical connector set which are excellent in environment resistance and suitable for the use in medical instruments, an image pickup unit and an image pickup system that use the optical connector, and an optical transmission module. [Solving Means] An optical connector according to the present technology includes a lens support, a fiber ferrule, a lens, and a lens retainer. The lens support includes a through-hole. An optical fiber is connected to the fiber ferrule. The fiber ferrule is press-fitted in the through-hole. The lens is inserted into the through-hole. The lens retainer is press-fitted in the lens support and sandwiches the lens between the lens retainer and the fiber ferrule.

Abstract: An optical module includes an optical waveguide including a plurality of waveguide cores through which light propagates, a clad configured to trap the light in the waveguide cores, a plurality of fiber guide grooves in which optical fibers are inserted, the fiber guide grooves being arranged in parallel, and an adhesive spread groove configured to connect the fiber guide grooves and provided at leading ends of the fiber guide grooves with which the optical fibers contact; and a fixing member fixed to the optical waveguide with an adhesive while covering the fiber guide grooves. The fiber guide grooves have side walls including support projections configured to support, align, and optical couple the optical fibers to the waveguide cores, and adhesive recesses configured to define gaps between outer peripheral surfaces of the optical fibers and the fiber guide grooves so that the adhesive spreads in the gaps.

Abstract: An optical device includes: a multilayer structure substrate on which plural insulating layers are stacked and a wiring pattern is formed between layers; a recessed part for exposing the wiring pattern between the layers by cutting off a part of the multilayer structure substrate; an optical element mounted within the recessed part in electric conduction to the wiring pattern exposed by the recessed part; and an optical waveguide member forming an optical path for the optical element and guiding light along a surface of the multilayer structure substrate.

Abstract: An optical module includes an optical waveguide including a waveguide core through which light propagates and a clad configured to trap the light in the waveguide core, and a circuit board on which a surface-type optical element is mounted. The optical waveguide further includes a reflective surface from which an end face of the waveguide core is exposed, the reflective surface being provided on an inclined face at one end face of the optical waveguide core in an extending direction of the waveguide core, and an element mount opening provided in the clad such as to be opposite from the reflective surface, the element mount opening having a size such as to contain the optical element. The optical waveguide is mounted on the circuit board while the optical element is contained in the element mount opening and is aligned with the reflective surface of the optical waveguide.

Abstract: A vertical cavity surface emitting laser capable of reducing parasitic capacitance while suppressing power consumption, and a method of manufacturing thereof are provided. The vertical cavity surface emitting laser includes a columnar mesa including, on a substrate, a first multilayer reflector, an active layer, and a second multilayer reflector in order from the substrate side, and also including a current narrowing layer. The columnar portion of the mesa including the active layer and the current narrowing layer is formed within a region opposed to the first multilayer reflector and a region opposed to the second multilayer reflector, and a cross section area of the columnar portion is smaller than a cross section area of the second multilayer reflector.

Abstract: A vertical cavity surface emitting laser capable of reducing parasitic capacitance while suppressing power consumption, and a method of manufacturing thereof are provided. The vertical cavity surface emitting laser includes a columnar mesa including, on a substrate, a first multilayer reflector, an active layer, and a second multilayer reflector in order from the substrate side, and also including a current narrowing layer. The columnar portion of the mesa including the active layer and the current narrowing layer is formed within a region opposed to the first multilayer reflector and a region opposed to the second multilayer reflector, and a cross section area of the columnar portion is smaller than a cross section area of the second multilayer reflector.

Abstract: There is provided a laser diode capable of setting a mesa diameter small without use of a method which loses reliability of a device, and is not easily controlled. The laser diode includes: a columnar mesa including a first multilayer film reflecting mirror, an active layer, and a second multilayer film reflecting mirror in this order, including an oxide confined layer having an unoxidized region in middle of a plane, and having a cross-sectional shape in a plane direction different from a cross-sectional shape of the unoxidized region in a plane direction; and a plurality of metal electrodes formed in regions on a top face of the mesa not facing the unoxidized region.

Abstract: The present invention provides a semiconductor device realizing improved adhesion between a low-dielectric-constant material and a semiconductor material. The semiconductor device includes, on a semiconductor layer, an adhesion layer and a low-dielectric-constant material layer in order from the semiconductor layer side. The adhesion layer has a projection/recess structure, and the low-dielectric-constant material layer is formed so as to bury gaps in the projection/recess structure.

Abstract: An optical device and a method of making an optical device is described herein. The optical device comprises a housing, an optical element, a base structure that supports the optical element and that interfaces with the housing to form a gap section between an outer wall section of the base structure and an inner wall section of the housing, a resin within the gap section fixing the housing to the base structure, and a light accommodation section in the housing. The light accommodation section accommodates a transmittance of light to the resin within the gap section.

Abstract: A semiconductor light-emitting device includes a semiconductor light-emitting element including a first multilayer reflector, an active layer having a light-emitting region, and a second multilayer reflector in the stated order; a semiconductor light-detecting element disposed opposite the first multilayer reflector in relation to the semiconductor light-emitting element and including a light-absorbing layer configured to absorb light emitted from the light-emitting region; a transparent substrate disposed between the semiconductor light-emitting element and the semiconductor light-detecting element; a first metal layer having a first opening in a region including a region opposite the light-emitting region and bonding the semiconductor light-emitting element and the substrate; and a second metal layer having a second opening in a region including a region opposite the light-emitting region and bonding the semiconductor light-detecting element and the substrate.

Abstract: A vertical cavity surface emitting laser capable of reducing parasitic capacitance while suppressing power consumption, and a method of manufacturing thereof are provided. The vertical cavity surface emitting laser includes a columnar mesa including, on a substrate, a first multilayer reflector, an active layer, and a second multilayer reflector in order from the substrate side, and also including a current narrowing layer. The columnar portion of the mesa including the active layer and the current narrowing layer is formed within a region opposed to the first multilayer reflector and a region opposed to the second multilayer reflector, and a cross section area of the columnar portion is smaller than a cross section area of the second multilayer reflector.

Abstract: A semiconductor light-emitting device includes a semiconductor light-emitting element including a first multilayer reflector, an active layer having a light-emitting region, and a second multilayer reflector in the stated order; a semiconductor light-detecting element disposed opposite the first multilayer reflector in relation to the semiconductor light-emitting element and including a light-absorbing layer configured to absorb light emitted from the light-emitting region; a transparent substrate disposed between the semiconductor light-emitting element and the semiconductor light-detecting element; a first metal layer having a first opening in a region including a region opposite the light-emitting region and bonding the semiconductor light-emitting element and the substrate; and a second metal layer having a second opening in a region including a region opposite the light-emitting region and bonding the semiconductor light-detecting element and the substrate.

Abstract: The present invention provides a semiconductor device realizing improved adhesion between a low-dielectric-constant material and a semiconductor material. The semiconductor device includes, on a semiconductor layer, an adhesion layer and a low-dielectric-constant material layer in order from the semiconductor layer side. The adhesion layer has a projection/recess structure, and the low-dielectric-constant material layer is formed so as to bury gaps in the projection/recess structure.

Abstract: An optical device includes: a multilayer structure substrate on which plural insulating layers are stacked and a wiring pattern is formed between layers; a recessed part for exposing the wiring pattern between the layers by cutting off a part of the multilayer structure substrate; an optical element mounted within the recessed part in electric conduction to the wiring pattern exposed by the recessed part; and an optical waveguide member forming an optical path for the optical element and guiding light along a surface of the multilayer structure substrate.

Abstract: An optical waveguide contains a core layer in which light is transferred, and a cladding layer that clads the core layer. The core layer has an inclined end surface across a direction where the core layer extends. The inclined end surface reflects light from the core layer to outside or light from the outside to the core layer. The cladding layer has an end portion that extends to the inclined surface of the core layer. The cladding layer includes a system that prevents an adhesive agent from flowing out.

Abstract: An optical module includes an optical waveguide including a waveguide core through which light propagates and a clad configured to trap the light in the waveguide core, and a circuit board on which a surface-type optical element is mounted. The optical waveguide further includes a reflective surface from which an end face of the waveguide core is exposed, the reflective surface being provided on an inclined face at one end face of the optical waveguide core in an extending direction of the waveguide core, and an element mount opening provided in the clad such as to be opposite from the reflective surface, the element mount opening having a size such as to contain the optical element. The optical waveguide is mounted on the circuit board while the optical element is contained in the element mount opening and is aligned with the reflective surface of the optical waveguide.

Abstract: An optical module includes an optical waveguide including a plurality of waveguide cores through which light propagates, a clad configured to trap the light in the waveguide cores, a plurality of fiber guide grooves in which optical fibers are inserted, the fiber guide grooves being arranged in parallel, and an adhesive spread groove configured to connect the fiber guide grooves and provided at leading ends of the fiber guide grooves with which the optical fibers contact; and a fixing member fixed to the optical waveguide with an adhesive while covering the fiber guide grooves. The fiber guide grooves have side walls including support projections configured to support, align, and optical couple the optical fibers to the waveguide cores, and adhesive recesses configured to define gaps between outer peripheral surfaces of the optical fibers and the fiber guide grooves so that the adhesive spreads in the gaps.

Abstract: An optical module has at least two optical elements mounted in parallel with each other. The module also has a first electrode pad which is formed between the paralleled optical elements and grounded to a ground potential and a second electrode pad which is arranged along a line that is intersected with a direction in which the optical elements are arranged, which faces the first electrode pad and is grounded to the ground potential. The module further has a conductive shield member which is connected to the first electrode pad and the second electrode pad and placed between electrical signal transmission paths each connected to the optical elements.

Abstract: An optical module has at least two optical elements mounted in parallel with each other. The module also has a first electrode pad which is formed between the paralleled optical elements and grounded to a ground potential and a second electrode pad which is arranged along a line that is intersected with a direction in which the optical elements are arranged, which faces the first electrode pad and is grounded to the ground potential. The module further has a conductive shield member which is connected to the first electrode pad and the second electrode pad and placed between electrical signal transmission paths each connected to the optical elements.