Abstract: A processing indicating device to improve the efficiency of processing on an object. The device includes a first communication unit which communicates information with a plurality of processing devices for processing the object and a second communication unit which communicates information with a conveyance controlling device controlling conveying of the object to the plurality of processing devices. An arrival time predicting unit predicts on the basis of information received by the second communication unit, the time when the conveying device arrives at one of the processing devices. In addition, a finish time predicting unit receives information and predicts the time when the processing on the object in the one processing device finishes. A processing indicating unit causes processing control information that orders the execution of device state improvement treatment to be transmitted to the one processing device on the basis of the predicted respective times.

Abstract: Provided is an operation limiting device which makes it possible to achieve more robust security and safety in processing of a workpiece by a processing apparatus. The operation limiting device limits operations relating to processing of a workpiece by a processing apparatus, and is provided with: an authentication unit for authenticating each of a plurality of users; a receiving unit for receiving an operation request or permission for said operation, from a plurality of authenticated users; an operation enabling unit for enabling an operation if an operation request or permission has been received from the plurality of authenticated users; and a releasing unit for releasing the operation enabled state set by the operation enabling unit if processing relating to the operation has terminated or if a predetermined period of time corresponding to the operation has elapsed.

Abstract: A production efficiency improving apparatus includes a first communicating means for communicating information with a plurality of processing apparatuses that process objects, and a second communicating means for communicating conveyance control information, with a conveyance system comprising conveyance apparatuses for conveying the objects between the plurality of processing apparatuses. A means for predicting, on the basis of information communicated by the first communicating means, the conveying timing at which the processing apparatus needs to send out processed objects, and the conveying timing at which the processing apparatus needs to bring in unprocessed objects. A generating means generates the control information such that the conveyance apparatus will arrive at the processing apparatus that is the destination of the communication of information at the predicted timing predicted by the means for predicting.

Abstract: Provided is an operation limiting device which makes it possible to achieve more robust security and safety in processing of a workpiece by a processing apparatus. The operation limiting device limits operations relating to processing of a workpiece by a processing apparatus, and is provided with: an authentication unit for authenticating each of a plurality of users; a receiving unit for receiving an operation request or permission for said operation, from a plurality of authenticated users; an operation enabling unit for enabling an operation if an operation request or permission has been received from the plurality of authenticated users; and a releasing unit for releasing the operation enabled state set by the operation enabling unit if processing relating to the operation has terminated or if a predetermined period of time corresponding to the operation has elapsed.

Abstract: A processing indicating device to improve the efficiency of processing on an object. The device includes a first communication unit which communicates information with a plurality of processing devices for processing the object and a second communication unit which communicates information with a conveyance controlling device controlling conveying of the object to the plurality of processing devices. An arrival time predicting unit predicts on the basis of information received by the second communication unit, the time when the conveying device arrives at one of the processing devices. In addition, a finish time predicting unit receives information and predicts the time when the processing on the object in the one processing device finishes. A processing indicating unit causes processing control information that orders the execution of device state improvement treatment to be transmitted to the one processing device on the basis of the predicted respective times.

Abstract: A production efficiency improving apparatus includes a first communicating means for communicating information with a plurality of processing apparatuses that process objects, and a second communicating means for communicating conveyance control information, with a conveyance system comprising conveyance apparatuses for conveying the objects between the plurality of processing apparatuses. A means for predicting, on the basis of information communicated by the first communicating means, the conveying timing at which the processing apparatus needs to send out processed objects, and the conveying timing at which the processing apparatus needs to bring in unprocessed objects. A generating means generates the control information such that the conveyance apparatus will arrive at the processing apparatus that is the destination of the communication of information at the predicted timing predicted by the means for predicting.

Abstract: A carrying system 1 has a carrying path which is laid out in such a manner as to pass through the lower sides of loading table 11 and the like provided at the front face side of treating devices 10, 100, 200, and covered by a cover 5. As the carrying path is positioned below the loading tables, the occupying areas of the loading table 11 and the like and portions of the region of the carrying path are shared so that space saving is achieved, and the accessibility to the treating device 10, 100 or the like from the front side thereof is improved, thereby realizing a layout which facilitates maintenance. A loading surface 11d or the like of the loading table 11 is set to a height which allows a conventional overhead-type carrying system 2 and unmanned carrying vehicle 3 of a floor-type carrying system to load an object on the loading surface, thereby ensuring the co-existence with the other carrying systems.

Abstract: The present invention provides a semiconductor device manufacturing line for applying a series of processes on a semiconductor substrate, and forming an integrated circuit on the semiconductor substrate by employing a semiconductor wafer having a diameter of 6 inches (150±3 mm: SEAJ specification) or less for the semiconductor substrate. This manufacturing line comprises two sub-lines conforming to the same specifications, each of these sub-lines is composed of a series of processing units including a film forming unit, a pattern exposure unit, an etching unit, and a test unit. In at least one pattern exposure unit and one etching unit, fine processing of 0.3 ?m or less can be performed.

Abstract: A carrying system 1 has a carrying path which is laid out in such a manner as to pass through the lower sides of loading table 11 and the like provided at the front face side of treating devices 10, 100, 200, and covered by a cover 5. As the carrying path is positioned below the loading tables, the occupying areas of the loading table 11 and the like and portions of the region of the carrying path are shared so that space saving is achieved, and the accessibility to the treating device 10, 100 or the like from the front side thereof is improved, thereby realizing a layout which facilitates maintenance. A loading surface 11d or the like of the loading table 11 is set to a height which allows a conventional overhead-type carrying system 2 and unmanned carrying vehicle 3 of a floor-type carrying system to load an object on the loading surface, thereby ensuring the co-existence with the other carrying systems.

Abstract: There is provided a transfer apparatus capable of increasing the length of a transfer arm when it is extended, without increasing the size of the transfer arm when it is contracted. The transfer apparatus 4 comprising a transfer arm 17 which comprises: two rotating shafts 5 and 6 arranged coaxially or in parallel; a pair of first arms 7 and 8, one end portions of which are fixed to the rotating shafts 5 and 6, respectively; a pair of second arms 10 and 11, one end portions of which are connected to the other end portions of the pair of first arms 7 and 8 by means of pins, respectively; and a holding portion 14 for holding an object w to be processed, the holding portion 14 being connected to each of the other end portions of the pair of second arms 10 and 11 by means of pins, wherein the second arms 10 and 11 cross each other.

Abstract: The present invention provides a semiconductor device manufacturing line for applying a series of processes on a semiconductor substrate, and forming an integrated circuit on the semiconductor substrate by employing a semiconductor wafer having a diameter of 6 inches (150±3 mm: SEAJ specification) or less for the semiconductor substrate. This manufacturing line comprises two sub-lines conforming to the same specifications, each of these sub-lines is composed of a series of processing units including a film forming unit, a pattern exposure unit, an etching unit, and a test unit. In at least one pattern exposure unit and one etching unit, fine processing of 0.3 ?m or less can be performed.

Abstract: The present invention provides a semiconductor device manufacturing line for applying a series of processes on a semiconductor substrate, and forming an integrated circuit on the semiconductor substrate by employing a semiconductor wafer having a diameter of 6 inches (150±3 mm: SEAJ specification) or less for the semiconductor substrate. This manufacturing line comprises two sub-lines conforming to the same specifications, each of these sub-lines is composed of a series of processing units including a film forming unit, a pattern exposure unit, an etching unit, and a test unit. In at least one pattern exposure unit and one etching unit, fine processing of 0.3 ?m or less can be performed.

Abstract: The present invention provides a semiconductor device manufacturing line for applying a series of processes on a semiconductor substrate, and forming an integrated circuit on the semiconductor substrate by employing a semiconductor wafer having a diameter of 6 inches (150±3 mm: SEAJ specification) or less for the semiconductor substrate. This manufacturing line comprises two sub-lines conforming to the same specifications, each of these sub-lines is composed of a series of processing units including a film forming unit, a pattern exposure unit, an etching unit, and a test unit. In at least one pattern exposure unit and one etching unit, fine processing of 0.3 ?m or less can be performed.

Abstract: Two load lock chambers 130 and 132 are arranged between a first transfer chamber 122 and a second transfer chamber 133. Each of the load lock chambers is capable of accommodating a single wafer W. The first transfer chamber 122 is provided with a first transfer unit 124 having two substrate holders 124a, 124b each capable of holding a single object to be processed, in order to transport the wafer W among a load port site 120, the first load lock chamber 130, the second load lock chamber 132 and a positioning unit 150. The second transfer chamber 133 is provided with a second transfer unit 156 having two substrate holders 156a, 156b each capable of holding the single object to be processed, in order to transport the wafer between the first load lock chamber 130, the second load lock chamber 132 and respective vacuum processing chambers 158 to 164. Since the volume of each load lock chamber can be minimized, it is possible to perform the prompt control of atmospheres in the load lock chambers.

Abstract: There is provided a transfer apparatus capable of increasing the length of a transfer arm when it is extended, without increasing the size of the transfer arm when it is contracted. The transfer apparatus 4 comprising a transfer arm 17 which comprises: two rotating shafts 5 and 6 arranged coaxially or in parallel; a pair of first arms 7 and 8, one end portions of which are fixed to the rotating shafts 5 and 6, respectively; a pair of second arms 10 and 11, one end portions of which are connected to the other end portions of the pair of first arms 7 and 8 by means of pins, respectively; and a holding portion 14 for holding an object w to be processed, the holding portion 14 being connected to each of the other end portions of the pair of second arms 10 and 11 by means of pins, wherein the second arms 10 and 11 cross each other.

Abstract: Two load lock chambers 130 and 132 are arranged between a first transfer chamber 122 and a second transfer chamber 133. Each of the load lock chambers is capable of accommodating a single wafer W. The first transfer chamber 122 is provided with a first transfer unit 124 having two substrate holders 124a, 124b each capable of holding a single object to be processed, in order to transport the wafer W among a load port site 120, the first load lock chamber 130, the second load lock chamber 132 and a positioning unit 150. The second transfer chamber 133 is provided with a second transfer unit 156 having two substrate holders 156a, 156b each capable of holding the single object to be processed, in order to transport the wafer between the first load lock chamber 130, the second load lock chamber 132 and respective vacuum processing chambers 158 to 164. Since the volume of each load lock chamber can be minimized, it is possible to perform the prompt control of atmospheres in the load lock chambers.

Abstract: Two load lock chambers 130 and 132 are arranged between a first transfer chamber 122 and a second transfer chamber 133. Each of the load lock chambers is capable of accommodating a single wafer W. The first transfer chamber 122 is provided with a first transfer unit 124 having two substrate holders 124a, 124b each capable of holding a single object to be processed, in order to transport the wafer W among a load port site 120, the first load lock chamber 130, the second load lock chamber 132 and a positioning unit 150. The second transfer chamber 133 is provided with a second transfer unit 156 having two substrate holders 156a, 156b each capable of holding the single object to be processed, in order to transport the wafer between the first load lock chamber 130, the second load lock chamber 132 and respective vacuum processing chambers 158 to 164. Since the volume of each load lock chamber can be minimized, it is possible to perform the prompt control of atmospheres in the load lock chambers.

Abstract: A drive mechanism provides a friction free movement of a movable member operated under a negative pressure environment. A gas bearing arrangement movably supports the movable element relative to a stationary element. The gas bearing arrangement is configured to be operated under the negative pressure environment inside the chamber. A drive arrangement drives the movable element from outside the chamber.

Abstract: A wafer processing system comprises a container-housing chamber for housing the conveying container conveyed from the common area, a cleaning chamber disposed adjacent to the container-housing chamber, and a load-lock chamber disposed adjacent to the cleaning chamber. The cleaning chamber has an inlet line for introducing a clean gas into the cleaning chamber and a pressure control means for controlling the pressure in the cleaning chamber. The load-lock chamber has a conveying unit capable of extending to the container-housing chamber through the cleaning chamber, in order to take out the object from the conveying container housed in the container-housing chamber to the load-lock chamber through the cleaning chamber.

Abstract: A transfer arm apparatus has first, second, and third arms. The second arm has a proximal link pivotally mounted on the distal end of the first arm, and first and second links connecting the proximal link and the third arm to constitute a link mechanism. The first and second links form a first pair of parallel links, and the proximal link and the third link form a second pair of parallel links connecting the first pair of parallel links. A transmission is contained in the first arm, and has an axial shaft and a hollow axial shaft coaxially arranged at the distal end of the first arm. The axial shaft transmits a rotational driving force to the first pair of parallel links, and the hollow axial shaft transmits a rotational driving force to the second pair of parallel links through the proximal link.