Abstract: A plurality of projections 21 is disposed on a inner surface of a lid 20 which is detachably attached to a carrier body 10. Each projection 21 has a tapered end part 22 with inclined surfaces 23, 24. The surfaces 23, 24 are in the form of semitransparent mirror. A Light emitting device 47 projects light beam which travels horizontally to the projection 21 from outside of the lid 20. When a wafer is not present in slots 15 of the carrier body, the light beam travels to upper and lower adjacent photoelectric devices 48, 48 via the upper and lower adjacent projections 21. The semitransparent mirror 23, 24 changes the light beam traveling direction. When the wafer is present in the slots 15, the light beam is intercepted by the wafer, and the photoelectric devices 48 does not receive the light beam. In aforementioned manner, whether a wafer is present or not in the slots 15 can be detected.

Abstract: A relay apparatus according to the invention is provided for transferring to-be-treated objects between a transfer mechanism for carrying the objects into and out of a treatment chamber, and a cassette containing the objects. The relay apparatus comprises a transfer unit including holding portions for each holding a corresponding one of the objects from below, the transfer unit transferring the objects between the cassette and a transfer position at which the objects are transferred to the transfer mechanism, while holding the object with the holding portions, and a stopper located in the transfer position for adjusting positions of edge portions of all the objects held by the holding portions of the transfer means, thereby preventing the objects from moving horizontally relative to the holding portions.

Abstract: The cassette transfer mechanism of the present invention comprises a cassette chamber for housing a cassette storing a plurality of substrates, a liftable stand capable of moving up and down in the cassette chamber, a cassette holder having a bottom-surface supporting portion for supporting a bottom-surface of the cassette and a back-surface supporting portion for supporting a back-surface of the cassette, and a moving mechanism provided outside the cassette chamber and rotatably supporting the cassette holder, for moving the cassette holder between a waiting position outside the cassette chamber and the liftable stand inside the cassette chamber, wherein the moving mechanism has rotation mechanism for rotating the cassette holder around an axis crossed virtually in perpendicular to an axis extending along the moving direction of the liftable stand.

Abstract: Vacuum process chambers are increased or decreased in number when the kind or order of processes is changed, and the shape and size of the transfer chamber are changed with the increase or decrease of the number of the vacuum process chambers, without entailing any change in a load-lock chamber and a transfer arm. The transfer arm has a minimum radius of rotation such that the arm can rotate in a transfer chamber of a minimum size corresponding to a minimum number of vacuum process chambers and a maximum arm reach such that the arm can deliver an object to-be-treated between each vacuum process chamber and a transfer chamber of a maximum size corresponding to a maximum number of vacuum process chambers. Thus, even though the number of the vacuum process chambers are increased or decreased with the change of the processes, it is necessary only that the shape and size of the transfer chamber be changed, and the other components, such as the load-lock chamber, transfer arm, etc.

Abstract: A cassette chamber according to the present invention comprises a housing defining a space stored with a cassette for holding a plurality of objects of treatment, a lift base having a rotatable shaft and located in the housing for up-and-down motion, an auxiliary base fixed to the shaft and inclined at a predetermined angle to the longitudinal direction of the shaft, a cassette support having a bottom support portion set on the lift base and bearing the bottom face of the cassette and a back support portion rotatably supported by the auxiliary base and bearing the back face of the cassette, a rotation mechanism for rotating the shaft as the lift base ascends or descends, thereby rotating the auxiliary base and the cassette support between a first position inside the housing and a second position outside the housing, and a support section for keeping the back support portion of the cassette support parallel to the shaft by engaging the back support portion being rotated to the second position by the rotation m

Abstract: A communication method and apparatus for performing communication between a master device and a plurality of slave devices, prepares, in the master device, the address data of a destination and operation command data to be transmitted to the destination, serially transmits the address data and the operation command data to the plurality of slave devices via the communication path, and executes an operation in accordance with the operation command data in at least one of the slave devices which is designated by the address data. The above operations are all performed in one bus cycle of the master side controller.

Abstract: The plasma etching apparatus for a semiconductor wafer includes a susceptor provided in the vacuum process chamber. An electrostatic chuck for attracting and holding the wafer is provided on the susceptor. The electrostatic chuck comprises a chuck electrode provided on the susceptor via an insulative layer. The chuck electrode is connected to the positive terminal of the DC power supply via a switch. The chuck electrode is coated with a resistive layer, and the wafer is placed directly on the resistive layer. The resistive layer exhibits an electric resistivity of 1.times.10.sup.10 .OMEGA..multidot.cm to 1.times.10.sup.12 .OMEGA..multidot.cm in a temperature range for etching. The resistive layer is formed to have such a surface roughness that a center line average hight falls within a range of 0.1 to 1.5 .mu.m.

Abstract: A load-lock unit is disposed between first and second atmospheres, for storing a wafer transferred from the first atmosphere, and which is blocked off from the first atmosphere, thereafter being set in an atmosphere at least substantially similar to the second atmosphere, and opened so as to communicate with the second atmosphere in order to transfer the wafer to the second atmosphere. The load-lock unit includes a load-lock chamber, a holding mechanism, disposed in the load-lock chamber for holding the wafer, a rotating mechanism for rotating the wafer held by the holding mechanism, and an error detecting mechanism for detecting a positional error of the center of the wafer and an orientation error of the wafer on the basis of data obtained by radiating light on the wafer which is rotating.

Abstract: A load-lock unit is disposed between first and second atmospheres, stores a wafer transferred from the first atmosphere, is blocked off from the first atmosphere, is thereafter set in the same atmosphere as or a similar atmosphere to the second atmosphere, and is opened to communicate with the second atmosphere in order to transfer the wafer to the second atmosphere. The load-lock unit includes a load-lock chamber, a storing device, disposed in the load-lock chamber, for storing a plurality of wafers vertically at a gap, a holding mechanism for holding one of the plurality of wafers stored in the storing device, a rotating mechanism for rotating the wafer held by the holding mechanism, and an error detecting device for detecting the positional error of the center of the wafer and an orientation error of the wafer on the basis of data obtained by radiating light on the wafer which is rotating.

Abstract: An ion injection device comprises a rotatable holding table for holding a semiconductor wafer, a rotary driving mechanism for rotating the holding table, and a detection device for detecting the position of the wafer. The holding table has a holding portion for electrostatically holding the wafer, and an electrode unit located below the holding portion substantially in parallel with an upper surface of the same. The holding portion is made of a dielectric member, and the electrode unit includes a plurality of electrodes separated from one another. The ion injection device further comprises a power source for applying voltage between the electrodes, a control device for controlling the application and interruption of voltage between the electrodes, and an ion injection unit for injecting ions into the wafer.

Abstract: A device for transferring a LCD substrate under a reduced pressure atmosphere comprises a first stage on which the LCD substrate is mounted such that the surface of the LCD substrate is substantially horizontal, a multi-joint arm mechanism for mounting the LCD substrate on a second stage of a delivery position after moving the first stage in substantially horizontal plane, a mechanism for pushing the LCD substrate on the first and second stages, and for positioning the LCD substrate at a home position.

Abstract: Load lock chambers having a function of detecting positional deviation of wafers are provided in a process chamber of an ion injection apparatus, two on a carrying-in side, and two on a carrying-out side. One load lock chamber on the carrying-in side and one on the carrying-out side are used as a standby. Carrying-in and carrying-out members are outside of the process chamber. Two transfer members are in the process chamber. A dummy wafer stage is formed at a position which can be accessed by the transfer members. Wafers are transferred from load stages by the carrying-in member via the load lock chambers to the process chamber through a double operation line. Loading a wafer on the turn table and unloading a wafer therefrom can be performed simultaneously by operations of the transfer members and. The wafers are similarly carried out of the apparatus in a double operation line. At this time, dummy wafers in the process chamber can be used, if necessary.

Abstract: A load-lock unit is disposed between first and second atmospheres, for storing a wafer transferred from the first atmosphere, and which is blocked off from the first atmosphere, thereafter being set in an atmosphere at least substantially similar to the second atmosphere, and opened so as to communicate with the second atmosphere in order to transfer the wafer to the second atmosphere. The load-lock unit includes a load-lock chamber, a holding mechanism, disposed in the load-lock chamber for holding the wafer, a rotating mechanism for rotating the wafer held by the holding mechanism, and an error detecting mechanism for detecting a positional error of the center of the wafer and an orientation error of the wafer on the basis of data obtained by radiating light on the wafer which is rotating.

Abstract: Load lock chambers having a function of detecting positional deviation of wafers are provided in a process chamber of an ion injection apparatus, two on a carrying-in side, and two on a carrying-out side. One load lock chamber on the carrying-in side and one on the carrying-out side are used as a standby. Carrying-in carrying-out members and are outside of the process chamber. Two transfer members are in the process chamber. A dummy wafer stage is formed at a position which can be accessed by the transfer members. Wafers are transferred from load stages by the carrying-in member via the load lock chambers to the process chamber through a double operation line. Loading a wafer on the turn table and unloading a wafer therefrom can be performed simultaneously by operations of the transfer members and. The wafers are similarly carried out of the apparatus in a double operation line. At this time, dummy wafers in the process chamber can be used, if necessary.

Abstract: A handling apparatus, used for handling a carrier of semiconductor wafers, comprises a first mechanism for transferring a carrier between a loader/unloader table and a storage compartment, and a second mechanism, for moving the first mechanism in both vertical and horizontal directions. The first mechanism includes an arm, a loading portion for loading the carrier, and an arm-rocking mechanism. The second mechanism moves the first mechanism to the loader/unloader table, picks up the carrier, and then moves the first mechanism to the storage compartment, where the arm is rocked, so as to discharge the object from the loading portion.

Abstract: A stock unit for carriers includes a stocker having shelves, for storing carriers containing semiconductor wafers, a mounting port on which the carriers are temporarily mounted, and a handler for transporting the carriers between the shelf and the mounting port.

Abstract: A plurality of coil sets are movably positioned in a plurality of magnetic fields which are arranged in a two-dimensional array. The magnetic fields periodically vary in strength and polarity along the two-dimensional array. The coil sets drive a loading table in the X and Y axes under the control of currents applied thereto.

Abstract: A device for positioning a semiconductor substrate is provided comprising magnetic field group formed from a plurality of magnetic fields disposed on a plane in a two-dimensional array. The magnetic fields are provided with a perpendicular orientation relative to the plane and adjacent magnetic fields are directed in alternate directions. Coil sets are formed of a plurality of coils, the coils having a specific dimensional relationship with the magnetic field array. Coil groups are formed by fixedly securing a plurality of these coil sets to each other the coil groups being disposed within the magnetic field group so as to be freely movable along the plane. Electric current is applied to the coils which generates a force in each coil set so as to move the coil set in either one of the longitudinal and lateral directions of the array of magnetic fields, whereby a current-motion converter and a driving device making use of the converter can be formed.

Abstract: A precision positioning device particularly adapted for use in a semiconductor manufacturing operation is provided which comprises a loading table, an armature and a two-dimensional current-motion converter having a magnetic field group and a first coil group. The magnetic field group is formed from a plurality of magnetic fields disposed on a plane in a two-dimensional array. The centers of the magnetic fields of the array are separated by an equal period. The magnetic fields of the array are disposed perpendicular to the plane and adjacent magnetic fields are directed in alternate directions. The first coil group comprises at least first, second, third and fourth coils having a fixed dimensional relationship. More particularly, each coil is provided with an outer dimension approximately equal to three halves of the magnetic fields and a coil width approximately equal to one-half of the period of the array.

Abstract: A first stage adapted to be moved in predetermined directions by a first driving device is provided in a machine base supported from a foundation by an intermediary of resilient means. This first stage is provided a second stage adapted to be moved in the directions at right angles to the directions of movement of the first stage by a second driving device. Upon movement of these respective stages, vibration of the machine base is excited by reaction forces exerted upon the machine base as a result of acceleration and deceleration. These reaction forces are offset by resistive forces generated by first and second force generators respectively. The first and second force generators establish an electromagnetic coupling between the foundation and the machine base.