Patents by Inventor Tetsuaki Inada
Tetsuaki Inada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11926893Abstract: Described herein is a technique capable of suppressing generation of particles by removing by-products in a groove of a high aspect ratio. According to one aspect of the technique, there is provided a substrate processing apparatus including: a process chamber in which a substrate is processed; and a substrate support provided in the process chamber and including a plurality of supports where the substrate is placed, wherein the process chamber includes a process region where a process gas is supplied to the substrate and a purge region where the process gas above the substrate is purged, and the purge region includes a first pressure purge region to be purged at a first pressure and a second pressure purge region to be purged at a second pressure higher than the first pressure.Type: GrantFiled: September 9, 2022Date of Patent: March 12, 2024Assignee: Kokusai Electric CorporationInventors: Naofumi Ohashi, Tetsuaki Inada
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Publication number: 20230274916Abstract: According to one aspect of the technique of the present disclosure, there is provided a seal structure capable of sealing a space between a first structure heated by a heater and a second structure arranged so as to face the first structure, the seal structure including: a metal plate arranged in contact with the first structure; and a sealing material made of a resin material and arranged in contact with the metal plate and the second structure, wherein the space between the first structure and the second structure is sealed by the metal plate and the sealing material.Type: ApplicationFiled: March 10, 2023Publication date: August 31, 2023Inventors: Takayuki SATO, Tetsuaki INADA, Kenta SASAKI
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Publication number: 20230245869Abstract: According to the present disclosure, there is provided a technique capable of efficiently heating a substrate with a light emitted from a lamp heater. According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process vessel at least a part of which is made of opaque quartz; a substrate mounting table provided in the process vessel or in a processing space communicating with an inside of the process vessel; a lamp heater provided at a position facing a substrate placing surface of the substrate mounting table; and a plasma generator provided at an outer periphery of the process vessel and configured to excite a gas in the process vessel by a plasma.Type: ApplicationFiled: December 22, 2022Publication date: August 3, 2023Inventors: Tetsuaki INADA, Takeshi YASUI
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Publication number: 20230230818Abstract: According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process vessel in which a substrate is processed; an outer vessel configured to cover an outer circumference of the process vessel; a gas flow path provided between the outer vessel and the outer circumference of the process vessel; an exhaust path in communication with the gas flow path; an adjusting valve configured to be capable of adjusting a conductance of the exhaust path; a first exhaust apparatus provided on the exhaust path downstream of the adjusting valve; a pressure sensor configured to measure an inner pressure of the outer vessel; and a controller configured to be capable of adjusting an exhaust volume flow rate of the first exhaust apparatus by controlling the first exhaust apparatus based on a pressure measured by the pressure sensor.Type: ApplicationFiled: March 13, 2023Publication date: July 20, 2023Applicant: Kokusai Electric CorporationInventors: Tetsuaki Inada, Junya Konishi, Masaki Murobayashi, Takeshi Yasui, Takeo Sato
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Publication number: 20230212753Abstract: According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process vessel in which a substrate is processed; an outer vessel configured to cover an outer circumference of the process vessel; a gas flow path provided between the outer vessel and the outer circumference of the process vessel; an exhaust path in communication with the gas flow path; an adjusting valve configured to be capable of adjusting a conductance of the exhaust path; a first exhaust apparatus provided on the exhaust path downstream of the adjusting valve; a pressure sensor configured to measure an inner pressure of the outer vessel; and a controller configured to be capable of adjusting an exhaust volume flow rate of the first exhaust apparatus by controlling the first exhaust apparatus based on a pressure measured by the pressure sensor.Type: ApplicationFiled: March 13, 2023Publication date: July 6, 2023Applicant: Kokusai Electric CorporationInventors: Tetsuaki INADA, Junya KONISHI, Masaki MUROBAYASHI, Takeshi YASUI, Takeo SATO
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Publication number: 20230207277Abstract: According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process vessel constituting a process chamber; a first gas supplier provided with a first supply port through which a first process gas is supplied; a second gas supplier provided with a second supply port through which a second process gas is supplied; a plasma generator provided along an outer circumference of the process vessel and configured to be capable of plasma-exciting the first process gas supplied into the process chamber; and a substrate mounting table on which a substrate is placed. The second supply port is provided at a supply pipe extending downward from a position in a ceiling surface of the process chamber located closer to a radial center of the process vessel than the first supply port, and is provided below the first supply port.Type: ApplicationFiled: February 21, 2023Publication date: June 29, 2023Applicant: Kokusai Electric CorporationInventors: Tetsuaki INADA, Takayuki Sato
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Publication number: 20230041284Abstract: Described herein is a technique capable of exhausting a process gas in a wide pressure range. According to one aspect of the technique, there is provided a substrate processing apparatus including: a process chamber; a gas supply system configured to supply a process gas containing a compound capable of reacting with a metal; and a gas exhaust system configured to exhaust an inner atmosphere of the process chamber, wherein the gas exhaust system includes: a common exhaust piping; a first exhaust piping made of a resin incapable of reacting with the compound and whose one end is connected to the common exhaust piping via a first valve and the other end is connected to a first exhauster; and a second exhaust piping made of the metal and whose one end is connected to the common exhaust piping via a second valve and the other end is connected to a second exhauster.Type: ApplicationFiled: October 12, 2022Publication date: February 9, 2023Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Tetsuaki INADA, Hideto TATENO
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Publication number: 20230002892Abstract: Described herein is a technique capable of suppressing generation of particles by removing by-products in a groove of a high aspect ratio. According to one aspect of the technique, there is provided a substrate processing apparatus including: a process chamber in which a substrate is processed; and a substrate support provided in the process chamber and including a plurality of supports where the substrate is placed, wherein the process chamber includes a process region where a process gas is supplied to the substrate and a purge region where the process gas above the substrate is purged, and the purge region includes a first pressure purge region to be purged at a first pressure and a second pressure purge region to be purged at a second pressure higher than the first pressure.Type: ApplicationFiled: September 9, 2022Publication date: January 5, 2023Inventors: Naofumi OHASHI, Tetsuaki INADA
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Patent number: 11499224Abstract: A technique capable of exhausting a process gas in a wide pressure range includes a substrate processing apparatus including: a process chamber; a gas supply system configured to supply a process gas containing a compound capable of reacting with a metal; and a gas exhaust system configured to exhaust an inner atmosphere of the process chamber, wherein the gas exhaust system includes: a common exhaust piping; a first exhaust piping made of a resin incapable of reacting with the compound and whose one end is connected to the common exhaust piping via a first valve and the other end is connected to a first exhauster; and a second exhaust piping made of the metal and whose one end is connected to the common exhaust piping via a second valve and the other end is connected to a second exhauster.Type: GrantFiled: July 20, 2020Date of Patent: November 15, 2022Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Tetsuaki Inada, Hideto Tateno
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Patent number: 11473196Abstract: Described herein is a technique capable of suppressing generation of particles by removing by-products in a groove of a high aspect ratio. According to one aspect of the technique, there is provided a substrate processing apparatus including: a process chamber in which a substrate is processed; and a substrate support provided in the process chamber and including a plurality of supports where the substrate is placed, wherein the process chamber includes a process region where a process gas is supplied to the substrate and a purge region where the process gas above the substrate is purged, and the purge region includes a first pressure purge region to be purged at a first pressure and a second pressure purge region to be purged at a second pressure higher than the first pressure.Type: GrantFiled: September 4, 2020Date of Patent: October 18, 2022Assignee: Kokusai Electric CorporationInventors: Naofumi Ohashi, Tetsuaki Inada
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Publication number: 20220230846Abstract: There is included a process container; a gas supply system; and a coil provided with a section between a first grounding point and a second grounding point of the coil so as to be spirally wound a plurality of times along an outer periphery of the process container, wherein the coil is configured so that a coil separation distance, which is a distance from an inner periphery of the coil to an inner periphery of the process container, in a partial section of a first winding section, which is a section where the coil winds once along the outer periphery of the process container in a direction from the first grounding point toward the second grounding point, is longer than a coil separation distance in another partial section of the first winding section continuous with the partial section of the first winding section.Type: ApplicationFiled: January 14, 2022Publication date: July 21, 2022Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Takeshi YASUI, Tetsuaki INADA, Masaki MUROBAYASHI
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Publication number: 20220139760Abstract: According to one aspect of the technique in the disclosure, there is provided a substrate processing apparatus including: a process chamber in which a substrate is accommodated; a susceptor configured to support the substrate in the process chamber; and a susceptor cover provided on an upper surface of the susceptor, wherein the susceptor includes: a heating element; and a first through-hole located so as to avoid the heating element, and the susceptor cover includes a second through-hole communicating with the first through-hole and having a diameter greater than a diameter of the first through-hole.Type: ApplicationFiled: January 21, 2022Publication date: May 5, 2022Applicant: Kokusai Electric CorporationInventors: Yasutoshi TSUBOTA, Takeshi YASUI, Tetsuaki INADA
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Publication number: 20220005678Abstract: Described herein is a technique capable of improving a heating efficiency for a substrate to be heated by a heater. According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process vessel defining a process chamber; a process gas supplier configured to supply a process gas into the process vessel; an electromagnetic field generation electrode extending along an outer peripheral surface of the process vessel while being spaced apart from the outer peripheral surface of the process vessel and configured to generate an electromagnetic field in the process vessel by being supplied with a high frequency power; a heater configured to radiate an infrared light to heat a substrate accommodated in the process chamber; and a reflector provided between the process vessel and the electromagnetic field generation electrode and configured to reflect the infrared light radiated from the heater.Type: ApplicationFiled: September 15, 2021Publication date: January 6, 2022Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Tetsuaki INADA, Takeshi YASUI
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Publication number: 20210301397Abstract: Described herein is a technique capable of suppressing generation of particles by removing by-products in a groove of a high aspect ratio. According to one aspect of the technique, there is provided a substrate processing apparatus including: a process chamber in which a substrate is processed; and a substrate support provided in the process chamber and including a plurality of supports where the substrate is placed, wherein the process chamber includes a process region where a process gas is supplied to the substrate and a purge region where the process gas above the substrate is purged, and the purge region includes a first pressure purge region to be purged at a first pressure and a second pressure purge region to be purged at a second pressure higher than the first pressure.Type: ApplicationFiled: September 4, 2020Publication date: September 30, 2021Inventors: Naofumi OHASHI, Tetsuaki INADA
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Patent number: 11035037Abstract: There is provided a substrate processing apparatus including a process chamber in which a substrate is accommodated, a processing gas supply system configured to introduce a processing gas containing hydrogen peroxide into the process chamber and an exhaust system configured to exhaust an interior of the process chamber, wherein at least one selected from the group of the process chamber, the processing gas supply system, and the exhaust system includes a metal member, the metal member exposed to the processing gas or a liquid generated by liquefying the processing gas is made of a material containing an iron element, and a surface of a plane of the metal members, which is exposed to the processing gas or the liquid, is formed of a layer containing iron oxide which is formed by performing a baking process on the metal member.Type: GrantFiled: February 6, 2019Date of Patent: June 15, 2021Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Tetsuaki Inada, Takuya Joda, Daisuke Hara
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Publication number: 20200347498Abstract: A technique capable of exhausting a process gas in a wide pressure range includes a substrate processing apparatus including: a process chamber; a gas supply system configured to supply a process gas containing a compound capable of reacting with a metal; and a gas exhaust system configured to exhaust an inner atmosphere of the process chamber, wherein the gas exhaust system includes: a common exhaust piping; a first exhaust piping made of a resin incapable of reacting with the compound and whose one end is connected to the common exhaust piping via a first valve and the other end is connected to a first exhauster; and a second exhaust piping made of the metal and whose one end is connected to the common exhaust piping via a second valve and the other end is connected to a second exhauster.Type: ApplicationFiled: July 20, 2020Publication date: November 5, 2020Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Tetsuaki INADA, Hideto TATENO
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Patent number: 10685832Abstract: There is provided a technique that includes a metal container including a process chamber configured to process a substrate, a substrate mounting plate rotatably installed in the container and having a plurality of substrate mounting surfaces circumferentially arranged at an upper surface thereof, a heater configured to heat the substrate mounted on each of the plurality of substrate mounting surfaces, a heat attenuator installed between the heater and the container, a gas supply part configured to supply a gas to the process chamber, and a support part configured to rotate the substrate mounting plate.Type: GrantFiled: August 30, 2019Date of Patent: June 16, 2020Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Tetsuaki Inada, Naofumi Ohashi, Shun Matsui
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Patent number: 10604839Abstract: A substrate processing apparatus, including: a processing chamber having a first and a second processing regions; a substrate mounting table rotatably installed in the processing chamber on which a substrate is mounted, and a rotation instrument configured to rotate the substrate mounting table such that the substrate passes through the first processing region and the second processing region in this order, at least one of the first and the second processing regions including: a gas supply part including a line-shaped opening portion extending in a radial direction of the substrate mounting table and configured to supply a gas from the opening portion into the region; and a gap holding member protruding from a ceiling of the processing chamber opposing the substrate, around the opening portion, toward the substrate such that a space on the substrate has a predetermined gap to serve as a passage of the supplied gas.Type: GrantFiled: August 14, 2015Date of Patent: March 31, 2020Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Tetsuaki Inada, Yuichi Wada, Mitsunori Ishisaka, Mitsuhiro Hirano, Sadayoshi Horii, Hideharu Itatani, Satoshi Takano, Motonari Takebayashi
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Publication number: 20190186000Abstract: There is provided a substrate processing apparatus including a process chamber in which a substrate is accommodated, a processing gas supply system configured to introduce a processing gas containing hydrogen peroxide into the process chamber and an exhaust system configured to exhaust an interior of the process chamber, wherein at least one selected from the group of the process chamber, the processing gas supply system, and the exhaust system includes a metal member, the metal member exposed to the processing gas or a liquid generated by liquefying the processing gas is made of a material containing an iron element, and a surface of a plane of the metal members, which is exposed to the processing gas or the liquid, is formed of a layer containing iron oxide which is formed by performing a baking process on the metal member.Type: ApplicationFiled: February 6, 2019Publication date: June 20, 2019Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Tetsuaki INADA, Takuya JODA, Daisuke HARA
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Patent number: D981970Type: GrantFiled: September 3, 2021Date of Patent: March 28, 2023Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Tetsuaki Inada, Takeshi Yasui