Substrate mounting plate for substrate processing apparatus

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Description

FIG. 1 is a front, top and right side perspective view of a substrate mounting plate for substrate processing apparatus showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view.

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a right side elevational view thereof; and,

FIG. 8 is a view take along line 8-8 in FIG. 2.

Claims

The ornamental design for a substrate mounting plate for substrate processing apparatus, as shown and described.

Referenced Cited
U.S. Patent Documents
D583394 December 23, 2008 Ota
D790041 June 20, 2017 Jang
D797067 September 12, 2017 Zhang
D825505 August 14, 2018 Hanson
D830981 October 16, 2018 Jeong
D868124 November 26, 2019 Riker
D869409 December 10, 2019 Riker
D877101 March 3, 2020 Johanson
D908645 January 26, 2021 Savandaiah
D937329 November 30, 2021 Riker
D940765 January 11, 2022 Gunther
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Patent History
Patent number: D981970
Type: Grant
Filed: Sep 3, 2021
Date of Patent: Mar 28, 2023
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventors: Tetsuaki Inada (Toyama), Takeshi Yasui (Toyama)
Primary Examiner: Shawn T Gingrich
Assistant Examiner: Caleb M Baker
Application Number: 29/806,527