Substrate mounting plate for substrate processing apparatus
Description
Claims
The ornamental design for a substrate mounting plate for substrate processing apparatus, as shown and described.
Referenced Cited
U.S. Patent Documents
D583394 | December 23, 2008 | Ota |
D790041 | June 20, 2017 | Jang |
D797067 | September 12, 2017 | Zhang |
D825505 | August 14, 2018 | Hanson |
D830981 | October 16, 2018 | Jeong |
D868124 | November 26, 2019 | Riker |
D869409 | December 10, 2019 | Riker |
D877101 | March 3, 2020 | Johanson |
D908645 | January 26, 2021 | Savandaiah |
D937329 | November 30, 2021 | Riker |
D940765 | January 11, 2022 | Gunther |
20100108500 | May 6, 2010 | Hawrylchak |
Patent History
Patent number: D981970
Type: Grant
Filed: Sep 3, 2021
Date of Patent: Mar 28, 2023
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventors: Tetsuaki Inada (Toyama), Takeshi Yasui (Toyama)
Primary Examiner: Shawn T Gingrich
Assistant Examiner: Caleb M Baker
Application Number: 29/806,527
Type: Grant
Filed: Sep 3, 2021
Date of Patent: Mar 28, 2023
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventors: Tetsuaki Inada (Toyama), Takeshi Yasui (Toyama)
Primary Examiner: Shawn T Gingrich
Assistant Examiner: Caleb M Baker
Application Number: 29/806,527
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)