Patents by Inventor Tetsuji Kadowaki

Tetsuji Kadowaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8128768
    Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.
    Type: Grant
    Filed: September 16, 2010
    Date of Patent: March 6, 2012
    Assignee: Fujitsu Limited
    Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
  • Publication number: 20110011514
    Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.
    Type: Application
    Filed: September 16, 2010
    Publication date: January 20, 2011
    Applicant: FUJITSU LIMITED
    Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
  • Patent number: 7819165
    Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.
    Type: Grant
    Filed: May 5, 2006
    Date of Patent: October 26, 2010
    Assignee: Fujitsu Limited
    Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
  • Publication number: 20100189625
    Abstract: [Problems] A carbon nanotube has a low apparent bulk density and therefore has serious problems in the workability upon use. Particularly when two or more types of carbon nanotubes are used together, the workability becomes more serious, and it is more difficult to exploit the properties of the carbon nanotubes. [Means for Solving the Problems] One or more types of carbon nanotubes are mixed and granulated. In this manner, it becomes possible to increase the apparent bulk density of a carbon nanotube, improve the workability of a carbon nanotube during the production of a resin master batch or a dispersion solution, and exploit the properties of a carbon nanotube satisfactorily.
    Type: Application
    Filed: July 11, 2008
    Publication date: July 29, 2010
    Applicant: MIKUNI SHIKISO KABUSHIKI KAISHA
    Inventors: Hideyuki Hisashi, Tetsuji Kadowaki, Takefumi Nagata
  • Patent number: 7703494
    Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.
    Type: Grant
    Filed: May 5, 2006
    Date of Patent: April 27, 2010
    Assignee: Fujitsu Limited
    Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
  • Patent number: 7681522
    Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.
    Type: Grant
    Filed: May 5, 2006
    Date of Patent: March 23, 2010
    Assignee: Fujitsu Limited
    Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
  • Patent number: 7621310
    Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.
    Type: Grant
    Filed: May 5, 2006
    Date of Patent: November 24, 2009
    Assignee: Fujitsu Limited
    Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
  • Patent number: 7513966
    Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.
    Type: Grant
    Filed: May 5, 2006
    Date of Patent: April 7, 2009
    Assignee: Fujitsu Limited
    Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
  • Patent number: 7476283
    Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.
    Type: Grant
    Filed: May 5, 2006
    Date of Patent: January 13, 2009
    Assignee: Fujitsu Limited
    Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
  • Publication number: 20080083439
    Abstract: A method for cleaning a laminated substrate fabrication apparatus that efficiently cleans a surface used to attract a substrate while enabling stable cleaning. A cleaning unit, which includes an attraction surface for attracting and holding the substrate, is arranged in a processing chamber to clean the attraction surface.
    Type: Application
    Filed: November 27, 2007
    Publication date: April 10, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Takanori Muramoto, Tetsuji Kadowaki, Yukio Takayama, Ken Tsuboi
  • Patent number: 7354494
    Abstract: An apparatus for manufacturing a laminated substrate with a simple structure and with satisfactory yield. First and second holding plates each attract substrates without contacting a laminating surface of the two substrates. A substrate conveying device conveys the substrates into the processing chamber. The substrate conveying device attracts only the surface of a substrate that is opposite to the laminating surface, transfers the substrate to a holding plate, and receives the substrate from the holding plate.
    Type: Grant
    Filed: September 8, 2004
    Date of Patent: April 8, 2008
    Assignee: Fujitsu Limited
    Inventors: Yoshimasa Miyajima, Ariyoshi Shibata, Joji Hasegawa, Tetsuji Kadowaki
  • Patent number: 7300532
    Abstract: A method for bonding a first substrate with a second substrate in a treatment chamber, wherein the treatment chamber accommodates a first holding unit that attracts the first substrate and a second holding unit that attracts the second substrate.
    Type: Grant
    Filed: October 12, 2005
    Date of Patent: November 27, 2007
    Assignee: Fujitsu Limited
    Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
  • Publication number: 20070235130
    Abstract: A laminated substrate manufacturing apparatus that seals an inner side of a seal frame into which liquid crystal is filled while reducing manufacturing deficiencies of laminated substrates. The substrate includes a first holding plate and a second holding plate for holding two substrates. A seal pressing device arranged on one of the first and second holding plates presses a seal formed between the substrates.
    Type: Application
    Filed: June 8, 2007
    Publication date: October 11, 2007
    Applicant: FUJITSU LIMITED
    Inventors: Joji Hasegawa, Takuya Ohno, Akiyoshi Ito, Tetsuji Kadowaki, Takanori Muramoto
  • Publication number: 20060221538
    Abstract: A method for cleaning a laminated substrate fabrication apparatus that efficiently cleans a surface used to attract a substrate while enabling stable cleaning. A cleaning unit, which includes an attraction surface for attracting and holding the substrate, is arranged in a processing chamber to clean the attraction surface.
    Type: Application
    Filed: October 13, 2005
    Publication date: October 5, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Takanori Muramoto, Tetsuji Kadowaki, Yukio Takayama, Ken Tsuboi
  • Publication number: 20060201629
    Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.
    Type: Application
    Filed: May 5, 2006
    Publication date: September 14, 2006
    Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
  • Publication number: 20060201603
    Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.
    Type: Application
    Filed: May 5, 2006
    Publication date: September 14, 2006
    Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
  • Publication number: 20060201424
    Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.
    Type: Application
    Filed: May 5, 2006
    Publication date: September 14, 2006
    Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
  • Publication number: 20060201627
    Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.
    Type: Application
    Filed: May 5, 2006
    Publication date: September 14, 2006
    Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
  • Publication number: 20060201617
    Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.
    Type: Application
    Filed: May 5, 2006
    Publication date: September 14, 2006
    Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
  • Publication number: 20060201628
    Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.
    Type: Application
    Filed: May 5, 2006
    Publication date: September 14, 2006
    Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki