Patents by Inventor Tetsuji Kadowaki
Tetsuji Kadowaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8128768Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: GrantFiled: September 16, 2010Date of Patent: March 6, 2012Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20110011514Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: September 16, 2010Publication date: January 20, 2011Applicant: FUJITSU LIMITEDInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7819165Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: GrantFiled: May 5, 2006Date of Patent: October 26, 2010Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20100189625Abstract: [Problems] A carbon nanotube has a low apparent bulk density and therefore has serious problems in the workability upon use. Particularly when two or more types of carbon nanotubes are used together, the workability becomes more serious, and it is more difficult to exploit the properties of the carbon nanotubes. [Means for Solving the Problems] One or more types of carbon nanotubes are mixed and granulated. In this manner, it becomes possible to increase the apparent bulk density of a carbon nanotube, improve the workability of a carbon nanotube during the production of a resin master batch or a dispersion solution, and exploit the properties of a carbon nanotube satisfactorily.Type: ApplicationFiled: July 11, 2008Publication date: July 29, 2010Applicant: MIKUNI SHIKISO KABUSHIKI KAISHAInventors: Hideyuki Hisashi, Tetsuji Kadowaki, Takefumi Nagata
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Patent number: 7703494Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.Type: GrantFiled: May 5, 2006Date of Patent: April 27, 2010Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7681522Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.Type: GrantFiled: May 5, 2006Date of Patent: March 23, 2010Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7621310Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.Type: GrantFiled: May 5, 2006Date of Patent: November 24, 2009Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7513966Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.Type: GrantFiled: May 5, 2006Date of Patent: April 7, 2009Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7476283Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.Type: GrantFiled: May 5, 2006Date of Patent: January 13, 2009Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20080083439Abstract: A method for cleaning a laminated substrate fabrication apparatus that efficiently cleans a surface used to attract a substrate while enabling stable cleaning. A cleaning unit, which includes an attraction surface for attracting and holding the substrate, is arranged in a processing chamber to clean the attraction surface.Type: ApplicationFiled: November 27, 2007Publication date: April 10, 2008Applicant: FUJITSU LIMITEDInventors: Takanori Muramoto, Tetsuji Kadowaki, Yukio Takayama, Ken Tsuboi
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Patent number: 7354494Abstract: An apparatus for manufacturing a laminated substrate with a simple structure and with satisfactory yield. First and second holding plates each attract substrates without contacting a laminating surface of the two substrates. A substrate conveying device conveys the substrates into the processing chamber. The substrate conveying device attracts only the surface of a substrate that is opposite to the laminating surface, transfers the substrate to a holding plate, and receives the substrate from the holding plate.Type: GrantFiled: September 8, 2004Date of Patent: April 8, 2008Assignee: Fujitsu LimitedInventors: Yoshimasa Miyajima, Ariyoshi Shibata, Joji Hasegawa, Tetsuji Kadowaki
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Patent number: 7300532Abstract: A method for bonding a first substrate with a second substrate in a treatment chamber, wherein the treatment chamber accommodates a first holding unit that attracts the first substrate and a second holding unit that attracts the second substrate.Type: GrantFiled: October 12, 2005Date of Patent: November 27, 2007Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20070235130Abstract: A laminated substrate manufacturing apparatus that seals an inner side of a seal frame into which liquid crystal is filled while reducing manufacturing deficiencies of laminated substrates. The substrate includes a first holding plate and a second holding plate for holding two substrates. A seal pressing device arranged on one of the first and second holding plates presses a seal formed between the substrates.Type: ApplicationFiled: June 8, 2007Publication date: October 11, 2007Applicant: FUJITSU LIMITEDInventors: Joji Hasegawa, Takuya Ohno, Akiyoshi Ito, Tetsuji Kadowaki, Takanori Muramoto
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Publication number: 20060221538Abstract: A method for cleaning a laminated substrate fabrication apparatus that efficiently cleans a surface used to attract a substrate while enabling stable cleaning. A cleaning unit, which includes an attraction surface for attracting and holding the substrate, is arranged in a processing chamber to clean the attraction surface.Type: ApplicationFiled: October 13, 2005Publication date: October 5, 2006Applicant: FUJITSU LIMITEDInventors: Takanori Muramoto, Tetsuji Kadowaki, Yukio Takayama, Ken Tsuboi
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Publication number: 20060201628Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: May 5, 2006Publication date: September 14, 2006Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20060201617Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: May 5, 2006Publication date: September 14, 2006Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20060201424Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: May 5, 2006Publication date: September 14, 2006Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20060201629Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: May 5, 2006Publication date: September 14, 2006Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20060201603Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: May 5, 2006Publication date: September 14, 2006Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20060201627Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: May 5, 2006Publication date: September 14, 2006Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki