Abstract: A barrier film is formed on a resin layer so as to include a missing part where a portion of the barrier film is missing in a central end region of the resin layer.

Abstract: In a non-flexible substrate (10) including a base layer (2), the base layer (2) includes a portion where a first resin layer (2a), an inorganic film (2b?), and a second resin layer (2c) are layered in this order, and at an end portion of the base layer (2), the second resin layer (2c) is formed in contact with a glass substrate (1).

Abstract: A barrier film is formed on a resin layer so as to include a missing part where a portion of the barrier film is missing in a central end region of the resin layer.

Abstract: In a bending region provided in a frame region, an opening is formed in an inorganic layered film, a plurality of residual layers of the inorganic layered film are provided in island shapes in a plan view in the opening, and a frame wiring line is disposed between the adjacent residual layers.

Abstract: Provided is an organic EL display device including a resin substrate layer, a TFT layer provided on the resin substrate layer, and a light-emitting element that is provided on the TFT layer and constitutes a display region. The resin substrate layer includes a first resin layer, an inorganic layer, and a second resin layer, which are provided in that order from a side opposite to the TFT layer. The interior of the first resin layer contains a plurality of air bubbles.

Abstract: In a case in which a curvature of a flexible organic EL display panel provided in a display device is zero, an absolute value of film stress of a first layered film, from a lower face film, formed in first regions in the flexible organic EL display panel is compressive stress and is greater than an absolute value of film stress of a second layered film, from the lower face film, formed in a second region.

Abstract: In a bending region in a frame region, a slit is formed in at least one inorganic film included in a TFT layer extending through the inorganic film and exposing an upper surface of a second resin film of a resin substrate layer, and at least one opening is formed in an inorganic insulating film of the resin substrate layer in the bending region. In the opening, a first resin film and the second resin film are in contact with one another.

Abstract: Included are the steps of: forming a laminated body (7) by disposing a resin layer (12), an inorganic layer (3) having mean stress (Px) of 0 (zero) or having tensile stress, a TFT layer (4), an OLED element layer (5), and a sealing layer (6) in this order on an upper side of a supporting substrate (50); and separating the supporting substrate (50) from the laminated body (7).

Abstract: An organic EL display device includes a reflective electrode and a transparent electrode disposed facing each other with an organic EL layer interposed therebetween. The reflective electrode includes a reflective film and a protection film formed on the reflective film, and the protection film includes a frame-shaped portion surrounding the periphery of the organic EL layer and an opening surrounded by the frame-shaped portion. This improves the reflectivity of the reflective electrode while protecting the reflective electrode.

Abstract: In a non-flexible substrate (10) including a base layer (2), the base layer (2) includes a portion where a first resin layer (2a), an inorganic film (2b?), and a second resin layer (2c) are layered in this order, and at an end portion of the base layer (2), the second resin layer (2c) is formed in contact with a glass substrate (1).

Abstract: A method of manufacturing a flexible display device, includes forming a base layer on a non-flexible substrate, the base layer including a first resin layer, an inorganic film, and a second resin layer, wherein the forming of the base layer includes a first step of forming the first resin layer inward from an end portion region of the non-flexible substrate, a second step of forming the inorganic film on the first resin layer such that the non-flexible substrate and/or the first resin layer is exposed, and a third step of forming the second resin layer in contact with the non-flexible substrate exposed from the inorganic film and/or the first resin layer exposed from the inorganic film, and the method further includes peeling the non-flexible substrate and bonding a flexible substrate to the first resin layer via an adhesive layer.

Abstract: In a display device, a through-hole and a surrounding region surrounding the through-hole are provided inside an edge of a display region, in which there are provided a first bypass wiring line formed in a first metal layer and bypassing the through-hole in the surrounding region, a first divided wiring line formed in the first metal layer and divided onto one side and the other side of the through-hole, a second bypass wiring line formed in a second metal layer and bypassing the through-hole in the surrounding region, and a second divided wiring line formed in the second metal layer and divided onto one side and the other side of the through-hole.

Abstract: Included are the steps of: forming a laminated body (7) by disposing a resin layer (12), an inorganic layer (3) having mean stress (Px) of 0 (zero) or having tensile stress, a TFT layer (4), an OLED element layer (5), and a sealing layer (6) in this order on an upper side of a supporting substrate (50); and separating the supporting substrate (50) from the laminated body (7).

Abstract: An organic EL display device includes a reflective electrode and a transparent electrode disposed facing each other with an organic EL layer interposed therebetween. The reflective electrode includes a reflective film and a protection film formed on the reflective film, and the protection film includes a frame-shaped portion surrounding the periphery of the organic EL layer and an opening surrounded by the frame-shaped portion. This improves the reflectivity of the reflective electrode while protecting the reflective electrode.

Abstract: In a bending region provided in a frame region, an opening is formed in an inorganic layered film, a plurality of residual layers of the inorganic layered film are provided in island shapes in a plan view in the opening, and a frame wiring line is disposed between the adjacent residual layers.

Abstract: A barrier film is formed on a resin layer so as to include a missing part where a portion of the barrier film is missing in a central end region of the resin layer.

Abstract: In a bending region in a frame region, a slit is formed in at least one inorganic film included in a TFT layer extending through the inorganic film and exposing an upper surface of a second resin film of a resin substrate layer, and at least one opening is formed in an inorganic insulating film of the resin substrate layer in the bending region. In the opening, a first resin film and the second resin film are in contact with one another.

Abstract: Provided is an organic EL display device including a resin substrate layer, a TFT layer provided on the resin substrate layer, and a light-emitting element that is provided on the TFT layer and constitutes a display region. The resin substrate layer includes a first resin layer, an inorganic layer, and a second resin layer, which are provided in that order from a side opposite to the TFT layer. The interior of the first resin layer contains a plurality of air bubbles.

Abstract: In a case in which a curvature of a flexible organic EL display panel provided in a display device is zero, an absolute value of film stress of a first layered film, from a lower face film, formed in first regions in the flexible organic EL display panel is compressive stress and is greater than an absolute value of film stress of a second layered film, from the lower face film, formed in a second region.

Abstract: A semiconductor device provided in a pixel circuit of a display device includes, in order from a lower side: a substrate; an LTPS layer; a first gate insulating layer; a first metal layer; a first flattened layer; a second gate insulating layer; an oxide semiconductor layer; a second metal layer; a passivation layer; and a third metal layer. The gate electrode layer of an LTPS-TFT and the gate electrode of an oxide semiconductor TFT are formed by the first metal layer.