Abstract: In a substrate bonding step of bonding an element original substrate to a counter original substrate through an intermediate layer so that a thin film element layer and a terminal group formed in the element original substrate face a second resin substrate layer formed in the counter original substrate, to manufacture a substrate bonded body, a terminal portion sealing member is formed in a frame shape surrounding the terminal group between the element original substrate and the counter original substrate.

Abstract: An organic electroluminescent display device includes a display region configured to display pixels; a frame region configured to surround the display region; a substrate; an organic electroluminescent element disposed on the substrate; a sealing member configured to cover the organic electroluminescent element; a lead wire disposed on the substrate and extending from a region covered with the sealing member to an outer side of the sealing member; and one or more organic insulators disposed within the frame region instead of within the display region. The lead wire includes two opposite side portions. The one organic insulator or each organic insulator covers part of at least one of the two side portions. The sealing member covers the one or more organic insulators.

Abstract: A method includes steps of (a) forming a substrate layer 10 above a support substrate 8 which is transparent, and then a thin-film element above the substrate layer 10; and (b) emitting laser beams La and Lb to a face of the support substrate 8 opposite to another face of the support substrate to which the substrate layer 10 and the thin-film element are formed, and delaminating the substrate layer 10 and the thin-film element from the support substrate 8. In step (b), the laser beams La and Lb are emitted from different directions.

Abstract: An organic electroluminescent display device includes a display region configured to display pixels; a frame region configured to surround the display region; a substrate; an organic electroluminescent element disposed on the substrate; a sealing member configured to cover the organic electroluminescent element; a lead wire disposed on the substrate and extending from a region covered with the sealing member to an outer side of the sealing member; and one or more organic insulators disposed within the frame region instead of within the display region. The lead wire includes two opposite side portions. The one organic insulator or each organic insulator covers part of at least one of the two side portions. The sealing member covers the one or more organic insulators.

Abstract: An organic electroluminescent display device includes a display region configured to display pixels; a frame region configured to surround the display region; a substrate; an organic electroluminescent element disposed on the substrate; a sealing member configured to cover the organic electroluminescent element; a lead wire disposed on the substrate and extending from a region covered with the sealing member to an outer side of the sealing member; and one or more organic insulators disposed within the frame region instead of within the display region. The lead wire includes two opposite side portions. The one organic insulator or each organic insulator covers part of at least one of the two side portions. The sealing member covers the one or more organic insulators.

Abstract: An organic electroluminescent display device includes a display region configured to display pixels; a frame region configured to surround the display region; a substrate; an organic electroluminescent element disposed on the substrate; a sealing member configured to cover the organic electroluminescent element; a lead wire disposed on the substrate and extending from a region covered with the sealing member to an outer side of the sealing member; and one or more organic insulators disposed within the frame region instead of within the display region. The lead wire includes two opposite side portions. The one organic insulator or each organic insulator covers part of at least one of the two side portions. The sealing member covers the one or more organic insulators.

Abstract: A drain electrode (17) includes (i) a lower drain electrode (17a) stacked on a semiconductor layer (14) so as to partially cover an upper surface of the semiconductor layer (14) and (ii) an upper drain electrode (17b). The semiconductor layer (14), the lower drain electrode (17a), and the upper drain electrode (17b) form steps. In a step part where the steps are formed, a distance between a periphery of the lower drain electrode (17a) and a periphery of the upper drain electrode (17b) is more than 0.4 ?m but less than 1.5 ?m.

Abstract: The present invention provides an etching liquid for a multilayer thin film containing a copper layer and a titanium layer, and a method of using it for etching a multilayer thin film containing a copper layer and a titanium layer, that is, an etching liquid for a multilayer thin film containing a copper layer and a titanium layer, which comprises (A) hydrogen peroxide, (B) nitric acid, (C) a fluoride ion source, (D) an azole, (E) a quaternary ammonium hydroxide and (F) a hydrogen peroxide stabilizer and has a pH of from 1.5 to 2.5, and a etching method of using it.

Abstract: An IZO layer (113) is formed on an a-ITO layer (112), and resist patterns (202R, 202G) having different film thicknesses are formed in at least sub-pixels (71R, 71G). The a-ITO layer (112) and the IZO layer (113) are etched by utilizing (i) a reduction in thickness of the resist patterns (202R, 202G) by ashing and (ii) a change in etching tolerance due to transformation from the a-ITO layer (112) into a p-ITO layer (114).

Abstract: An IZO layer (113) is formed on an a-ITO layer (112), and resist patterns (202R, 202G) having different film thicknesses are formed in at least sub-pixels (71R, 71G). The a-ITO layer (112) and the IZO layer (113) are etched by utilizing (i) a reduction in thickness of the resist patterns (202R, 202G) by ashing and (ii) a change in etching tolerance due to transformation from the a-ITO layer (112) into a p-ITO layer (114).

Abstract: An active matrix substrate (30) of the present invention includes a substrate, a gate line (50) formed on the substrate, and an interlayer insulating layer (90) for insulating a layer formed on the gate line (50) from the gate line (50). In a region of the substrate, the interlayer insulating layer (90) is not provided on an upper surface of the gate line (50), and therefore, the upper surface is exposed. On the other hand, the insulating layer (90) is provided on the substrate so as to have contact with at least an edge face of the gate line (50) which edge face is on an extension of a longitudinal direction of the gate line (50).

Abstract: A drain electrode (17) includes (i) a lower drain electrode (17a) stacked on a semiconductor layer (14) so as to partially cover an upper surface of the semiconductor layer (14) and (ii) an upper drain electrode (17b). The semiconductor layer (14), the lower drain electrode (17a), and the upper drain electrode (17b) form steps. In a step part where the steps are formed, a distance between a periphery of the lower drain electrode (17a) and a periphery of the upper drain electrode (17b) is more than 0.4 ?m but less than 1.5 ?m.

Abstract: The present invention provides an etching liquid for a multilayer thin film containing a copper layer and a titanium layer, and a method of using it for etching a multilayer thin film containing a copper layer and a titanium layer, that is, an etching liquid for a multilayer thin film containing a copper layer and a titanium layer, which comprises (A) hydrogen peroxide, (B) nitric acid, (C) a fluoride ion source, (D) an azole, (E) a quaternary ammonium hydroxide and (F) a hydrogen peroxide stabilizer and has a pH of from 1.5 to 2.5, and a etching method of using it.

Abstract: A connecting terminal has a configuration in which a plurality of parts of a first line (2) and respective corresponding plurality of parts of a second line (6) are connected to each other by a transparent conductive thin film (10). In a connecting terminal part, the plurality of parts of the first line (2) and the respective corresponding plurality of parts of the second line (6) are connected to each other in parallel. With the configuration, it is possible to greatly reduce a risk of disconnection. It is therefore possible to prevent disconnection from being caused by corrosion in the connecting terminal part of a display apparatus etc.

Abstract: The present invention is a substrate for use in a display panel. According to the substrate, lines (102, 106, 107, and 113) provided in a display region on the substrate are made up of multiple layers whose uppermost layers (102c, 106c, 107c, and 113c) are each made from (i) an oxide of first metal selected from the group consisting of copper, titanium, and molybdenum or (ii) a nitride of copper. This can prevent external light from being reflected and thereby improve a contrast in a bright room.

Abstract: An active matrix substrate (30) of the present invention includes a substrate, a gate line (50) formed on the substrate, and an interlayer insulating layer (90) for insulating a layer formed on the gate line (50) from the gate line (50). In a region of the substrate, the interlayer insulating layer (90) is not provided on an upper surface of the gate line (50), and therefore, the upper surface is exposed. On the other hand, the insulating layer (90) is provided on the substrate so as to have contact with at least an edge face of the gate line (50) which edge face is on an extension of a longitudinal direction of the gate line (50).

Abstract: This feed system comprises: feed device for feeding a part to be welded, which can be inserted into a hole of a work, to the vicinity of an electrode of a welder; chuck for removably chucking the part fed by the feed means; first transfer device for transferring the trailing end of the feed device to and from the chuck; a guide pin held capable of being transferred by the electrode for being inserted into the work when the work is to be positioned; second transfer device connected to the chuck for positioning the part, which is chucked by the chuck, concentrically of the guide pin of the electrode; and pusher transferred by the second transfer device for pushing the part, which is chucked concentrically of the guide pin by the chuck, to insert the part into the hole of the work.