Patents by Inventor Tetsuo Kawakita

Tetsuo Kawakita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic components mounting/connecting package and its fabrication method
    Patent number: 5336547
    Abstract: The present invention relates to an electronic components mounting/connecting package characterized by using bump electrodes to connect electronic components such as semiconductors and the like with patterning electrodes of a circuit board.In order to prevent deterioration in connecting reliability due to deformation and the like of semiconductors and circuit boards, it is necessary to have some elasticity incorporated with bump electrodes. The composition of bump electrodes disclosed by the present invention is to have resin particles dispersed to high density in the metallic bump electrodes.According to this composition, even when there are some variations of distribution in circuit board warp and bump electrode height, it has become possible to absorb the variations through elasticity presented by the bump electrodes and to perform a low strain connection with a resultant enhancement in connecting reliability at high temperature.
    Type: Grant
    Filed: February 26, 1993
    Date of Patent: August 9, 1994
    Assignee: Matsushita Electric Industrial Co. Ltd.
    Inventors: Tetsuo Kawakita, Takayuki Yoshida, Kenzo Hatada