Abstract: This method controls a copper density in a dip solder bath holding a molten solder alloy containing at least copper as an essential composition thereof during a dip soldering step of one of a printed circuit board with a surfaced copper foil and a component part having a copper lead attached thereto. The method includes a step of introducing a replenished solder containing no copper at all or a copper content having a density lower than that of the molten solder in the bath prior to the supply of the replenished solder to the bath so that the copper density in the bath is controlled to a predetermined constant density or lower The molten solder alloy in the bath contains tin, copper and nickel as the major compositions thereof, and the replenished solder contains nickel and balanced tin, for example. Alternatively, the molten solder alloy in the bath contains tin, copper, and silver as the major components thereof and the replenished solder contains silver and balanced tin.

Abstract: A lead-free solder characterized as comprising 0.1 to 2 wt % of Cu, 0.002 to 1 wt % of Ni with the residue being Sn. The solder preferably contains Cu in an amount of 0.3 to 0.7 wt %, and more preferably it contains Cu in an amount of 0.3 to 0.7 wt % and Ni in an amount of 0.04 to 0.1 wt %. The solder can be prepared by adding Ni to a molten mother alloy of Sn—Cu, or by adding Cu to a molten mother alloy of Sn—Ni. A lead-free solder which further comprises 0.001 to 1 wt % of Ga is also disclosed. The lead-free solder can form a solder joint having a high strength and stability comparable to those of a conventional Sn—Pb eutectic solder.

Abstract: An in-pipe work device comprising at least two movement mechanisms connected with each other in a longitudinal direction of a pipe by a flexible tube, and a control device for controlling the movement mechanisms, the movement mechanisms including a body connected to the flexible tube, a guide member installed on the body such that the guide member is slidable in an axial direction, a support leg drive mechanism provided on the guide member and having a support leg movable in a radial direction of the pipe, for pressing the support leg against an inner wall of the pipe, thereby to hold the guide member kept unmovable in an axis direction of the pipe, a slide mechanism for relatively sliding the guide member and the body, with the support leg pressed against the inner wall of the pipe, thereby to slide the body in the axis direction of the pipe, wherein the control device controls the in-pipe movement device so as to move in a pipe by itself, by sequentially operating the plurality of movement mechanism in a pr

Abstract: A wave soldering machine welling up molten solder by means of a pump for soldering a printed circuit board. The wave soldering machine comprises a nozzle formed of an enclosure surrounded by a front upright, a rear upright and side plates, a rear baffle plate extended from the top edge of the rear upright in a manner that the height of the rear baffle plate is adjusted, and a generally L-shaped front baffle plate having a large radius of curvature pivotally attached to the top edge of the front upright, whereby a solder wave formed on the top end of the rear baffle plate by surface tension of molten solder flows along the top surface of the front baffle plate. The rear baffle plate is particularly shaped and a bypass is formed to present a stable solder wave.

Abstract: The invention is a solder alloy which can alleviate the fatigue rupture which occurs at a soldered joint due to a heat cycle. The solder alloy also shows effective use of the addition of Cu. This solder alloy comprises 57 to 65% Sn, 0.1 to 0.5% Sb, 0.002 to 0.05% Te and the balance being lead, wherein all percentages are by weight. The solder alloy of the present invention also supplements the base composition with 0.001 to 0.05% by weight Ga and/or 0.1 to 0.3% by weight Cu.

Abstract: A soldering flux comprising a bis (2-oxazoline) compound, a dithiol compound, an organic carboxylic acid compound and an activator which does not require post-soldering cleaning and, yet, does not cause corrosion of the base metal or deterioration of electrical characteristics and helps to clear the statutory regulations on the use of chlorofluorohydrocarbons.A soldering flux comprising, in addition to the above components, an organic solvent, a thermoplastic resin or/and an epoxy group-containing compound.

Abstract: An assembly of a tube having a breakaway plug mounted on one opening thereof is provided. The plug includes a hollow cylindrical segment fixedly secured to the tube, a closing segment, and a frangible thin-wall portion located in the hollow segment apart from the secured portion. A protector of a relatively rigid material is fitted over the plug. The plug can be torn off at the frangible portion by twisting the protector.

Abstract: A branch tube comprising a main tube defining a continuous flow path and one or two branches connected to the main tube has a closure member connected to one end of the main tube to block the flow path thereof. The closure member is integrally molded with the main tube so that a continuous smooth flow path extends through the main tube up to the closure member and the closure member is breakable from the main tube to open the flow path. A tubular sleeve is connected to the main tube so as to surround the closure member.

Abstract: An assembly of a tube having a breakaway plug member mounted on one opening thereof is provided. The plug member has an open end and a closed end, and includes on its inner surface a first inner-wall portion extending from the open end toward the closed end a predetermined distance which is fixedly secured to the one open end of said tubular body, and a second inner-wall portion defining a space therein which extends from the first inner-wall portion to the closed end. The plug member also includes on its outer surface a thin-walled frangible portion located on or radially outside the second inner-wall portion which is breakable to allow separation of the plug member from the tubular body. The one open end of the tubular body extends in said space beyond the thin-walled frangible portion toward the closed end of the plug member.

Abstract: A conventional solder composition of Sn--Bi--Pb which is improved so that, when soldering job at a lower temperature, adequate adhesion strength and a resilient bond is obtained by virtue of additional incorporation of 0.005 to 1% GA and/or 0.01 to 0.1% Ni. The inventive solder is useful in assembly work in the electronic industry wherein thermally weak parts are subjected to soldering.

Abstract: A heat sterilized medical needle device having a needle cannula with a pointed distal end, a hub supporting a proximal end portion of the needle cannula at one end thereof and allowing connection of a tube at the other end thereof to allow communication between the tube and the needle cannula therethrough, and a protector comprising a hollow body with a closed distal end and an open proximal end and sealing a portion of the needle cannula which is exposed from the hub within the hollow portion thereof. The hub has a thin portion to be twisted and broken to disconnect the hub from the protector, and the hub is coupled to the protector to form a liquid-tight joint by blocking at a portion of the hub which is closer to the pointed end of the needle cannula than the thin portion.