Abstract: A hydrogen injection apparatus has an injector attached to an attachment hole of a body. The injector can inject hydrogen. A mounting member made of metal is provided on the outer circumferential side of the injector. An annular elastic member is provided in contact with a base of the mounting member. At the time of mounting the injector to the attachment hole, an elastic member and the mounting member are assembled in a manner that the elastic member and the mounting member are accommodated in a support base of an attachment provided at an opening of the attachment hole.

Abstract: In a fuel gas circulation apparatus, an injector for injecting a fuel gas is inserted into an attachment hole of a body. A cylindrical nozzle is provided integrally with a distal end of the injector. A diffuser is provided downstream of the injector. The diffuser mixes a redundant fuel cell and the injected fuel gas. Connection channels are formed at the proximal end of the diffuser for circulation of the off gas. A reduced diameter portion having the reduced flow channel diameter is formed downstream of a chamber where the connection channels are provided. A nozzle injection hole at the distal end of the nozzle is positioned to face, and coaxially with the reduced diameter portion to circulate the off gas toward a fuel cell stack under operation of the negative pressure generated by the diffuser.

Abstract: In a fuel gas circulation apparatus, a diffuser is accommodated in an attachment hole of a body. An injector is provided upstream of the diffuser through an attachment. A vibration absorption member made of elastic material is provided between a proximal end of a large diameter portion of this diffuser and a distal end of a main body in the attachment, and a ring member is provided adjacent to the vibration absorption member.

Abstract: A fuel cell system includes a fuel cell, a fuel-gas supply path, a fuel-gas circulation path, a first flow adjuster, an ejector, a bypass flow path, and a second flow adjuster. The fuel cell has a fuel-gas flow path and an oxidant-gas flow path. The bypass flow path connects an upstream section of the fuel-gas supply path located upstream of the first flow adjuster to a downstream section of the fuel-gas supply path located downstream of the ejector so as to cause fuel gas to bypass the first flow adjuster and the ejector. The second flow adjuster is provided in the bypass flow path to adjust a flow rate of the fuel gas by intermittently ejecting the fuel gas at a larger flow rate than the first flow adjuster.

Abstract: A semiconductor pressure sensor includes a cavity disposed in one silicon substrate of a SOI substrate having two silicon substrates bonded to each other with an oxide film therebetween and a diaphragm formed from the other silicon substrate and the oxide film, wherein the oxide film, bordering the cavity, of the diaphragm includes an arc-shaped section at the boundary portion to the one silicon substrate defining the inner wall side surface of the cavity, the arc-shaped section having the same width as the width of the cavity at a desired section in the one silicon substrate and reducing the width of the cavity from the boundary portion toward the diaphragm center.

Abstract: Compositions comprising a purified and/or isolated antibody, humanized antibodies, precipitates and anti-sera that specifically bind to or are otherwise directed against ROR1 protein. The compositions may be used for detecting ROR1 in a sample from a subject that is suspected or known to contain cancer cells. The ROR1 antibodies are especially useful in identifying and treating lymphomas and ademocarcinomas. Vaccines and related methods for protecting a subject against diseases that involve expression of ROR1 are also provided, as are human anti-sera effective in abrogating interactions between Wnt5a protein and ROR1 that contribute to the survival of certain cancer cells, such as CLL cells.

Abstract: The presence or absence of putting round of a yarn is detected according to whether carriers are positioned on a near side or a far side and according to the relationship of connection between loops, and the result is displayed on a monitor. On the monitor, for example, the degree of the deformation of the yarn is changed according to the presence or absence of putting round when the yarn is touched, or a color is changed according to the presence or absence of putting round. The presence or absence of putting round of the yarn can be detected and then displayed to a user.

Abstract: A semiconductor pressure sensor includes a cavity disposed in one silicon substrate of a SOI substrate having two silicon substrates bonded to each other with an oxide film therebetween and a diaphragm formed from the other silicon substrate and the oxide film, wherein the oxide film, bordering the cavity, of the diaphragm includes an arc-shaped section at the boundary portion to the one silicon substrate defining the inner wall side surface of the cavity, the arc-shaped section having the same diameter as the diameter of the cavity in the one silicon substrate and reducing the cavity diameter from the boundary portion toward the diaphragm center.

Abstract: To provide a pump comprising an impeller which sucks and discharges liquid, a motor unit which drives the impeller, a parting plate which is disposed between the impeller and the motor unit and which partitions the impeller and the motor unit, a case formed with a pump chamber in which the impeller is accommodated, a suction port which is connected to the case and which sucks liquid and a discharge port which discharges liquid, wherein the case is provided with a discharge passage which discharges liquid introduced into the pump chamber from the suction port, the discharge passage has a predetermined diameter, the discharge passage is provided along an outer periphery of the pump chamber at a location at a predetermined distance from the outer periphery of the pump chamber, the pump further comprises at least one reflow passage which brings the discharge passage and the pump chamber into communication with each other and through which liquid flowing through the discharge passage flows back to the pump chamber

Abstract: Compositions comprising a purified and/or isolated antibody, humanized antibodies, precipitates and anti-sera that specifically bind to or are otherwise directed against ROR1 protein. The compositions may be used for detecting ROR1 in a sample from a subject that is suspected or known to contain cancer cells. The ROR1 antibodies are especially useful in identifying and treating lymphomas and ademocarcinomas. Vaccines and related methods for protecting a subject against diseases that involve expression of ROR1 are also provided, as are human anti-sera effective in abrogating interactions between Wnt5a protein and ROR1 that contribute to the survival of certain cancer cells, such as CLL cells.

Abstract: Embodiments of the present disclosure are directed to a package having pressure sensor including a first substrate having a fixed electrode bonded to a second substrate having a movable electrode disposed at a predetermined interval from the fixed electrode, a support substrate with an opening for storing the second substrate, and a resin layer for fixing the pressure sensor and the support substrate. The pressure sensor may be packaged on the support substrate via the first substrate and a bonding member in a state where the second substrate is fit within the opening. The package for the pressure sensor may be sufficiently thin to be employed for the use on a minimum area.

Abstract: The presence or absence of putting round of a yarn is detected according to whether carriers are positioned on a near side or a far side and according to the relationship of connection between loops, and the result is displayed on a monitor. On the monitor, for example, the degree of the deformation of the yarn is changed according to the presence or absence of putting round when the yarn is touched, or a color is changed according to the presence or absence of putting round. The presence or absence of putting round of the yarn can be detected and then displayed to a user.

Abstract: A package is mainly formed of a package body having a storage area for storing a pressure sensor, a capacity type pressure sensor stored in the storage area of the package body, a lid seals the package body in which the pressure sensor is stored, an adhesive agent for fixing the pressure sensor to the package body, and a bonding wire for electrically coupling a bonding pad of the pressure sensor and a conductive portion of the package body. An adhesive area of the package body and the pressure sensor is set to the area other than a projection area of the diaphragm of the pressure sensor on a mount bottom surface. This makes it possible to provide the package for the pressure sensor capable of detecting the pressure with high sensitivity although the gap between the substrate and the diaphragm has the value with the magnitude of several ?ms.

Abstract: A pressure-sensor package mainly includes a pressure sensor, a support substrate, and a resin layer. The pressure sensor includes a glass substrate having a fixed electrode, and a silicon substrate having a diaphragm that is disposed apart from the fixed electrode by a predetermined distance. The support substrate is a silicon/glass composite substrate on which the pressure sensor is mounted such that the support substrate and the diaphragm face each other. The resin layer fixes the pressure sensor and the support substrate together. The pressure sensor is mounted on a mounting area of the support substrate with a joint member therebetween. Accordingly, even if a gap between the support substrate and the diaphragm has a size of about several micrometers, the pressure-sensor package is capable of performing pressure detection with high sensitivity.

Abstract: A pressure sensor includes a gold-silicon eutectic crystal layer interposed between the contact layer and the silicon substrate. Because the contact layer and the silicon substrate are electrically connected to each other by using a gold-silicon eutectic reaction at the time of bonding the silicon substrate and the glass substrate, a contact resistance between the contact layer and the silicon substrate can be stabilized, and a Q value of the sensor can be stabilized. In addition, since the contact layer and the silicon substrate are bonded to each other by the gold-silicon eutectic reaction, the bonding strength is sufficient.

Abstract: A capacitive pressure sensor is provided. The capacitive pressure sensor includes a glass substrate that has a pair of surfaces facing each other. A first silicon substrate has a fixed electrode passing through the glass substrate to be exposed at one surface and a projection passing through the glass substrate to be exposed at the one surface. A second silicon substrate is bonded to the one surface of the glass substrate and is disposed to face the fixed electrode so as to form a cavity between the second silicon substrate and the fixed electrode.

Abstract: A pressure-sensor package mainly includes a pressure sensor, a support substrate, and a resin layer. The pressure sensor includes a glass substrate having a fixed electrode, and a silicon substrate having a diaphragm that is disposed apart from the fixed electrode by a predetermined distance. The support substrate is a silicon/glass composite substrate on which the pressure sensor is mounted such that the support substrate and the diaphragm face each other. The resin layer fixes the pressure sensor and the support substrate together. The pressure sensor is mounted on a mounting area of the support substrate with a joint member therebetween. Accordingly, even if a gap between the support substrate and the diaphragm has a size of about several micrometers, the pressure-sensor package is capable of performing pressure detection with high sensitivity.

Abstract: A package is mainly formed of a package body having a storage area for storing a pressure sensor, a capacity type pressure sensor stored in the storage area of the package body, a lid seals the package body in which the pressure sensor is stored, an adhesive agent for fixing the pressure sensor to the package body, and a bonding wire for electrically coupling a bonding pad of the pressure sensor and a conductive portion of the package body. An adhesive area of the package body and the pressure sensor is set to the area other than a projection area of the diaphragm of the pressure sensor on a mount bottom surface. This makes it possible to provide the package for the pressure sensor capable of detecting the pressure with high sensitivity although the gap between the substrate and the diaphragm has the value with the magnitude of several ?ms.

Abstract: A capacitive pressure sensor and method of manufacturing the same is provided. The capactive pressure sensor includes a glass substrate that has a pair of surfaces opposite to each other. A recessed portion is provided to form a cavity on one of the pair of principal surfaces. A first protruding portion provided in the recessed portion. A first silicon substrate has a fixed electrode formed on the first protruding portion, and a movable electrode disposed with a predetermined interval between the fixed electrode and the movable electrode.