Patents by Inventor Tetsuya Hayashi

Tetsuya Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5510572
    Abstract: A melody segmentation module segments a given melody into a plurality of phrases. A phrase tonality analyzer determines a key of each phrase to provide a correct succession of keys of the melody. With this arrangement, the music apparatus can detect, from the melody, a modulation (change of key). A chord progression database is searched to assign an appropriate chord pattern to each phrase. Thus, the melody is harmonized with a natural and real chord progression. A style analyzer tests a melody phrase for a preselected music style and labels it with style-matched if it meets the preselected music style. A chord pattern characteristic of the preselected music style is selected from a chord progression database of the same music style to harmonize the style-matched phrase. Thus, the melody agrees with the harmonizing chord progression in terms of music style.
    Type: Grant
    Filed: October 8, 1993
    Date of Patent: April 23, 1996
    Assignee: Casio Computer Co., Ltd.
    Inventors: Tetsuya Hayashi, Kunihiro Matsubara
  • Patent number: 5460775
    Abstract: The invention provides aluminum sintered alloys with high dimensional accuracy and high density which are superior in mechanical and physical characteristics as well as wear resistance, and a method of producing such alloys not by plastic working but by atmospheric sintering with high economy. Rapidly solidified aluminum alloy powder resulting from solidifying aluminum alloy molten metal containing 0.4 to 4.0% by weight of Mg at a solidification rate of 10.sup.2 .degree. C./sec or more is press molded in the cold, after annealing in the temperature range of 250 to 450.degree. C. if necessary, and then the molded product is sintered by generating nitrogen compounds on the powder surface at atmospheric pressure with a nitrogen partial pressure of 0.8 atm or more and a steam partial pressure of 0.01 atm or less in which a reducing gas component has been added as a nitrogen-combining acceleration gas component by 0.01 atm or more. Thus, a nitrogen-combined aluminum sintered alloy containing 0.4 to 4.
    Type: Grant
    Filed: July 2, 1993
    Date of Patent: October 24, 1995
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Tetsuya Hayashi, Yoshinobu Takeda
  • Patent number: 5372775
    Abstract: To prepare an aluminum matrix particle composite alloy, a molten metal, mainly composed of aluminum, containing ceramic particles is disintegrated by atomization, to prepare atomized powder. The atomized powder is mechanically ground/reflocculated with a ball mill or the like, to prepare mechanically ground/reflocculated powder containing ceramic particles of not more than 8 .mu.m in maximum diameter and not more than 3 .mu.m in mean particle diameter. The mechanically ground/reflocculated powder is then warm-formed/solidified. Alternatively, an aluminum alloy molten metal containing dispersed particles is disintegrated by atomization, and thereafter the powder containing the dispersed particles of not more than 20 .mu.m in mean particle diameter is warm-formed/solidified by powder forging. Thus, it is possible to obtain an aluminum matrix particle composite alloy in which extra-fine ceramic particles are homogeneously distributed without segregation.
    Type: Grant
    Filed: August 17, 1992
    Date of Patent: December 13, 1994
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Tetsuya Hayashi, Yoshinobu Takeda
  • Patent number: 5366691
    Abstract: A hyper-eutectic aluminum-silicon powder containing extremely fine primary crystal silicon, is prepared by atomizing. First, a molten metal of a hyper-eutectic aluminum-silicon alloy containing phosphorus is prepared. This molten metal or melt is atomized with air or an inert gas and quench-solidified. Aluminum-silicon alloy powder containing primary crystal silicon of not more than 10 .mu.m in crystal grain size is obtained. This aluminum-silicon alloy powder contains at least 12 percent by weight and not more than 50 percent by weight of silicon and at least 0.0005 percent by weight and not more than 0.1 percent by weight of phosphorus. When this hyper-eutectic aluminum-silicon alloy powder is employed, it is possible to prepare a consolidate of powder which has improved mechanical properties, and provides a high yield.
    Type: Grant
    Filed: June 24, 1992
    Date of Patent: November 22, 1994
    Assignees: Sumitomo Electric Industries, Ltd., Toyo Aluminum K.K.
    Inventors: Yoshinobu Takeda, Tetsuya Hayashi, Toshihiko Kaji, Yusuke Odani, Kiyoaki Akechi, Jun Kusui, Takamasa Yokote, Akiei Tanaka, Takashi Watsuji
  • Patent number: 5265457
    Abstract: An oil groove is formed on the end surface of a rotor of an aluminum alloy for a compressor of a vane type, in an economical manner by a method comprising forming the oil groove of a concave type on the end surface of the rotor slidably moving in contact with a side plate by warm-pressing a die stamp.
    Type: Grant
    Filed: October 30, 1992
    Date of Patent: November 30, 1993
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Tetsuya Hayashi, Tosio Fujiwara
  • Patent number: 5149091
    Abstract: A golf club head having a channel formed in the back on the heel side of the club head main body that extends from the upper end of the hosel portion to the underside of a sole portion. A cover member molded separately is mounted over the opening of the channel to close it whereby a shaft fit hole is formed for receipt of the club's shaft by the inner surface of the cover member and a part of the inner surface of the channel.
    Type: Grant
    Filed: May 3, 1991
    Date of Patent: September 22, 1992
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Takaharu Okumoto, Tetsuya Hayashi, Masahiro Kato
  • Patent number: 5132779
    Abstract: A housing for a semiconductor device is improved to avoid thermal distortion. The housing is formed of an Al-Si compound material and includes a housing member having a space for holding the semiconductor device. Occlusion gas contained in the Al-Si compound material is removed so that at least any nitrogen gas remaining in occlusion after degassing is 0.1 percent by weight or less. Since the housing member substantially does not contain occlusion gas, the housing is not subject to thermal distortion even though the housing is exposed to heat in operation.
    Type: Grant
    Filed: January 15, 1991
    Date of Patent: July 21, 1992
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Mitsuo Osada, Yugaku Abe, Tetsuya Hayashi
  • Patent number: 5057861
    Abstract: A photosensitive sheet (11) having photohardenable microcapsules is unrolled to be intermittently fed onto the exposure stage (300), and color separated images are projected onto a common area of the photosensitive sheet. A receiver paper (12) having a color coupler layer is overlaid on the photosensitive sheet, and pressed with a press roller mechanism (700), whereby a color image appears on the receiver paper. The receiver paper is separated from the photosensitive sheet, and thermally treated with a heater (820).
    Type: Grant
    Filed: November 23, 1988
    Date of Patent: October 15, 1991
    Assignee: Dainippon Screen Mfg. Co. Ltd.
    Inventors: Kiyoshi Maeda, Sadahiko Nishide, Mamoru Yoshiyama, Seiichi Matsuguchi, Masahiko Kurosaki, Takao Oura, Tetsuya Hayashi, Yoshikazu Kobayashi, Yoshiaki Handa
  • Patent number: 5022455
    Abstract: An aluminum alloy is melted and sprayed from a nozzle. Solid particles of silicon are sprayed by gas jet simultaneously with spraying of the aluminum alloy. Both the sprayed aluminum alloy and the sprayed solid particles of silicon are deposited and cooled.
    Type: Grant
    Filed: July 30, 1990
    Date of Patent: June 11, 1991
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Yoshinobu Takeda, Yusuke Odani, Tetsuya Hayashi, Toshihiko Kaji, Yoshiaki Itoh
  • Patent number: 4959276
    Abstract: A heat-resistant, wear-resistant and high-strength Al-Si alloy, wherein(A) 3 to 5% by weight based on the total amount of the alloy of alumina particles having a maximum particle diameter of 30 .mu.m or less and an average particle diameter of 10 .mu.m or less and having shaped with no sharp edge and(B) 0.5 to 3% by weight based on the total amount of the alloy of graphite particles having a maximum particle diameter of 10 .mu.m or less as measured on a cross section of the Al-Si alloy structureare dispersed in a matrix consisting essentially of ingredients for an Al-Si alloy and having primary Si crystals, the sizes of the primary Si crystals being not larger than 10 .mu.m.
    Type: Grant
    Filed: October 31, 1989
    Date of Patent: September 25, 1990
    Assignees: Sumitomo Electric Industries, Ltd., Honda Motor Co., Ltd.
    Inventors: Yoshitoshi Hagiwara, Eitaro Koya, Tetsuya Hayashi, Yoshinobu Takeda
  • Patent number: D324008
    Type: Grant
    Filed: May 19, 1989
    Date of Patent: February 18, 1992
    Assignee: Fuji Jukogyo Kabushiki Kaisha
    Inventor: Tetsuya Hayashi
  • Patent number: D328046
    Type: Grant
    Filed: May 19, 1989
    Date of Patent: July 21, 1992
    Assignee: Fuji Jukogyo Kabushiki Kaisha
    Inventor: Tetsuya Hayashi
  • Patent number: D328265
    Type: Grant
    Filed: May 19, 1989
    Date of Patent: July 28, 1992
    Assignee: Fuji Jukogyo Kabushiki Kaisha
    Inventor: Tetsuya Hayashi
  • Patent number: D330689
    Type: Grant
    Filed: July 3, 1990
    Date of Patent: November 3, 1992
    Assignee: Fuji Jukogyo Kabushiki Kaisha
    Inventors: Tetsuya Hayashi, Hiroshi Yako, Hiroshi Ono, Yuji Uemura, Danny E. Ellis
  • Patent number: D337550
    Type: Grant
    Filed: September 13, 1991
    Date of Patent: July 20, 1993
    Assignee: Fuji Jukogyo Kabushiki Kaisha
    Inventors: Tetsuya Hayashi, Hidefumi Kato, Masashi Takahashi
  • Patent number: D338639
    Type: Grant
    Filed: September 20, 1991
    Date of Patent: August 24, 1993
    Assignee: Fuji Jukogyo Kabushiki Kaisha
    Inventors: Tetsuya Hayashi, Hidefumi Kato, Masashi Takahashi