Patents by Inventor Tetsuya Mieda

Tetsuya Mieda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220157486
    Abstract: An insulating tape for coating a connection portion of a power cable is unlikely to cause local cracking to a fused part even when a highly hydrophilic polyethylene is used. This insulating tape is formed of a resin material including a polyethylene which is at least partially modified by a molecule capable of imparting hydrophilicity; an antioxidant; and a cross-linking agent. The antioxidant has a molecular weight of not less than 190 but less than 1,050. The contained amount of the antioxidant is 0.05-0.8 parts by mass with respect to 100 parts by mass of the polyethylene. The insulating tape has a thickness of 50-250 ?m. In addition, this power cable 1 is provided with a connection structure that has a connection portion formed by conductively connecting ends of multiple power cables where respective conductors are exposed.
    Type: Application
    Filed: March 30, 2020
    Publication date: May 19, 2022
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tetsuya MIEDA, Takahiro KANAYA
  • Publication number: 20220157488
    Abstract: An insulating resin composition that allows a reduction in the amount of spatial electric charges accumulated in an insulating layer, whereby dielectric breakdown is less likely to occur. This insulating resin composition 1 contains at least an antioxidant and a base resin including an unmodified polyolefin resin and a modified polyolefin resin modified by a molecule having a polar group. The modified polyolefin resin is modified by at least one selected from unsaturated dicarboxylic anhydride derivatives, unsaturated dicarboxylic anhydrides, and unsaturated dicarboxylic acids, which are each a molecule having a polar group. The base resin has a so-called island-in-sea structure in which a second phase 12 containing the modified polyolefin resin is present in a first phase 11 containing the unmodified polyolefin resin. The second phase has an average diameter of 2 ?m or less.
    Type: Application
    Filed: March 30, 2020
    Publication date: May 19, 2022
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tetsuya MIEDA, Takahiro KANAYA
  • Patent number: 11139449
    Abstract: A resin composition for sealing an organic electronic device element, containing a polyisobutylene resin (A), a hydrogenated cyclic olefin resin (B), and a polymer (C) obtained by any one of radical polymerization, anionic polymerization or coordination polymerization and exhibiting rubber elasticity, a resin sheet using the same, organic electroluminescent element, and image display apparatus.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: October 5, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tetsuya Mieda, Kunihiko Ishiguro
  • Patent number: 10988646
    Abstract: An adhesive composition, having: a polyalkylene oxide-added polyfunctional epoxy compound (a) represented by formula (A); a polyfunctional (meth)acrylate monomer (b), and a photo-acid generator (c); a method of bonding the adherends and a method of producing a stack, each of which uses the same: wherein R designates a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); X designates a divalent linking group having a ring structure and 6 to 20 carbon atoms, or a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); and m and n each are 0, or a positive number, independently.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: April 27, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tetsuya Mieda, Takumi Asanuma, Yasushi Ishizaka
  • Patent number: 10829669
    Abstract: A curable and hygroscopic resin composition for sealing electronic devices, comprising: a cationically polymerizable compound (a); a hygroscopic compound (b) containing a structure represented by Formula (1); and a cationic polymerization initiator (c); a resin cured material formed by curing the composition, and an electronic device sealed by curing the composition. wherein in Formula (1), R designates (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group having at least one selected from the group consisting of —O—, —S—, —CO—, and —NH—, between a carbon-carbon bond of the above-described hydrocarbon group; M designates a boron or aluminum atom; n is an integer of 2 to 20; and *1 and *2 each designate a binding site to a terminal group or are bonded to each other.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: November 10, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tetsuya Mieda, Takumi Asanuma, Yasushi Ishizaka
  • Patent number: 10829670
    Abstract: A curable and hygroscopic resin composition for sealing electronic devices, comprising: a radically polymerizable compound (a); a hygroscopic compound (b) containing a structure represented by Formula (1); and a photo-radical polymerization initiator (c); a resin cured material formed by curing the composition, and an electronic device sealed by curing the composition. wherein in Formula (1), R designates (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group having at least one selected from the group consisting of —O—, —S—, —CO—, and —NH—, between a carbon-carbon bond of the above-described hydrocarbon group; M designates a boron or aluminum atom; n is an integer of 2 to 20; and *1 and *2 each designate a binding site to a terminal group or are bonded to each other.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: November 10, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventor: Tetsuya Mieda
  • Patent number: 10556974
    Abstract: A curable and hygroscopic resin composition for sealing electronic devices, having at least a (meth)acrylate oligomer (a) having the number-average molecular weight of 1,500 to 5,000, a low molecular weight (meth)acrylate (b) having an average molecular weight of 170 to 500, a moisture-reactive organometallic compound (c), and a polymerization initiator (d), wherein the (meth)acrylate oligomer (a) and the low molecular weight (meth)acrylate (b) are multifunctional (meth)acrylates in which the number of (meth)acryloyl groups is from 1.5 to 3 in one molecule of each of the (meth)acrylate oligomer (a) and the low molecular weight (meth)acrylate (b); a sealing resin; and an electronic device.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: February 11, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tetsuya Mieda, Takumi Asanuma, Yasushi Ishizaka
  • Patent number: 10196534
    Abstract: A resin composition for sealing an electronic device and other things being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth)acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: wherein R1 and R2 each represent a hydroxyl group or H2C?C(R7)—COO—; R3 and R4 each represent a C1-C16 substituted or unsubstituted divalent organic group; R5, R6 and R7 each represent a hydrogen atom or a C1-C10 alkyl group, and at least one organic group represented by chemical formula (2) is included within chemical formula (1); l and m each represent 0 or 1; n represents an integer of 15-150; and x:y=0 to 100:100 to 0; R1 and R2 are never both a hydroxyl group.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: February 5, 2019
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Takumi Asanuma, Masami Aoyama, Yasushi Ishizaka, Tetsuya Mieda
  • Patent number: 10115904
    Abstract: A transparent resin composition for organic EL element sealing and other things having a sufficient moisture blocking effect and excellent flexibility is provided. A thermoplastic resin, a tackifying resin, and an organometallic compound having at least an ester bond and represented by the following formula are included, and in which the light transmittance for light is 85% or higher, the relationship: AM/Y<162 is satisfied, and the thermoplastic resin includes a hydride of a styrene-based A-B-A type triblock body. (wherein R1, R2, R4 and R6 represent organic groups including an alkyl group, an aryl group, a cycloalkyl group, and an acyl group each having a carbon number of 1˜8; R3 and R5 represent organic groups including an alkyl group, an aryl group, an alkoxy group, a cycloalkyl group, and an acyl group each having a carbon number of 1˜8; and M represents a trivalent metal atom.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: October 30, 2018
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kunihiko Ishiguro, Tetsuya Mieda
  • Publication number: 20180291242
    Abstract: An adhesive composition, having: a polyalkylene oxide-added polyfunctional epoxy compound (a) represented by formula (A); a polyfunctional (meth)acrylate monomer (b), and a photo-acid generator (c); a method of bonding the adherends and a method of producing a stack, each of which uses the same: wherein R designates a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); X designates a divalent linking group having a ring structure and 6 to 20 carbon atoms, or a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); and m and n each are 0, or a positive number, independently.
    Type: Application
    Filed: June 14, 2018
    Publication date: October 11, 2018
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tetsuya MIEDA, Takumi ASANUMA, Yasushi ISHIZAKA
  • Patent number: 10084153
    Abstract: A filler material for an organic electroluminescent element, formed of a resin composition being liquid at 25° C., and containing a organometallic compound and a hydrocarbon polymer having a number average molecular weight of 300 or more and less than 20,000, and an iodine value less than 40 g/100 g, and having no polar group, wherein a contact angle to silicon nitride is 10 to 40 degrees, and an amount of outgassing other than moisture upon being heated at 85° C. for 1 hour is 500 ppm or less in terms of a toluene equivalent, and a method of sealing an organic electroluminescent element using the same.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: September 25, 2018
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Naoaki Mihara, Yasushi Ishizaka, Tetsuya Mieda
  • Patent number: 10079360
    Abstract: An electronic-device-sealing resin composition and an organic EL element, having, as a crosslinkable organometallic desiccant, a metal complex compound having crosslinkable alkoxide represented by formula (1) as a ligand: M(ORx)n??Formula (1) wherein, in formula (1), M designates Al, B, Ti or Zr; Rx in the ligand designates an alkyl group, an alkenyl group, an aryl group, a cycloalkyl group, a heterocyclic group, an acyl group, or a group represented by formula (a); at least one of Rx's has a crosslinkable group; and n designates a valence of M. wherein, in formula (a), O* designates O of ORx in formula (1); R1 designates an alkyl group, an alkenyl group or an acyl group; R2 designates a hydrogen atom or an alkyl group; and R3 designates an alkyl group or an alkoxy group.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: September 18, 2018
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tetsuya Mieda, Takumi Asanuma, Yasushi Ishizaka, Keiji Saito
  • Patent number: 10043996
    Abstract: Provided are a resin composition for element encapsulation for organic electronic devices which is transparent, has excellent flexibility, water vapor barrier properties, and adhesive force, and can suppress the generation of dark spots, a resin sheet for element encapsulation for organic electronic devices, an organic electroluminescent element, and an image display device. This adhesive resin composition for element encapsulation for organic electronic devices is used to seal an element for organic electronic devices, and is characterized by containing a diene polymer and a softening agent, in which the content of the softening agent is from 5% by mass to 30% by mass of the total mass.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: August 7, 2018
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masami Aoyama, Tetsuya Mieda, Keiji Saito, Kunihiko Ishiguro, Toshimitsu Nakamura, Naoaki Mihara, Takumi Asanuma
  • Publication number: 20180208804
    Abstract: A curable and hygroscopic resin composition for sealing electronic devices, comprising: a cationically polymerizable compound (a); a hygroscopic compound (b) containing a structure represented by Formula (1); and a cationic polymerization initiator (c); a resin cured material formed by curing the composition, and an electronic device sealed by curing the composition. wherein in Formula (1), R designates (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group having at least one selected from the group consisting of —O—, —S—, —CO—, and —NH—, between a carbon-carbon bond of the above-described hydrocarbon group; M designates a boron or aluminum atom; n is an integer of 2 to 20; and *1 and *2 each designate a binding site to a terminal group or are bonded to each other.
    Type: Application
    Filed: January 19, 2018
    Publication date: July 26, 2018
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tetsuya MIEDA, Takumi ASANUMA, Yasushi ISHIZAKA
  • Publication number: 20180208805
    Abstract: A curable and hygroscopic resin composition for sealing electronic devices, comprising: a radically polymerizable compound (a); a hygroscopic compound (b) containing a structure represented by Formula (1); and a photo-radical polymerization initiator (c); a resin cured material formed by curing the composition, and an electronic device sealed by curing the composition. wherein in Formula (1), R designates (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group having at least one selected from the group consisting of —O—, —S—, —CO—, and —NH—, between a carbon-carbon bond of the above-described hydrocarbon group; M designates a boron or aluminum atom; n is an integer of 2 to 20; and *1 and *2 each designate a binding site to a terminal group or are bonded to each other.
    Type: Application
    Filed: January 19, 2018
    Publication date: July 26, 2018
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventor: Tetsuya MIEDA
  • Patent number: 9913324
    Abstract: A resin composition for sealing an organic electroluminescent element, containing: at least one epoxy compound; at least one polyester resin; and at least one Lewis acid compound or at least one compound which generates a Lewis acid, in which the content of the epoxy compound is from 10 to 200 parts by mass with respect to 100 parts by mass of the polyester resin.
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: March 6, 2018
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Naoaki Mihara, Kunihiko Ishiguro, Toshimitsu Nakamura, Tetsuya Mieda
  • Publication number: 20170327608
    Abstract: A curable and hygroscopic resin composition for sealing electronic devices, having at least a (meth)acrylate oligomer (a) having the number-average molecular weight of 1,500 to 5,000, a low molecular weight (meth)acrylate (b) having an average molecular weight of 170 to 500, a moisture-reactive organometallic compound (c), and a polymerization initiator (d), wherein the (meth)acrylate oligomer (a) and the low molecular weight (meth)acrylate (b) are multifunctional (meth)acrylates in which the number of (meth)acryloyl groups is from 1.5 to 3 in one molecule of each of the (meth)acrylate oligomer (a) and the low molecular weight (meth)acrylate (b); a sealing resin; and an electronic device.
    Type: Application
    Filed: July 28, 2017
    Publication date: November 16, 2017
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tetsuya MIEDA, Takumi ASANUMA, Yasushi ISHIZAKA
  • Publication number: 20170331070
    Abstract: An electronic-device-sealing resin composition and an organic EL element, having, as a crosslinkable organometallic desiccant, a metal complex compound having crosslinkable alkoxide represented by formula (1) as a ligand: M(ORx)n??Formula (1) wherein, in formula (1), M designates Al, B, Ti or Zr; Rx in the ligand designates an alkyl group, an alkenyl group, an aryl group, a cycloalkyl group, a heterocyclic group, an acyl group, or a group represented by formula (a); at least one of Rx's has a crosslinkable group; and n designates a valence of M. wherein, in formula (a), O* designates O of ORx in formula (1); R1 designates an alkyl group, an alkenyl group or an acyl group; R2 designates a hydrogen atom or an alkyl group; and R3 designates an alkyl group or an alkoxy group.
    Type: Application
    Filed: July 28, 2017
    Publication date: November 16, 2017
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tetsuya MIEDA, Takumi ASANUMA, Yasushi ISHIZAKA, Keiji SAITO
  • Patent number: 9793511
    Abstract: A filler material for an organic electroluminescent element, formed of a resin composition being liquid at 25° C., and containing a hydrocarbon polymer having a number average molecular weight of 300 or more and less than 32,000 and an organometallic compound represented by M-Ln (wherein, M represents a metal atom; L represents an organic group having 9 or more carbon atoms and 1 or more oxygen atoms, and all of L represent the same organic group; and n represents the valence of a metal atom M), wherein a contact angle to silicon nitride is 10 to 40 degrees, and an amount of outgassing other than moisture upon heating at 85° C. for 1 hour is 500 ppm or less in terms of a toluene equivalent, and a method of sealing an organic electroluminescent element using the same.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: October 17, 2017
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Naoaki Mihara, Yasushi Ishizaka, Tetsuya Mieda, Kunihiko Ishiguro
  • Patent number: 9758690
    Abstract: A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y<162, A: the acid value excluding the organometallic compound M: the weight average molecular weight of the organometallic compound Y: the weight ratio of the organometallic compound with respect to 100 parts by weight of resin components wherein the thermoplastic resin contains a hydride of a styrene-based A-B-A type triblock, wherein R1 to R4 represent organic groups including an alkyl group, aryl group, alkoxy group, cycloalkyl group and acyl group, each having a carbon number of 1 or more and 8 or less, M represents a metal atom having 3 valency.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: September 12, 2017
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kunihiko Ishiguro, Tetsuya Mieda, Keiji Saito, Masami Aoyama, Toshimitsu Nakamura, Naoaki Mihara, Takumi Asanuma