Patents by Inventor Tetsuya Mieda

Tetsuya Mieda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9758690
    Abstract: A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y<162, A: the acid value excluding the organometallic compound M: the weight average molecular weight of the organometallic compound Y: the weight ratio of the organometallic compound with respect to 100 parts by weight of resin components wherein the thermoplastic resin contains a hydride of a styrene-based A-B-A type triblock, wherein R1 to R4 represent organic groups including an alkyl group, aryl group, alkoxy group, cycloalkyl group and acyl group, each having a carbon number of 1 or more and 8 or less, M represents a metal atom having 3 valency.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: September 12, 2017
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kunihiko Ishiguro, Tetsuya Mieda, Keiji Saito, Masami Aoyama, Toshimitsu Nakamura, Naoaki Mihara, Takumi Asanuma
  • Publication number: 20170047548
    Abstract: A resin composition for sealing an organic electronic device element, containing a polyisobutylene resin (A), a hydrogenated cyclic olefin resin (B), and a polymer (C) obtained by any one of radical polymerization, anionic polymerization or coordination polymerization and exhibiting rubber elasticity, a resin sheet using the same, organic electroluminescent element, and image display apparatus.
    Type: Application
    Filed: September 29, 2016
    Publication date: February 16, 2017
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tetsuya MIEDA, Kunihiko ISHIGURO
  • Publication number: 20160362576
    Abstract: A resin composition for sealing an electronic device and other things being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth)acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: wherein R1 and R2 each represent a hydroxyl group or H2C?C(R7)—COO—; R3 and R4 each represent a C1-C16 substituted or unsubstituted divalent organic group; R5, R6 and R7 each represent a hydrogen atom or a C1-C10 alkyl group, and at least one organic group represented by chemical formula (2) is included within chemical formula (1); l and m each represent 0 or 1; n represents an integer of 15-150; and x:y=0 to 100:100 to 0; R1 and R2 are never both a hydroxyl group.
    Type: Application
    Filed: August 26, 2016
    Publication date: December 15, 2016
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Takumi ASANUMA, Masami AOYAMA, Yasushi ISHIZAKA, Tetsuya MIEDA
  • Publication number: 20160308164
    Abstract: A filler material for an organic electroluminescent element, formed of a resin composition being liquid at 25° C., and containing a hydrocarbon polymer having a number average molecular weight of 300 or more and less than 32,000 and an organometallic compound represented by M—Ln (wherein, M represents a metal atom; L represents an organic group having 9 or more carbon atoms and 1 or more oxygen atoms, and all of L represent the same organic group; and n represents the valence of a metal atom M), wherein a contact angle to silicon nitride is 10 to 40 degrees, and an amount of outgassing other than moisture upon heating at 85° C. for 1 hour is 500 ppm or less in terms of a toluene equivalent, and a method of sealing an organic electroluminescent element using the same.
    Type: Application
    Filed: June 23, 2016
    Publication date: October 20, 2016
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Naoaki MIHARA, Yasushi ISHIZAKA, Tetsuya MIEDA, Kunihiko ISHIGURO
  • Publication number: 20160308165
    Abstract: A filler material for an organic electroluminescent element, formed of a resin composition being liquid at 25° C., and containing a organometallic compound and a hydrocarbon polymer having a number average molecular weight of 300 or more and less than 20,000, and an iodine value less than 40 g/100 g, and having no polar group, wherein a contact angle to silicon nitride is 10 to 40 degrees, and an amount of outgassing other than moisture upon being heated at 85° C. for 1 hour is 500 ppm or less in terms of a toluene equivalent, and a method of sealing an organic electroluminescent element using the same.
    Type: Application
    Filed: June 23, 2016
    Publication date: October 20, 2016
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Naoaki MIHARA, Yasushi ISHIZAKA, Tetsuya MIEDA
  • Patent number: 9257671
    Abstract: A resin composition for sealing an organic electroluminescent device, containing: a drying agent, and a curable component, wherein a surface roughness Ra of the shear failure surface after curing the resin composition is 0.5 ?m or more; a production method thereof; an adhesive film and a gas-barrier formed of the resin composition; an organic electroluminescent device and an organic electroluminescent panel using the same.
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: February 9, 2016
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Toshihiro Suzuki, Satoshi Hattori, Tetsuya Mieda, Hideto Fukuda, Takanori Yamakawa, Toshimitsu Nakamura
  • Publication number: 20160020426
    Abstract: Provided are a resin composition for element encapsulation for organic electronic devices which is transparent, has excellent flexibility, water vapor barrier properties, and adhesive force, and can suppress the generation of dark spots, a resin sheet for element encapsulation for organic electronic devices, an organic electroluminescent element, and an image display device. This adhesive resin composition for element encapsulation for organic electronic devices is used to seal an element for organic electronic devices, and is characterized by containing a diene polymer and a softening agent, in which the content of the softening agent is from 5% by mass to 30% by mass of the total mass.
    Type: Application
    Filed: September 28, 2015
    Publication date: January 21, 2016
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masami AOYAMA, Tetsuya MIEDA, Keiji SAITO, Kunihiko ISHIGURO, Toshimitsu NAKAMURA, Naoaki MIHARA, Takumi ASANUMA
  • Publication number: 20160017197
    Abstract: Provided are an element sealing resin composition for organic electronic devices, which promotes a balance between the water vapor barrier properties and adhesiveness, decreases the water content, and sufficiently suppresses the generation of outgases, so that consequently the service life of an element for organic electronic devices can be lengthened, and which gives a satisfactory external appearance when used to seal an organic electronic device; an element sealing resin sheet for organic electronic devices; an organic electroluminescent element; and an image display apparatus. Disclosed is an element sealing resin composition for organic electronic devices, comprising a polyisobutylene resin (A) having a weight average molecular weight (Mw) of 10,000 to 300,000 and a hydrogenated cyclic olefin-based polymer (B), and having a water content according to the Karl-Fischer method of 500 ppm or less and an amount of outgas generation of 500 ppm or less when heated at 85° C. for 1 hour.
    Type: Application
    Filed: September 25, 2015
    Publication date: January 21, 2016
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tetsuya MIEDA, Toshimitsu NAKAMURA, Kunihiko ISHIGURO, Masami AOYAMA
  • Publication number: 20160017186
    Abstract: A sealant composition being adhesive for used in electronic devices, the sealant composition including an olefin-based polymer and a tackifier, wherein the olefin-based polymer is at least one selected from an ethylene/?-olefin copolymer and an ethylene/?-olefin/non-conjugated diene copolymer, and the content of the tackifier is 10% by mass or more and 70% by mass or less in the resin composition that constitutes the sealant composition.
    Type: Application
    Filed: September 28, 2015
    Publication date: January 21, 2016
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masami AOYAMA, Tetsuya MIEDA, Keiji SAITO, Kunihiko ISHIGURO, Toshimitsu NAKAMURA, Naoaki MIHARA, Takumi ASANUMA
  • Publication number: 20160020423
    Abstract: Provided are a resin composition for element encapsulation for organic electronic devices and other things, which have excellent long-term reliability and excellent visibility by capturing not only the moisture on the front surface or lateral surfaces of the resin composition for element encapsulation for organic electronic devices, but also the moisture permeating through the interior of the resin composition for element encapsulation for organic electronic devices. The resin composition includes a polyisobutylene resin (A) containing a polyisobutylene skeleton in a main chain or in a side chain and having a weight average molecular weight (Mw) of 300,000 or more; and a tackifying agent (B) as main components, includes an organometallic compound (C) having hygroscopic properties, and has a water content of 1000 ppm or less.
    Type: Application
    Filed: September 28, 2015
    Publication date: January 21, 2016
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Keiji SAITO, Masami AOYAMA, Kunihiko ISHIGURO, Naoaki MIHARA, Tetsuya MIEDA
  • Publication number: 20160005973
    Abstract: A transparent resin composition for organic EL element sealing and other things having a sufficient moisture blocking effect and excellent flexibility is provided. A thermoplastic resin, a tackifying resin, and an organometallic compound having at least an ester bond and represented by the following formula are included, and in which the light transmittance for light is 85% or higher, the relationship: AM/Y<162 is satisfied, and the thermoplastic resin includes a hydride of a styrene-based A-B-A type triblock body. (wherein R1, R2, R4 and R6 represent organic groups including an alkyl group, an aryl group, a cycloalkyl group, and an acyl group each having a carbon number of 1˜8; R3 and R5 represent organic groups including an alkyl group, an aryl group, an alkoxy group, a cycloalkyl group, and an acyl group each having a carbon number of 1˜8; and M represents a trivalent metal atom.
    Type: Application
    Filed: September 17, 2015
    Publication date: January 7, 2016
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kunihiko ISHIGURO, Tetsuya MIEDA
  • Publication number: 20150291824
    Abstract: A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y<162, A: the acid value except the organometallic compound M: the weight average molecular weight of the organometallic compound Y: the weight ratio of the organometallic compound with respect to 100 parts by weight of resin components wherein the thermoplastic resin contains a hydride of a styrene-based A-B-A type triblock, wherein R1 to R4 represent organic groups including an alkyl group, aryl group, alkoxy group, cycloalkyl group and acyl group, each having a carbon number of 1 or more and 8 or less, M represents a metal atom having 3 valency.
    Type: Application
    Filed: June 25, 2015
    Publication date: October 15, 2015
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kunihiko ISHIGURO, Tetsuya Mieda, Keiji Saito, Masami Aoyama, Toshimitsu Nakamura, Naoaki Mihara, Takumi Asanuma
  • Publication number: 20150091436
    Abstract: A resin composition for sealing an organic electroluminescent element, containing: at least one epoxy compound; at least one polyester resin; and at least one Lewis acid compound or at least one compound which generates a Lewis acid, in which the content of the epoxy compound is from 10 to 200 parts by mass with respect to 100 parts by mass of the polyester resin.
    Type: Application
    Filed: December 11, 2014
    Publication date: April 2, 2015
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Naoaki MIHARA, Kunihiko ISHIGURO, Toshimitsu NAKAMURA, Tetsuya MIEDA
  • Publication number: 20140291655
    Abstract: A resin composition for sealing an organic electroluminescent device, containing: a drying agent, and a curable component, wherein a surface roughness Ra of the shear failure surface after curing the resin composition is 0.5 ?m or more; a production method thereof; an adhesive film and a gas-barrier formed of the resin composition; an organic electroluminescent device and an organic electroluminescent panel using the same.
    Type: Application
    Filed: June 12, 2014
    Publication date: October 2, 2014
    Inventors: Toshihiro SUZUKI, Satoshi HATTORI, Tetsuya MIEDA, Hideto FUKUDA, Takanori YAMAKAWA, Toshimitsu NAKAMURA
  • Patent number: 6656996
    Abstract: Resin composition for sealing semiconductor devices, which contains a filler (A) of spherical fused silica having maximum particle size of not larger than 45 &mgr;m and may contain metal impurities having a particle size of not larger than 53 &mgr;m; and a semiconductor device sealed with the resin composition.
    Type: Grant
    Filed: May 16, 2000
    Date of Patent: December 2, 2003
    Assignees: Sumitomo Bakelite Co. Ltd., Fujitsu Limited
    Inventors: Yasuaki Tsutsumi, Tetsuya Mieda, Masayuki Tanaka, Toshimi Kawahara, Yukio Takigawa
  • Publication number: 20030027918
    Abstract: Disclosed are a resin composition for sealing semiconductor devices, which contains a filler (A) of spherical fused silica having a maximum particle size of not larger than 45 &mgr;m and may contain metal impurities having a particle size of not larger than 53 &mgr;m; and a semiconductor device sealed with the resin composition.
    Type: Application
    Filed: May 16, 2000
    Publication date: February 6, 2003
    Inventors: Yasuaki Tsutsumi, Tetsuya Mieda, Masayuki Tanaka, Toshimi Kawahara, Yukio Takigawa