Abstract: An optical waveguide includes a diamond layer including a first surface, a second surface and a diamond layer including a complex defect; a first clad layer in contact with the first surface; a second clad layer in contact with the second surface and including a polarity; and a metal layer in Schottky contact with the second clad layer.

Abstract: A method of manufacturing a quantum circuit, the method includes forming, in a diamond layer that includes a color center, an optical waveguide optically coupled the color center, the diamond layer having a first principal surface and a second principal surface, wherein the optical waveguide includes: a core region that includes the color center; and an optical confinement region provided around the core region, a refractive index of the optical confinement region is lower than the refractive index of the core region.

Abstract: A quantum circuit includes a plurality of first optical waveguides and a plurality of second optical waveguides formed on a substrate and each of which includes a single-photon source; a first multiplexer formed on the substrate and configured to condense first photons propagated through the plurality of first optical waveguides; a second multiplexer formed on the substrate and configured to condense second photons propagated through the plurality of second optical waveguides; a branching element configured to introduce the first photons condensed by the first multiplexer and the second photons condensed by the second multiplexer and branch the first photons and the second photons in a first direction and a second direction; a first detector configured to detect the first photons and the second photons branched in the first direction; and a second detector configured to detect the first photons and the second photons branched in the second direction.

Abstract: A main body case 9 includes an output opening 43 for outputting sound from a sound source to an opposing space between an upper main wall 33 and a lower main wall 34. The main body case 9 includes a front main wall 41 for preventing entering of a water droplet to the output opening 43 and for guiding the sound to a rear side B, and a rear main wall 35 for reflecting the sound to a front side F. A first space 51 between the front main wall 41 and the rear main wall 35, a second space 52 surrounded by a left surface 41C of the front main wall 41 and the rear main wall 35 and the upper main wall 33 and the lower main wall 34 and a third space 53 surrounded by a right surface 41D the front main wall 41 and the rear main wall 35 and the upper main wall 33 and the lower main wall 34 are communicating with one another along a crosswise direction Y at a rear end part of each of these spaces.

Abstract: A main body case 9 includes an output opening 43 for outputting sound from a sound source to an opposing space between an upper main wall 33 and a lower main wall 34. The main body case 9 includes a front main wall 41 for preventing entering of a water droplet to the output opening 43 and for guiding the sound to a rear side B, and a rear main wall 35 for reflecting the sound to a front side F. A first space 51 between the front main wall 41 and the rear main wall 35, a second space 52 surrounded by a left surface 41C of the front main wall 41 and the rear main wall 35 and the upper main wall 33 and the lower main wall 34 and a third space 53 surrounded by a right surface 41D the front main wall 41 and the rear main wall 35 and the upper main wall 33 and the lower main wall 34 are communicating with one another along a crosswise direction Y at a rear end part of each of these spaces.

Abstract: A main body case 9 includes an output opening 43 for outputting sound from a sound source to an opposing space between an upper main wall 33 and a lower main wall 34. The main body case 9 includes a front main wall 41 for preventing entering of a water droplet to the output opening 43 and for guiding the sound to a rear side B, and a rear main wall 35 for reflecting the sound to a front side F. A first space 51 between the front main wall 41 and the rear main wall 35, a second space 52 surrounded by a left surface 41C of the front main wall 41 and the rear main wall 35 and the upper main wall 33 and the lower main wall 34 and a third space 53 surrounded by a right surface 41D the front main wall 41 and the rear main wall 35 and the upper main wall 33 and the lower main wall 34 are communicating with one another along a crosswise direction Y at a rear end part of each of these spaces.

Abstract: An apparatus includes a flip-chip semiconductor substrate, a light detection element configured to be formed over the flip-chip semiconductor substrate and to have a laminate structure including a first semiconductor layer of a first-conductive-type, a light-absorption layer formed over the first semiconductor layer, and a second semiconductor layer of a second-conductive-type formed over the light-absorption layer, an inductor configured to be connected to the light detection element over the flip-chip semiconductor substrate, an output electrode for bump connection configured to output a current generated by the light detection element through the inductor, a bias electrode for bump connection configured to apply a bias voltage to the light detection element through a bias electrode, and a line configured to cause a metal line of the inductor and the light detection element to be connected to the output electrode or the bias electrode.

Abstract: An apparatus includes a flip-chip semiconductor substrate, a light detection element configured to be formed over the flip-chip semiconductor substrate and to have a laminate structure including a first semiconductor layer of a first-conductive-type, a light-absorption layer formed over the first semiconductor layer, and a second semiconductor layer of a second-conductive-type formed over the light-absorption layer, an inductor configured to be connected to the light detection element over the flip-chip semiconductor substrate, an output electrode for bump connection configured to output a current generated by the light detection element through the inductor, a bias electrode for bump connection configured to apply a bias voltage to the light detection element through a bias electrode, and a line configured to cause a metal line of the inductor and the light detection element to be connected to the output electrode or the bias electrode.

Abstract: An optical waveguide device includes: a substrate which has an electro-optical effect; an optical waveguide which is formed on the substrate and/or inside the substrate; and an in-substrate electrode which is formed of a metal and provided inside the substrate.

Abstract: An optical transmission apparatus comprising a first gradient index lens, an optical receiver, and a second gradient index lens. The first gradient index lens is connected to an end of an optical transmission line. The optical receiver receives light and is provided to an electronic device. The second gradient index lens is arranged between the first gradient index lens and the optical receiver.

Abstract: An apparatus includes a flip-chip semiconductor substrate, a light detection element configured to be formed over the flip-chip semiconductor substrate and to have a laminate structure including a first semiconductor layer of a first-conductive-type, a light-absorption layer formed over the first semiconductor layer, and a second semiconductor layer of a second-conductive-type formed over the light-absorption layer, an inductor configured to be connected to the light detection element over the flip-chip semiconductor substrate, an output electrode for bump connection configured to output a current generated by the light detection element through the inductor, a bias electrode for bump connection configured to apply a bias voltage to the light detection element through a bias electrode, and a line configured to cause a metal line of the inductor and the light detection element to be connected to the output electrode or the bias electrode.

Abstract: An optical waveguide device includes: a substrate which has an electro-optical effect; an optical waveguide which is formed on the substrate and/or inside the substrate; and an in-substrate electrode which is formed of a metal and provided inside the substrate.

Abstract: An optical waveguide device includes: a substrate which has an electro-optical effect; an optical waveguide which is formed on the substrate and/or inside the substrate; and an in-substrate electrode which is formed of a metal and provided inside the substrate.

Abstract: A light emitting apparatus includes a light-transmissive cover including a pair of side walls, a heat dissipation member including a pair of outer surfaces disposed between inner surfaces of the pair of side walls of the cover and including a fin disposed between the outer surfaces, a light emitting element supported by the heat dissipation member and accommodated in the cover, projections, and recesses. One of the cover and the heat dissipation member has the projections, which are respectively provided on the inner surfaces of the cover or the outer surfaces of the heat dissipation member. The other of the cover and the heat dissipation member has the recesses, which are respectively provided on the inner surfaces of the cover or the outer surfaces of the heat dissipation member. The recesses extend longitudinally of the cover in engagement with the respective projections.

Abstract: An apparatus includes a flip-chip semiconductor substrate, a light detection element configured to be formed over the flip-chip semiconductor substrate and to have a laminate structure including a first semiconductor layer of a first-conductive-type, a light-absorption layer formed over the first semiconductor layer, and a second semiconductor layer of a second-conductive-type formed over the light-absorption layer, an inductor configured to be connected to the light detection element over the flip-chip semiconductor substrate, an output electrode for bump connection configured to output a current generated by the light detection element through the inductor, a bias electrode for bump connection configured to apply a bias voltage to the light detection element through a bias electrode, and a line configured to cause a metal line of the inductor and the light detection element to be connected to the output electrode or the bias electrode.