Abstract: An optical subassembly manufacturing method includes forming connecting electrodes and a piece of high-melting-point glass on a wiring substrate; positioning on and connecting to the connecting electrodes, an optoelectronic converting element; disposing on the piece of high-melting-point glass, a piece of low-melting-point glass having a melting point lower than the piece of high-melting-point glass; and fixing to the piece of low-melting-point glass, a protruding portion of a lens member further having a lens portion. The protruding portion has a shape matching that of the piece of high-melting-point glass, and relative positions of the protruding portion and the optical axis of the lens portion are determined to correspond to relative positions of the connecting electrodes and the piece of high-melting-point glass. The fixing includes fixing the protruding portion of the lens member to the piece of high-melting-point glass via surface tension generated by melting the piece of low-melting-point glass.

Abstract: An optical modulation device includes: a crystal substrate having an electro-optic effect; an optical waveguide formed in the crystal substrate; an electrode formed on the crystal substrate, to apply an electric field to the optical waveguide; and a buried layer of low dielectric constant buried to avoid the optical waveguide, in at least one portion of a lower region of the electrode inside the crystal substrate, which is spaced from both of a front surface of the crystal substrate on which the electrode is formed and a rear surface thereof opposed to the front surface.

Abstract: An optical transmission apparatus comprising a first gradient index lens, an optical receiver, and a second gradient index lens. The first gradient index lens is connected to an end of an optical transmission line. The optical receiver receives light and is provided to an electronic device. The second gradient index lens is arranged between the first gradient index lens and the optical receiver.

Abstract: An optical transmission board includes a base having light transmissibility, and an amorphized part provided in a lens-like shape in the base, the lens-like shape part having a different refractive index from the rest of the base.

Abstract: An optical waveguide device includes: a substrate which has an electro-optical effect; an optical waveguide which is formed on the substrate and/or inside the substrate; and an in-substrate electrode which is formed of a metal and provided inside the substrate.

Abstract: The application relates to an optical device for enhancing the stress to be generated in a substrate in comparison with a conventional technique. To this end, the optical device includes a substrate having a photoelastic effect, a first stress layer formed on a first face of the substrate and having a pattern for generating stress which induces refraction index variation by the photoelastic effect in a partial region in the substrate, and a second stress layer formed on a second face which is a reverse face to the first face of the substrate and configured to generate stress for restoring the shape from the deformation caused by the stress generated in the substrate by the first stress layer in the substrate.

Abstract: An optical subassembly manufacturing method includes forming connecting electrodes and a piece of high-melting-point glass on a wiring substrate; positioning on and connecting to the connecting electrodes, an optoelectronic converting element; disposing on the piece of high-melting-point glass, a piece of low-melting-point glass having a melting point lower than the piece of high-melting-point glass; and fixing to the piece of low-melting-point glass, a protruding portion of a lens member further having a lens portion. The protruding portion has a shape matching that of the piece of high-melting-point glass, and relative positions of the protruding portion and the optical axis of the lens portion are determined to correspond to relative positions of the connecting electrodes and the piece of high-melting-point glass. The fixing includes fixing the protruding portion of the lens member to the piece of high-melting-point glass via surface tension generated by melting the piece of low-melting-point glass.

Abstract: An optical modulation device includes: a crystal substrate having an electro-optic effect; an optical waveguide formed in the crystal substrate; an electrode formed on the crystal substrate, to apply an electric field to the optical waveguide; and a buried layer of low dielectric constant buried to avoid the optical waveguide, in at least one portion of a lower region of the electrode inside the crystal substrate, which is spaced from both of a front surface of the crystal substrate on which the electrode is formed and a rear surface thereof opposed to the front surface.

Abstract: An optical device includes: a crystal substrate; an optical waveguide formed in the crystal substrate; and an amorphous area formed in the crystal substrate, adjacent to a curved waveguide of the optical waveguide. The amorphous area is formed by irradiation of an ultrashort pulse laser.

Abstract: An organic EL element includes an organometallic complex including a rhenium atom; one ligand which has a coordinated nitrogen atom and a coordinated oxygen atom, each coordinated with the rhenium atom, and has at least one ? conjugation part; and the other ligand coordinated with the rhenium atom in such a way that the ligand saturates the coordination number of the rhenium atom and the charge of the whole organometallic complex is neutral.

Abstract: The application relates to an optical device for enhancing the stress to be generated in a substrate in comparison with a conventional technique. To this end, the optical device includes a substrate having a photoelastic effect, a first stress layer formed on a first face of the substrate and having a pattern for generating stress which induces refraction index variation by the photoelastic effect in a partial region in the substrate, and a second stress layer formed on a second face which is a reverse face to the first face of the substrate and configured to generate stress for restoring the shape from the deformation caused by the stress generated in the substrate by the first stress layer in the substrate.