Abstract: To effectively enhance the operation efficiency of an autonomous mobile robot, an autonomous mobile robot control system includes a processor and a plurality of environmental cameras. The processor estimates a moving route of each of a plurality of moving bodies on the basis of characteristics of each of the plurality of moving bodies and sets a subset of the plurality of moving bodies whose moving routes overlap among the detected moving bodies as avoidance processing target moving bodies. The processor generates an avoidance procedure for the avoidance processing target moving bodies so the motion of the avoidance processing target moving bodies does not interfere with the motion of other avoidance target moving bodies.

Abstract: A method of manufacturing an electronic device includes a preparation step of preparing a substrate to which a lead is bonded, and a molding step of mounting a cap in a mold in a state in which the cap is disposed on the substrate and forming a mold portion by filling a mold material into the mold. The mold includes a first mold including a cap mounting portion, and a second mold including a lead pressing portion. The molding step includes a step of mounting the cap in the cap mounting portion, a step of mounting the substrate on the cap, a step of pressing the lead with the lead pressing portion to elastically deform the lead, and biasing the substrate toward the cap by a restoring force generated in the lead, and a step of filling the mold material into the mold.

Abstract: The present invention provides a cathode mixture that can be suitably used in a cathode mixture layer of an all-solid-state lithium-sulfur battery having an excellent charge/discharge capacity and a method of producing the cathode mixture, by maximally utilizing excellent physical properties of sulfur. The present invention relates to a positive electrode mixture for composite all-solid-state lithium-sulfur batteries, the positive electrode mixture containing sulfur or its discharge product (A); phosphorus pentasulfide (B); conductive carbon (C); and lithium halide (D) at a weight ratio of A:B:C:D of 40-60:15-35:5-20:16-30, wherein a peak at 50 ppm in 31P-MAS NMR has a relative intensity of 40% or less.

Abstract: An electronic device includes: a substrate; a first electronic component that is mounted on a first surface of the substrate; a cap that accommodates the first electronic component between the cap and the substrate; and a mold portion that bonds the cap and the substrate. The cap includes a base portion having a recess that opens to a substrate side and accommodates the first electronic component, and a flange portion that protrudes from an end portion of the base portion on the substrate side to an outer peripheral side and is in contact with the first surface. The mold portion is provided from a second surface side of the substrate to a first surface side while bypassing a side, and bonds the cap and the substrate by molding the flange portion in a portion on the first surface side.

Abstract: An electronic device includes: a substrate having an upper surface and a lower surface; a first electronic component mounted on the upper surface of the substrate; a second electronic component mounted on the lower surface of the substrate; and a mold portion covering the second electronic component without covering the first electronic component. The first electronic component is bonded to the upper surface on the first relative surface via a conductive first bonding member. The second electronic component is bonded to the lower surface via a second bonding member on a second relative surface relative to the lower surface.

Abstract: A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1?A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

Abstract: A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1?A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

Abstract: A method of manufacturing an electronic device includes a step of housing an electronic component in a metal mold, then filling the metal mold with a molding material, wherein the metal mold includes a cavity having a rectangular planar shape and housing the electronic component, and a dummy cavity communicated with a side surface having the smallest gap with the electronic component out of four side surfaces included in the cavity, and in the step of filling the metal mold with the molding material, the molding material inflows into the cavity, and the molding material in the cavity inflows into the dummy cavity.

Abstract: An electronic device includes: a substrate having an upper surface and a lower surface; a first electronic component mounted on the upper surface of the substrate; a second electronic component mounted on the lower surface of the substrate; and a mold portion covering the second electronic component without covering the first electronic component. The first electronic component is bonded to the upper surface on the first relative surface via a conductive first bonding member. The second electronic component is bonded to the lower surface via a second bonding member on a second relative surface relative to the lower surface.

Abstract: A method of manufacturing an electronic device includes a preparation step of preparing a substrate to which a lead is bonded, and a molding step of mounting a cap in a mold in a state in which the cap is disposed on the substrate and forming a mold portion by filling a mold material into the mold. The mold includes a first mold including a cap mounting portion, and a second mold including a lead pressing portion. The molding step includes a step of mounting the cap in the cap mounting portion, a step of mounting the substrate on the cap, a step of pressing the lead with the lead pressing portion to elastically deform the lead, and biasing the substrate toward the cap by a restoring force generated in the lead, and a step of filling the mold material into the mold.

Abstract: An electronic device includes: a substrate; a first electronic component that is mounted on a first surface of the substrate; a cap that accommodates the first electronic component between the cap and the substrate; and a mold portion that bonds the cap and the substrate. The cap includes a base portion having a recess that opens to a substrate side and accommodates the first electronic component, and a flange portion that protrudes from an end portion of the base portion on the substrate side to an outer peripheral side and is in contact with the first surface. The mold portion is provided from a second surface side of the substrate to a first surface side while bypassing a side, and bonds the cap and the substrate by molding the flange portion in a portion on the first surface side.

Abstract: A sensor unit includes a plurality of terminal members each of which includes a lead portion and an external terminal portion having an external connection end face, a sensor device connected to the lead portions, and a resin member that covers the sensor device and a part of the plurality of terminal members. The lead portion includes a thin wall portion having a thickness thinner than the external terminal portion and a protruding portion protruding from the thin wall portion to an external connection end face side. In a plan view from a direction where the terminal member and the sensor device overlap, the sensor device is disposed at a position overlapping the protruding portion and not overlapping the external terminal portion.

Abstract: A physical quantity sensor includes an acceleration sensor having an acceleration sensor element and a package accommodating the acceleration sensor element, a support member having a first surface and supporting the acceleration sensor on the first surface, and an IC chip to which a second surface facing the first surface of the support member is attached, in which, in a plan view from a stacking direction of the acceleration sensor and the support member, in a case where an area of a region surrounded by an outer edge of the package is S1 and an area of the first surface is S2, S1?S2 is satisfied.

Abstract: A method of manufacturing an electronic device includes a step of housing an electronic component in a metal mold, then filling the metal mold with a molding material, wherein the metal mold includes a cavity having a rectangular planar shape and housing the electronic component, and a dummy cavity communicated with a side surface having the smallest gap with the electronic component out of four side surfaces included in the cavity, and in the step of filling the metal mold with the molding material, the molding material inflows into the cavity, and the molding material in the cavity inflows into the dummy cavity.

Abstract: An oscillator includes a resonator and an integrated circuit element. The resonator includes a resonator element and a resonator element container accommodating the resonator element. The integrated circuit element includes an inductor. The resonator and the integrated circuit element are stacked on each other. The resonator includes a metal member, and the metal member does not overlap the inductor when viewed in a plan view.

Abstract: A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1?A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

Abstract: A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1?A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

Abstract: A vibrator device has a base that has a first terminal, a circuit element that is disposed on the base and has a second terminal, a vibrator that includes a vibrator element and a vibrator element package, and is positioned between the first terminal and the second terminal in plan view of the base, a wiring unit that is disposed on the vibrator, a first wire that electrically connects the first terminal and the wiring unit together, and a second wire that electrically connects the wiring unit and the second terminal together.

Abstract: An electronic device includes a base material, a first metal film disposed on the base material and containing nitrogen and chromium, and a second metal film disposed on the first metal film and containing gold. In the first metal film, the number of nitrogen atoms may be between 20% to 100% of the number of chromium atoms. Further, the distribution of nitrogen atoms in the first metal film is larger in a third region sandwiched between a first region on the base material side of the first metal film and a second region on the second metal film side than in the first region and in the second region.

Abstract: A sensor unit includes a plurality of terminal members each of which includes a lead portion and an external terminal portion having an external connection end face, a sensor device connected to the lead portions, and a resin member that covers the sensor device and a part of the plurality of terminal members. The lead portion includes a thin wall portion having a thickness thinner than the external terminal portion and a protruding portion protruding from the thin wall portion to an external connection end face side. In a plan view from a direction where the terminal member and the sensor device overlap, the sensor device is disposed at a position overlapping the protruding portion and not overlapping the external terminal portion.