Abstract: The present invention provides a rigid circuit member obtained by bending a composite laminate comprising a circuit conductor made of a metal foil interposed between plastic films having an elastic modulus of not less than 450 kg/mm2 with an adhesive, characterized in that as said plastic film there is used a polyethylene naphthalate film. The present invention also provides a circuit board adapted to be connected to a conductor on a rigid substrate, characterized in that said circuit conductor is interposed between polyethylene naphthalate films. The present invention further provides a printed circuit board, comprising a polyethylene naphthalate film having an elastic modulus of not less than 500 kg/mm2, not more than 1.5×10−5/° C., a hygroscopic expansion coefficient of not more than 1.2×10−5/%RH, a water vapor permeability of not more than 15 g/m2/mil day, a percent water absorption of not more than 2% and a melting point of not higher than 280° C.

Abstract: A method of mounting a semiconductor device including a film carrier having an insulating film having on one side thereof a connecting lead and a semiconductor element junctioned with the film carrier on an outer substrate, which includes forming an opening for adhesive forcing or adhesive injection in the insulating film within its bonding area to be in contact with a land part on the outer substrate and in an area near the bonding area, connecting the connecting lead to the land part on the outer substrate, and forcing or injecting an adhesive through the opening formed in the insulating film into the space between the film carrier and the outer substrate.

Abstract: A wiring substrate, a film carrier, a semiconductor device made by using the film carrier, and a mounting structure comprising the semiconductor device are disclosed.The wiring substrate comprises:a conductor pattern which has a bonding pad and is formed on the rear surface of an insulating support;at least one of minute through-holes which are provided in a region of the insulating support where the bonding pad is in contact therewith, or which are provided a region of the insulating support where the bonding pad is in contact therewith and in the vicinity of the region, the through-holes running in the direction of the thickness of the insulating support;a conductive passage which is made of a metal material and which is formed in the through-holes that are provided in a region of the insulating support where the bonding pad is in contact therewith; anda bump-like metal protrusion which is formed on the conductive passage and which is protruded from the front surface of the insulating support.

Abstract: If a deceleration exeeds first set value G1 within set time T1 after the brake is depressed, a set amount of fluid is supplied to the fluid spring chamber of each front-wheel suspension unit. If a deceleration exceeds the second set value G2 when set time T1 or more has elapsed upon this operation, a set amount of fluid is exhausted from the fluid spring chamber of each rearwheel suspension unit. With this operation, since braking action for gradually increasing a deceleration is controlled by two stages, uncomfortableness which passangers feel in anti-nose-dive control can be greatly reduced. In addition, control is not performed only by depressing the brake pedal if an acutal deceleration is smaller than first set value G1.

Abstract: When vibrations having a period at which pitching tends to occur in a vehicle body is detected, if its amplitude falls out of the range between "H" and "L", a control unit increases the damping force of each suspension unit by using an actuator. In addition, if the amplitude falls out of the range between "HH" and "LL", the control unit supplies a predetermined amount of air to each air spring chamber in response to an upward displacement of vehicle height, and exhausts a predetermined amount of air from each air spring chamber in response to a downward displacement of vehicle height.