Patents by Inventor Thomas A. Buckley
Thomas A. Buckley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20040206631Abstract: A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The organic compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the organic compounds that inhibit or retard additive consumption can be employed to copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.Type: ApplicationFiled: October 2, 2001Publication date: October 21, 2004Applicant: Shipley Company, L.L.C.Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
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Patent number: 6773573Abstract: A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.Type: GrantFiled: October 2, 2001Date of Patent: August 10, 2004Assignee: Shipley Company, L.L.C.Inventors: David R. Gabe, Andrew J. Cobley, Leon R. Barstad, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Thomas Buckley
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Publication number: 20040104124Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as ductility, micro-throwing power and micro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.Type: ApplicationFiled: November 24, 2003Publication date: June 3, 2004Applicant: Shipley Company, L.L.C.Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
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Patent number: 6736954Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.Type: GrantFiled: October 2, 2001Date of Patent: May 18, 2004Assignee: Shipley Company, L.L.C.Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
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Publication number: 20040084412Abstract: A substantially oxygen-free and nitrogen-free plasma ashing process for removing photoresist in the presence of a low k material from a semiconductor substrate includes forming reactive species by exposing a plasma gas composition to an energy source to form plasma. The plasma gas composition is substantially free from oxygen-bearing and nitrogen-bearing gases. The plasma selectively removes the photoresist from the underlying substrate containing low k material by exposing the photoresist to substantially oxygen and nitrogen free reactive species. The process can be used with carbon containing low k dielectric materials.Type: ApplicationFiled: August 11, 2003Publication date: May 6, 2004Inventors: Carlo Waldfried, Orlando Escorcia, Qingyuan Han, Thomas Buckley, Palani Sakthivel
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Publication number: 20040074778Abstract: A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, platinum, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.Type: ApplicationFiled: October 10, 2003Publication date: April 22, 2004Applicant: Shipley Company, L.L.C.Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
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Patent number: 6652731Abstract: A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The Metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.Type: GrantFiled: October 2, 2001Date of Patent: November 25, 2003Assignee: Shipley Company, L.L.C.Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
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Patent number: 6593095Abstract: The present invention relates to toxins that specifically bind to GPI anchored proteins. More specifically, the present invention encompasses the uses of such toxins to detect the presence or absence of GPI anchored proteins. In one embodiment the present invention can be used to detect the presence of paroxysmal nocturnal hemoglobinuria.Type: GrantFiled: July 14, 2000Date of Patent: July 15, 2003Assignees: University of Victoria Innovation and Development Corporation, Johns Hopkins UniversityInventors: J. Thomas Buckley, Robert A. Brodsky
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Publication number: 20030102226Abstract: A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.Type: ApplicationFiled: October 2, 2001Publication date: June 5, 2003Applicant: Shipley Company, L.L.C.Inventors: David R. Gabe, Andrew J. Cobley, Leon R. Barstad, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Thomas Buckley
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Publication number: 20030085132Abstract: A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The Metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.Type: ApplicationFiled: October 2, 2001Publication date: May 8, 2003Applicant: Shipley Company, L.L.C.Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
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Publication number: 20030070934Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.Type: ApplicationFiled: October 2, 2001Publication date: April 17, 2003Applicant: Shipley Company, L.L.C.Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
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Publication number: 20030066756Abstract: A metal plating bath and method for plating a metal on a substrate. The metal plating bath contains hydroxylamines that inhibit the consumption of additive bath components to improve the efficiency of metal plating processes. The additive bath components are added to metal plating baths to improve brightness of plated metal as well as the micro-throwing and macro-throwing power of the bath. In addition to brighteners, the additive bath components may include levelers, suppressors, hardeners, and the like. The hydroxylamines that inhibit additive consumption may be employed in metal plating baths for plating copper, gold, silver, platinum, palladium, cobalt, cadmium, nickel, bismuth, indium, tin, rhodium, iridium, ruthenium and alloys thereof.Type: ApplicationFiled: October 4, 2001Publication date: April 10, 2003Applicant: Shipley Company, L.L.C.Inventors: David R. Gabe, Andrew J. Cobley, Leon R. Barstad, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Thomas Buckley
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Patent number: 6495315Abstract: The infectivity of a population of enveloped viruses which comprise a glycosylphosphatidylinositol-anchored protein in their membrane can be reduced by employing certain toxins such as aerolysin, alpha toxin of Clostridium septicum, or enterolobin. Toxins which bind to glycosylphosphatidylinositol-anchored proteins inactivate such viruses. The toxins can be used to produce attenuated viral vaccines, to purge blood products, cells, or tissues of such viruses, and to detect viruses in samples.Type: GrantFiled: January 12, 2001Date of Patent: December 17, 2002Assignee: The Johns Hopkins UniversityInventors: James E. K. Hildreth, Dzung H. Nguyen, James Thomas Buckley
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Publication number: 20020012671Abstract: The infectivity of a population of enveloped viruses which comprise a glycosylphosphatidylinositol-anchored protein in their membrane can be reduced by employing certain toxins such as aerolysin, alpha toxin of Clostridium septicum, or enterolobin. Toxins which bind to glycosylphosphatidylinositol-anchored proteins inactivate such viruses. The toxins can be used to produce attenuated viral vaccines, to purge blood products, cells, or tissues of such viruses, and to detect viruses in samples.Type: ApplicationFiled: January 12, 2001Publication date: January 31, 2002Inventors: James E.K. Hildreth, Dzung H. Nguyen, James Thomas Buckley
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Patent number: 6120515Abstract: An athetectomy catheter is disclosed having a composite cutter which is capable of cutting material, including hardened plaque, from a biological conduit. The composite cutter has a cutter and a sensor mount. The cutter has a proximal end and a distal end with a cutting edge. The proximal end of the cutter bonds with the sensor mount. The sensor mount is adaptable for holding a sensor and attaching to a cutter torque cable of an atherectomy catheter. Typically, the atherectomy catheter has a cutter housing with a window. The composite cutter is positioned in the cutter housing and moves in response to movement of the cutter torque cable to cut material from the biological conduit via the window.Type: GrantFiled: July 16, 1997Date of Patent: September 19, 2000Assignee: Devices for Vascular Intervention, Inc.Inventors: Larry Rogers, John Thomas Buckley, Ron Ray Hundertmark, Ferolyn T. Powell, Charles Milo, Anthony J. Castro
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Patent number: 5798218Abstract: Aerolysin is shown to bind specifically to the Thy-1 antigen. Aerolysin-based methods, compositions and kits for detecting the presence of Thy-1 antigen are presented.Type: GrantFiled: September 24, 1996Date of Patent: August 25, 1998Assignee: University of British Columbia Innovation and Development CorporationInventor: James Thomas Buckley
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Patent number: 5733296Abstract: An athetectomy catheter is disclosed having a composite cutter which is capable of cutting material, including hardened plaque, from a biological conduit. The composite cutter has a cutter and a sensor mount. The cutter has a proximal end and a distal end with a cutting edge. The proximal end of the cutter bonds with the sensor mount. The sensor mount is adaptable for holding a sensor and attaching to a cutter torque cable of an atherectomy catheter. Typically, the atherectomy catheter has a cutter housing with a window. The composite cutter is positioned in the cutter housing and moves in response to movement of the cutter torque cable to cut material from the biological conduit via the window.Type: GrantFiled: February 6, 1996Date of Patent: March 31, 1998Assignee: Devices for Vascular InterventionInventors: Larry Rogers, John Thomas Buckley, Ron Ray Hundertmark, Ferolyn T. Powell, Charles Milo, Anthony J. Castro
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Patent number: D455996Type: GrantFiled: April 17, 2001Date of Patent: April 23, 2002Assignee: Caterpillar Inc.Inventor: Thomas A. Buckley