Patents by Inventor Thomas Aisenbrey
Thomas Aisenbrey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20040233112Abstract: Low cost antennas formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises conductor fibers or conductor particles in a resin or plastic host wherein the ratio of the weight of the conductor fibers or conductor particles to the weight of the resin or plastic host is between about 0.20 and 0.40. The conductive fibers can be stainless steel, nickel, copper, silver, or the like. The antenna elements can be formed using methods such as injection molding or extrusion. Virtually any antenna fabricated by conventional means such as wire, strip-line, printed circuit boards, or the like can be fabricated using the conductive loaded resin-based materials. The conductive loaded resin-based material used to form the antenna elements can be in the form of a thin flexible woven fabric which can readily cut to the desired shape.Type: ApplicationFiled: June 25, 2004Publication date: November 25, 2004Applicant: INTEGRAL TECHNOLOGIES, INC.Inventor: Thomas Aisenbrey
-
Publication number: 20040235351Abstract: Electrical connector housings are formed of a conductive loaded resin-based material which provides superior protection from EMI and RFI by absorbing such interfering signals. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination thereof, in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 40% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.Type: ApplicationFiled: July 2, 2004Publication date: November 25, 2004Applicant: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
-
Publication number: 20040227688Abstract: Devices are formed of a conductive loaded resin-based material with a plated metal layer overlying. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.Type: ApplicationFiled: June 16, 2004Publication date: November 18, 2004Applicant: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
-
Publication number: 20040222863Abstract: Inductor-capacitor (LC) oscillator circuits are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.Type: ApplicationFiled: April 19, 2004Publication date: November 11, 2004Applicant: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
-
Publication number: 20040217405Abstract: Capacitors are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.Type: ApplicationFiled: April 16, 2004Publication date: November 4, 2004Applicant: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
-
Publication number: 20040217903Abstract: Low cost antennas formed of conductive loaded resin-based materials. The conductive loaded resin-based materials are resins filled with conductive materials to provide a material which is a conductor rather than an insulator or body. The conductive materials comprise a resin-based structural material loaded with micron conductive powders or micron conductive fibers to provide a composite which is a conductor rather than an insulator. Virtually any antenna fabricated by conventional means such as wire, strip-line, printed circuit boards, or the like can be fabricated using the conductive loaded resin-based materials. The antennas can be formed using methods such as injection molding, overmolding, or extrusion.Type: ApplicationFiled: May 24, 2004Publication date: November 4, 2004Applicant: INTEGRAL TECHNOLOGIES, INC.Inventor: Thomas A. Aisenbrey
-
Publication number: 20040217472Abstract: Chip carrier with integrated functions such as antennas, EMI shields, and heat sinks are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.Type: ApplicationFiled: April 13, 2004Publication date: November 4, 2004Applicant: Integral Technologies, Inc.Inventors: Thomas Aisenbrey, Thor Arne Larsen
-
Publication number: 20040211653Abstract: Conveyors, chutes, skids, guides, and ways for the transporting of material are formed of a conductive loaded resin-based material such that fragments of these structures can be detected by a metal detector. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders.Type: ApplicationFiled: April 13, 2004Publication date: October 28, 2004Applicant: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
-
Publication number: 20040206615Abstract: Key actuators and other switching devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.Type: ApplicationFiled: March 26, 2004Publication date: October 21, 2004Applicant: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
-
Publication number: 20040196201Abstract: Inductors and inductive devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.Type: ApplicationFiled: April 16, 2004Publication date: October 7, 2004Applicant: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
-
Publication number: 20040196198Abstract: Inductor-capacitor (LC) RF resonator circuits are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.Type: ApplicationFiled: April 19, 2004Publication date: October 7, 2004Applicant: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
-
Publication number: 20040189170Abstract: Lighting devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.Type: ApplicationFiled: April 7, 2004Publication date: September 30, 2004Applicant: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
-
Publication number: 20040188418Abstract: Heating devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.Type: ApplicationFiled: April 7, 2004Publication date: September 30, 2004Applicant: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
-
Publication number: 20040174318Abstract: Low cost moldable antennas and methods of forming the antennas are described. Elements of the antennas are conductive loaded resin-based material having a conducting wire center. The conducting wire center can be single strand, multi-strand, insulated, or non-insulated wire. The conductive loaded resin-based material comprises micron conductor fibers, micron conductor powders, or in combination thereof homogenized within a base resin host wherein the ratio of the weight of the conductor fibers, conductor powders, or combination thereof to the weight of the base resin host is typically between about 0.20 and 0.40. The micron conductive fibers or powders can be stainless steel, nickel, copper, silver, carbon, graphite, or plated particles or fibers, or the like. The conducting metal wire can be copper, nickel, stainless steel, silver, or the like.Type: ApplicationFiled: March 12, 2004Publication date: September 9, 2004Applicant: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
-
Publication number: 20040174651Abstract: Heat sinks, heat pipes, and other thermal management devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.Type: ApplicationFiled: March 23, 2004Publication date: September 9, 2004Applicant: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
-
Publication number: 20040174301Abstract: A multi-segmented planar antenna with a built in ground plane and method of forming the antenna are described. The antenna elements are formed on a layer of first dielectric having conducting material on both the first and second sides of the layer of first dielectric, such as a printed circuit board. Antenna elements are formed on both sides of the layer of first dielectric using selective etching of the conducting material. Two antenna elements are generally rectangular separated by a narrow gap and electrically connected by two shorting strips across the gap. Two antenna elements are long and narrow wherein the length of each is an integral multiple of a quarter wavelength of the operating frequencies of the antenna. A layer of second dielectric is placed between the layer of first dielectric having the antenna elements and a ground plane. The antenna can be fully encapsulated in a plastic encapsulation material.Type: ApplicationFiled: January 29, 2003Publication date: September 9, 2004Applicant: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
-
Publication number: 20040164923Abstract: A low cost moldable transformer or trans-inductor core, referred to in this description as a transductor. Elements of the transductor core are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductor fibers, micron conductor powders, or in combination thereof homogenized within a base resin host wherein the ratio of the weight of the conductor fibers, conductor powders, or combination thereof to the weight of the base resin host can be between about 0.20 and 0.40. The micron conductive fibers or powders, can be of stainless steel, nickel, copper, silver, carbon, graphite, plated particles, plated fibers, or the like. Transductors can be formed using methods such as injection molding, over-molding, thermo-set, protrusion, extrusion, compression, or the like, in combination with a large number of production or wire wrapping techniques to achieve desired electrical characteristics.Type: ApplicationFiled: February 19, 2004Publication date: August 26, 2004Applicant: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
-
Publication number: 20040160377Abstract: Low cost antennas and electromagnetic absorbing parts formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises conductive fibers, conductive powders, or in combination thereof in a resin base host wherein the ratio of the weight of the conductor fibers, conductor powders, or combination of conductor fibers and conductor powders to the weight of the base resin host is between about 0.20 and 0.40. The conductive fibers or conductive powders can be stainless steel, nickel, copper, silver, carbon, graphite, plated fibers or particles, or the like. The antenna elements can be formed using methods such as injection molding or extrusion. Virtually any antenna, ground planes, or shielding packages fabricated by conventional means of metal can be fabricated using the conductive loaded resin-based materials.Type: ApplicationFiled: February 17, 2004Publication date: August 19, 2004Applicant: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
-
Patent number: 6741221Abstract: Low cost antennas formed of conductive loaded resin-based materials. The conductive loaded resin-based materials are resins filled with conductive materials to provide a material which is a conductor rather than an insulator or body. The conductive materials comprise a resin-based structural material loaded with micron conductive powders or micron conductive fibers to provide a composite which is a conductor rather than an insulator. Virtually any antenna fabricated by conventional means such as wire, strip-line, printed circuit boards, or the like can be fabricated using the conductive loaded resin-based materials. The antennas can be formed using methods such as injection molding, overmolding, or extrusion.Type: GrantFiled: February 14, 2002Date of Patent: May 25, 2004Assignee: Integral Technologies, Inc.Inventor: Thomas A. Aisenbrey
-
Patent number: 6717550Abstract: Antennas and methods of forming the antennas having a very low profile and a built in ground plane are described. The antenna elements are formed of conducting material on a layer of dielectric material, such as an integrated circuit board. The antenna elements are mounted on a ground plane having a number of shorting elements between one of the antenna elements and the ground plane. In some embodiments the antenna elements are on a single side of the layer of dielectric material. In other embodiments the antenna elements are formed on both the top and bottom surfaces of the layer of dielectric material. The self contained ground plane makes the antenna performance independent of proximity to conducting or non conducting surfaces.Type: GrantFiled: September 24, 2002Date of Patent: April 6, 2004Assignee: Integral Technologies, Inc.Inventor: Thomas Aisenbrey