Patents by Inventor Thomas Allan Kocian
Thomas Allan Kocian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9969610Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.Type: GrantFiled: January 26, 2017Date of Patent: May 15, 2018Assignee: RAYTHEON COMPANYInventors: Buu Q. Diep, Adam M. Kennedy, Thomas Allan Kocian, Mark Lamb
-
Patent number: 9771258Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.Type: GrantFiled: June 24, 2015Date of Patent: September 26, 2017Assignee: RAYTHEON COMPANYInventors: Buu Q. Diep, Adam M. Kennedy, Thomas Allan Kocian, Mark Lamb
-
Patent number: 9708181Abstract: A sealed package having a device disposed on a wafer structure and a lid structure boned to the device wafer. The device wafer includes: a substrate; a metal ring disposed on a surface portion of substrate around the device and a bonding material disposed on the metal ring. The metal ring extends laterally beyond at least one of an inner and outer edge of the bonding material. A first layer of the metal ring includes a stress relief buffer layer having a higher ductility than that of the surface portion of the substrate and a width greater than the width of the bonding material. The metal ring extends laterally beyond at least one of the inner and outer edges of the bonding material. The stress relief buffer layer has a coefficient of thermal expansion greater than the coefficient of expansion of the surface portion of the substrate and less than the coefficient of expansion of the bonding material.Type: GrantFiled: February 19, 2016Date of Patent: July 18, 2017Assignee: Raytheon CompanyInventors: Adam M. Kennedy, Buu Q. Diep, Stephen H. Black, Tse E. Wong, Thomas Allan Kocian, Gregory D. Tracy
-
Publication number: 20170129775Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.Type: ApplicationFiled: January 26, 2017Publication date: May 11, 2017Inventors: Buu Q. Diep, Adam M. Kennedy, Thomas Allan Kocian, Mark Lamb
-
Publication number: 20160376146Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.Type: ApplicationFiled: June 24, 2015Publication date: December 29, 2016Inventors: Buu Q. Diep, Adam M. Kennedy, Thomas Allan Kocian, Mark Lamb
-
Publication number: 20160167959Abstract: A sealed package having a device disposed on a wafer structure and a lid structure boned to the device wafer. The device wafer includes: a substrate; a metal ring disposed on a surface portion of substrate around the device and a bonding material disposed on the metal ring. The metal ring extends laterally beyond at least one of an inner and outer edge of the bonding material. A first layer of the metal ring includes a stress relief buffer layer having a higher ductility than that of the surface portion of the substrate and a width greater than the width of the bonding material. The metal ring extends laterally beyond at least one of the inner and outer edges of the bonding material. The stress relief buffer layer has a coefficient of thermal expansion greater than the coefficient of expansion of the surface portion of the substrate and less than the coefficient of expansion of the bonding material.Type: ApplicationFiled: February 19, 2016Publication date: June 16, 2016Applicant: Raytheon CompanyInventors: Adam M. Kennedy, Buu Q. Diep, Stephen H. Black, Tse E. Wong, Thomas Allan Kocian, Gregory D. Tracy
-
Patent number: 9334154Abstract: A sealed package having a device disposed on a wafer structure and a lid structure boned to the device wafer. The device wafer includes: a substrate; a metal ring disposed on a surface portion of substrate around the device and a bonding material disposed on the metal ring. The metal ring extends laterally beyond at least one of an inner and outer edge of the bonding material. A first layer of the metal ring includes a stress relief buffer layer having a higher ductility than that of the surface portion of the substrate and a width greater than the width of the bonding material. The metal ring extends laterally beyond at least one of the inner and outer edges of the bonding material. The stress relief buffer layer has a coefficient of thermal expansion greater than the coefficient of expansion of the surface portion of the substrate and less than the coefficient of expansion of the bonding material.Type: GrantFiled: August 11, 2014Date of Patent: May 10, 2016Assignee: RAYTHEON COMPANYInventors: Adam M. Kennedy, Buu Q. Diep, Stephen H. Black, Tse E. Wong, Thomas Allan Kocian, Gregory D. Tracy
-
Publication number: 20160039665Abstract: A sealed package having a device disposed on a wafer structure and slid structure boned to the device wafer. The device wafer includes: a substrate; a metal ring disposed on a surface portion of substrate around the device and a bonding material disposed on the metal ring. The metal ring extends laterally beyond at least one of an inner and outer edge of the bonding material. A first layer of the metal ring includes a stress relief buffer layer having a higher ductility than that of the surface portion of the substrate and a width greater than the width of the bonding material. The metal ring extends laterally beyond at least one of the inner and outer edges of the bonding material. The stress relief buffer layer has a coefficient of thermal expansion greater than the coefficient of expansion of the surface portion of the substrate and less than the coefficient of expansion of the bonding material.Type: ApplicationFiled: August 11, 2014Publication date: February 11, 2016Inventors: Adam M. Kennedy, Buu Q. Diep, Stephen H. Black, Tse E. Wong, Thomas Allan Kocian, Gregory D. Tracy
-
Publication number: 20160040282Abstract: A getter structure and method wherein a layer of seed material is deposited on a predetermined region of a surface of a structure under conditions to form a plurality of nucleation sites on a surface of the structure. The nucleation sites have an average height over the surface area of the predetermined region of less than one molecule thick. Subsequently a getter material is deposited over the surface to form a plurality of getter material members projecting outwardly from the nucleation sites.Type: ApplicationFiled: October 16, 2015Publication date: February 11, 2016Applicant: RAYTHEON COMPANYInventors: Roland Gooch, Adam M. Kennedy, Stephen H. Black, Thomas Allan Kocian, Buu Diep
-
Patent number: 9196556Abstract: A getter structure and method wherein a layer of seed material is deposited on a predetermined region of a surface of a structure under conditions to form a plurality of nucleation sites on a surface of the structure. The nucleation sites have an average height over the surface area of the predetermined region of less than one molecule thick. Subsequently a getter material is deposited over the surface to form a plurality of getter material members projecting outwardly from the nucleation sites.Type: GrantFiled: February 28, 2014Date of Patent: November 24, 2015Assignee: RAYTHEON COMPANYInventors: Roland Gooch, Adam M. Kennedy, Stephen H. Black, Thomas Allan Kocian, Buu Diep
-
Patent number: 9187312Abstract: A method of forming a wafer level packaged circuit device includes forming a device wafer, the device wafer including a first group of one or more material layers left remaining in a first region of a substrate of the device wafer; and forming a cap wafer configured to be attached to the device wafer, the cap wafer including a second group of one or more material layers left remaining in a second region of a substrate of the cap wafer; wherein a combined thickness of the first and second groups of one or more material layers defines an integrated bond gap control structure upon bonding of the device wafer and the cap wafer.Type: GrantFiled: March 10, 2014Date of Patent: November 17, 2015Assignee: RAYTHEON COMPANYInventors: Roland Gooch, Buu Diep, Thomas Allan Kocian, Stephen H. Black, Adam M. Kennedy
-
Patent number: 9174836Abstract: A method of forming a wafer level packaged circuit device includes forming a device wafer, the device wafer including a first group of one or more material layers left remaining in a first region of a substrate of the device wafer; and forming a cap wafer configured to be attached to the device wafer, the cap wafer including a second group of one or more material layers left remaining in a second region of a substrate of the cap wafer; wherein a combined thickness of the first and second groups of one or more material layers defines an integrated bond gap control structure upon bonding of the device wafer and the cap wafer.Type: GrantFiled: August 11, 2014Date of Patent: November 3, 2015Assignee: RAYTHEON COMPANYInventors: Roland Gooch, Buu Diep, Thomas Allan Kocian, Stephen H. Black, Adam M. Kennedy
-
Publication number: 20150249042Abstract: A getter structure and method wherein a layer of seed material is deposited on a predetermined region of a surface of a structure under conditions to form a plurality of nucleation sites on a surface of the structure. The nucleation sites have an average height over the surface area of the predetermined region of less than one molecule thick. Subsequently a getter material is deposited over the surface to form a plurality of getter material members projecting outwardly from the nucleation sites.Type: ApplicationFiled: February 28, 2014Publication date: September 3, 2015Applicant: Raytheon CompanyInventors: Roland Gooch, Adam M. Kennedy, Stephen H. Black, Thomas Allan Kocian, Buu Diep
-
Patent number: 9105800Abstract: A method for forming a coating of material on selected portions of a surface of a substrate having a plurality of cavities, each cavity having outer, peripheral sidewalls extending outwardly from the surface. The method includes: providing a structure having a release agent thereon; contacting top surface of the wafer with the release agent to transfer portions of the release agent to the top surface of the wafer while bottom portions of the cavities remain spaced from the release agent to produce an intermediate structure; the release agent disposed on the top surface of the wafer and with the bottom portions of the cavities void of the release agent; exposing the intermediate structure to the material to blanket coat the material on both the release agent and the bottom portions of the cavities; and selectively removing the release agent together with the coating material while leaving the coating material on the bottom portions of the cavities.Type: GrantFiled: December 9, 2013Date of Patent: August 11, 2015Assignee: RAYTHEON COMPANYInventors: Roland Gooch, Thomas Allan Kocian, Buu Diep, Adam M. Kennedy, Stephen H. Black
-
Patent number: 9093444Abstract: An electronic device and methods of manufacture thereof. One or more methods may include providing a lid wafer having a cavity and a surface surrounding the cavity and a device wafer having a detector device and a reference device. In certain examples, a solder barrier layer of titanium material may be deposited onto the surface of the lid wafer. The solder barrier layer of titanium material may further be activated to function as a getter. In various examples, the lid wafer and the device wafer may be bonded together using solder, and the solder barrier layer of titanium material may prevent the solder from contacting the surface of the lid wafer.Type: GrantFiled: July 11, 2013Date of Patent: July 28, 2015Assignee: RAYTHEON COMPANYInventors: Roland W. Gooch, Buu Q. Diep, Adam M. Kennedy, Stephen H. Black, Thomas Allan Kocian
-
Publication number: 20150162479Abstract: A method for forming a coating of material on selected portions of a surface of a substrate having a plurality of cavities, each cavity having outer, peripheral sidewalls extending outwardly from the surface. The method includes: providing a structure having a release agent thereon; contacting top surface of the wafer with the release agent to transfer portions of the release agent to the top surface of the wafer while bottom portions of the cavities remain spaced from the release agent to produce an intermediate structure; the release agent disposed on the top surface of the wafer and with the bottom portions of the cavities void of the release agent; exposing the intermediate structure to the material to blanket coat the material on both the release agent and the bottom portions of the cavities; and selectively removing the release agent together with the coating material while leaving the coating material on the bottom portions of the cavities.Type: ApplicationFiled: December 9, 2013Publication date: June 11, 2015Applicant: Raytheon CompanyInventors: Roland Gooch, Thomas Allan Kocian, Buu Diep, Adam M. Kennedy, Stephen H. Black
-
Publication number: 20150014854Abstract: An electronic device and methods of manufacture thereof. One or more methods may include providing a lid wafer having a cavity and a surface surrounding the cavity and a device wafer having a detector device and a reference device. In certain examples, a solder barrier layer of titanium material may be deposited onto the surface of the lid wafer. The solder barrier layer of titanium material may further be activated to function as a getter. In various examples, the lid wafer and the device wafer may be bonded together using solder, and the solder barrier layer of titanium material may prevent the solder from contacting the surface of the lid wafer.Type: ApplicationFiled: July 11, 2013Publication date: January 15, 2015Inventors: Roland W. Gooch, Buu Q. Diep, Adam M. Kennedy, Stephen H. Black, Thomas Allan Kocian
-
Publication number: 20140346643Abstract: A method of forming a wafer level packaged circuit device includes forming a device wafer, the device wafer including a first group of one or more material layers left remaining in a first region of a substrate of the device wafer; and forming a cap wafer configured to be attached to the device wafer, the cap wafer including a second group of one or more material layers left remaining in a second region of a substrate of the cap wafer; wherein a combined thickness of the first and second groups of one or more material layers defines an integrated bond gap control structure upon bonding of the device wafer and the cap wafer.Type: ApplicationFiled: August 11, 2014Publication date: November 27, 2014Inventors: Roland Gooch, Buu Diep, Thomas Allan Kocian, Stephen H. Black, Adam M. Kennedy
-
Publication number: 20140193948Abstract: A method of forming a wafer level packaged circuit device includes forming a device wafer, the device wafer including a first group of one or more material layers left remaining in a first region of a substrate of the device wafer; and forming a cap wafer configured to be attached to the device wafer, the cap wafer including a second group of one or more material layers left remaining in a second region of a substrate of the cap wafer; wherein a combined thickness of the first and second groups of one or more material layers defines an integrated bond gap control structure upon bonding of the device wafer and the cap wafer.Type: ApplicationFiled: March 10, 2014Publication date: July 10, 2014Applicant: RAYTHEON COMPANYInventors: Roland Gooch, Buu Diep, Thomas Allan Kocian, Stephen H. Black, Adam M. Kennedy
-
Publication number: 20140175590Abstract: A wafer level vacuum packaged (WLVP) device having a first substrate having an array of detectors and a second substrate bonded to the first substrate having a plurality of protrusions and a plurality of getter material members projecting outwardly from a sidewall of the protrusions members are disposed at oblique angles to the sidewalls and have ends extending into gaps between the protrusions. The device is formed by: forming protrusions into a surface of a substrate; and depositing getter material by physical vapor deposition from an evaporating source of the getter material at an oblique angle to the sidewalls, atoms of the getter material initially forming nucleation sites on the sidewalls with subsequent atoms attaching to the nucleation sites and shadowing area surrounding each nucleation site, the getter material thereby growing into structures towards the evaporating source.Type: ApplicationFiled: December 20, 2012Publication date: June 26, 2014Applicant: Raytheon CompanyInventors: Roland Gooch, Adam M. Kennedy, Stephen H. Black, Thomas Allan Kocian, Buu Diep