Patents by Inventor Thomas Allan Kocian

Thomas Allan Kocian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated bondline spacers for wafer level packaged circuit devices
    Patent number: 8736045
    Abstract: A method of forming a wafer level packaged circuit device includes forming a device wafer, the device wafer including a first group of one or more material layers left remaining in a first region of a substrate of the device wafer; and forming a cap wafer configured to be attached to the device wafer, the cap wafer including a second group of one or more material layers left remaining in a second region of a substrate of the cap wafer; wherein a combined thickness of the first and second groups of one or more material layers defines an integrated bond gap control structure upon bonding of the device wafer and the cap wafer.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: May 27, 2014
    Assignee: Raytheon Company
    Inventors: Roland Gooch, Buu Diep, Thomas Allan Kocian, Stephen H. Black, Allan M. Kennedy
  • INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
    Publication number: 20140124899
    Abstract: A method of forming a wafer level packaged circuit device includes forming a device wafer, the device wafer including a first group of one or more material layers left remaining in a first region of a substrate of the device wafer; and forming a cap wafer configured to be attached to the device wafer, the cap wafer including a second group of one or more material layers left remaining in a second region of a substrate of the cap wafer; wherein a combined thickness of the first and second groups of one or more material layers defines an integrated bond gap control structure upon bonding of the device wafer and the cap wafer.
    Type: Application
    Filed: November 2, 2012
    Publication date: May 8, 2014
    Applicant: RAYTHEON COMPANY
    Inventors: Roland Gooch, Buu Diep, Thomas Allan Kocian, Stephen H. Black, Adam M. Kennedy