Abstract: A method of manufacturing a semiconductor device includes providing a semiconductor substrate having opposing first and second main surfaces and first and second dopants. A covalent atomic radius of a material of the substrate is i) larger than a covalent atomic radius of the first dopant and smaller than that of the second dopant, or ii) smaller than the covalent atomic radius of the first dopant and larger than that of the second dopant. A vertical extension of the first dopant into the substrate from the first main surface ends at a bottom of a substrate portion at a first vertical distance to the first main surface. The method further includes forming a semiconductor layer on the first main surface, forming semiconductor device elements in the semiconductor layer, and reducing a thickness of the substrate by removing material from the second main surface at least up to the substrate portion.

Abstract: A method for treating cancer with a combination of a chemotherapy agent and a composition that includes a quercetin, vitamin B3, and vitamin C. The quercetin can be quercetin aglycon or a quercetin derivative, and the composition can also include folic acid.

Abstract: A method for treating thrombotic disorders using a composition containing quercetin, together with one or more of vitamin B3, vitamin C, and folic acid. Also disclosed is a method of improving the efficacy of a blood thinning medication by co-administering a composition containing quercetin, together with one or more of vitamin B3, vitamin C, and folic acid to a subject being treated with a blood thinning medication.

Abstract: A technique allows for an electrical connection between a thermal abrasion heating catheter and the energy delivery console that utilizes serial communication. Accordingly, the serial communication allows data such as measured temperature, start/stop status, intended treatment area, device identification, device calibration parameters and/or use history to be conveyed along the same wires that deliver power to a heating element. For example, data can be conveyed along a two wire connection and provided at a frequency that is filtered out so that it is not delivered to a heating feature. In this example, one wire provides power to the heating element, one wire provided communication from the energy delivery console, and a third wire provides a common ground which the heating catheter uses to communicate with the energy delivery console.

Abstract: A method for treating Zika virus infection with a composition containing quercetin or isoquercetin, together with one or more of vitamin B3, vitamin C, and a folate compound is described. Methods of preventing microcephaly and treating and preventing infections of other Flavivridae viruses are also described.

Abstract: In accordance with an embodiment of the present invention, a method of fabricating a semiconductor device includes forming openings partially filled with a sacrificial material, where the openings extend into a semiconductor substrate from a first side. A void region is formed in a central region of the openings. An epitaxial layer is formed over the first side of the semiconductor substrate and the openings, where the epitaxial layer covers the void region. From a second side of the semiconductor substrate opposite to the first side, the semiconductor substrate is thinned to expose the sacrificial material. The sacrificial material in the openings is removed and the epitaxial layer is exposed. A conductive material is deposited on the exposed surface of the epitaxial layer.

Abstract: A method and system for a protection mechanism associated with a server to prevent execution of malicious code. The method includes identifying permissions of a set of files by the protection mechanism where the set of files are related to a request sent to the server, determining whether the request references any file in the set of files with inappropriate permissions, and blocking the request from being executed by a processing engine in response to determining the request is associated with at least one file with improper permissions.

Abstract: Tissue explants of the gastrointestinal tract are provided. Methods of making and using the tissue explants are also provided, along with substrates designed for the tissue explants described.

Abstract: The invention relates to a continuous flow dryer (10) for drying a material (14) by means of hot air (24), comprising a first and a second section (20, 22), which in a transport direction (18) are successively passed through by the material (14), and which in terms of flow are separated to a great extent. The invention is characterized in that a fresh air supply device (28) for supplying fresh air (26) as first infeed air (32) into the first section (20) is provided, an exhaust air recirculation device (44) for removing exhaust air (40) from the second section (22) and for recirculating exhaust air (40) as second infeed air (42) back into the second section (22) is provided. Furthermore, a heat exchanger (58) is provided, through which the fresh air (26) on the one hand and the exhaust air (40) on the other hand are guided, for transferring waste heat (62) of the exhaust air (40) into the fresh air (26).

Abstract: A continuous-flow dryer for drying a material by hot air is provided with a first and a second section, through which the material is passed successively in a transport direction. It includes a fresh air supply device, an exhaust air recirculation device for removing exhaust air and recirculating it as supply air, and a heat exchanger, through which fresh air and exhaust air are led, for transferring waste heat of the exhaust air into the fresh air. With the exhaust air recirculation device a first part of the exhaust air is removed from the first section and recirculated as supply air directly into the first section. Furthermore, a second part of the exhaust air is removed from the first section, led through the heat exchanger, and recirculated as supply air into the first section. The fresh air supply device supplies fresh air as supply air into the second section.

Abstract: A continuous-flow dryer for drying a material by means of hot air is provided with a fresh air supply device for supplying fresh air as supply air, an exhaust air recirculation device for removing exhaust air and for recirculating exhaust air as supply air, and a heat exchanger, through which fresh air on the one hand and exhaust air on the other hand are led, for transferring waste heat of the exhaust air into the fresh air. According to the invention, the removed exhaust air is supplied at the bottom into the heat exchanger.

Abstract: A continuous-flow dryer for drying a material by hot air is provided with a first and a second section, through which the material flows successively in a transport direction. It includes a fresh air supply device, an exhaust air recirculation device for removing exhaust air and for recirculating exhaust air as supply air, and a heat exchanger, through which fresh air and exhaust air are led, for transferring waste heat of the exhaust air into the fresh air. With the exhaust air recirculation device a first part of the exhaust air is removed from the first section and recirculated directly into the first section. Furthermore, a second part of the exhaust air is removed from the first section, led through the heat exchanger, and recirculated as supply air into the first section. The fresh air supply device supplies fresh air as supply air into the second section.

Abstract: A semiconductor device includes a trench extending through a semiconductor substrate and an epitaxial layer disposed over a first side of the semiconductor substrate. The epitaxial layer partially fills a portion of the trench. The semiconductor device further includes a back side metal layer disposed over a second side of the semiconductor substrate. The back side metal layer extends into the trench and fills the remaining portion of the trench. The epitaxial layer partially filling the trench contacts the back side metal layer filling the remaining portion within the trench.

Abstract: The invention relates to combinations of peptides derived from a portion of an amino sequence of a grass pollen allergen, e.g. the allergens Phl p 1, Phl p 2, Phl p 3, Phl p 4 and/or Phl p 5, or a peptide variant thereof. Such peptides comprise at least one T cell epitope mid a high number of patients in a worldwide population will have HLA Class II alleles with the potential to bind the peptides of the peptide combinations. The invention also relates to the use of such peptide combinations in relieving an immune response caused by grass pollen species.

Abstract: A vehicle tire monitoring methodology is based on embedding into a tire at least one tire inductor coil with multiple circumferential windings. A tire condition that causes deformation of the tire, causes deformation of the tire inductor coil. A tire condition (such as pressure, speed, damage or deterioration) can be monitored by acquiring tire coil response measurements corresponding to an inductive response to the tire condition that causes deformation of the tire, and thereby deformation of the tire inductor coil, and then converting the tire coil response into data representing the tire condition. Multiple circumferential tire inductor coils can be embedded (such as into the tread and/or sidewalls), so that tire monitoring can involve acquiring respective tire coil responses corresponding to a tire condition that causes differential tire coil responses (such as steering direction), which can be converted into data representing the tire condition.

Abstract: In accordance with an embodiment of the present invention, a method of fabricating a semiconductor device includes forming openings partially filled with a sacrificial material, where the openings extend into a semiconductor substrate from a first side. A void region is formed in a central region of the openings. An epitaxial layer is formed over the first side of the semiconductor substrate and the openings, where the epitaxial layer covers the void region. From a second side of the semiconductor substrate opposite to the first side, the semiconductor substrate is thinned to expose the sacrificial material. The sacrificial material in the openings is removed and the epitaxial layer is exposed. A conductive material is deposited on the exposed surface of the epitaxial layer.

Abstract: A method of fabricating a semiconductor device includes forming trenches filled with a sacrificial material. The trenches extend into a semiconductor substrate from a first side. An epitaxial layer is formed over the first side of the semiconductor substrate and the trenches. From a second side of the semiconductor substrate opposite to the first side, the sacrificial material in the trenches is removed. The trenches are filled with a conductive material.

Abstract: A wafer chuck configured to support a wafer during a wafer test procedure comprises a contact portion for supporting the wafer while being in contact with the wafer. The contact portion is made of a conductive material, the conductive material having a melting point larger than 1500° C.

Abstract: A method of fabricating a semiconductor device includes forming trenches filled with a sacrificial material. The trenches extend into a semiconductor substrate from a first side. An epitaxial layer is formed over the first side of the semiconductor substrate and the trenches. From a second side of the semiconductor substrate opposite to the first side, the sacrificial material in the trenches is removed. The trenches are filled with a conductive material.

Abstract: A valve assembly comprises a housing, a chamber having a first product opening, a second product opening, a first closable secondary opening that can be connected to a steam line, and a second closable secondary opening. The assembly also includes a first closing element by which the first product opening can be closed, a second closing element by which the second product opening can be closed, and an outlet associated with the second secondary opening. A switching valve is arranged between the second secondary opening and the outlet such that a fluid connection between the outlet and the second secondary opening can be switched to a fluid connection between the outlet and an inlet provided on the switching valve. The inlet can be connected to a steam line, while simultaneously closing the second secondary opening. A system comprising the valve assembly and a method for operating the system are described.