Abstract: Improvement of key electrical specifications of vertical semiconductor devices, usually found in the class of devices known as discrete semiconductors, has a direct impact on the performance achievement and power efficiency of the systems in which these devices are used. Imprecise vertical device specifications cause system builders to either screen incoming devices for their required specification targets or to design their system with lower performance or lower efficiency than desired. Disclosed is an architecture and method for achieving a desired target specification for a vertical semiconductor device. Precise trimming of threshold voltage improves targeting of both on-resistance and switching time. Precise trimming of gate resistance also improves targeting of switching time. Precise trimming of a device's effective width improves targeting of both on-resistance and current-carrying capability.

Abstract: A semiconductor field-effect device is disclosed that utilizes an octagonal or inverse-octagonal deep trench super-junction in combination with an octagonal or inverse-octagonal gate trench. The field-effect device achieves improved packing density, improved current density, and improved on resistance, while at the same time maintaining compatibility with the multiple-of-45°-angles of native photomask processing and having well characterized (010), (100) and (110) (and their equivalent) silicon sidewall surfaces for selective epitaxial refill and gate oxidation, resulting in improved scalability. By varying the relative length of each sidewall surface, devices with differing threshold voltages can be achieved without additional processing steps. Mixing trenches with varying sidewall lengths also allows for stress balancing during selective epitaxial refill.

Abstract: Embodiments of the invention provide increased ESD protection suitable for high-voltage devices. In one embodiment, an internal DMOS circuit is placed in parallel with a lateral NPN ESD clamp. The clamp has both a high holding voltage, above the operating voltage of the DMOS circuit, and a high maximum current before breakdown. The discharge path of the clamp includes a high-voltage lightly doped well containing a low-voltage higher doped well. The dopant of both wells is the same type, and the interface between the two defines a graded junction. The emitter of the entire circuit is grounded and the collector is coupled to the voltage of the DMOS circuit.

Abstract: A field effect device is disclosed that provides a reduced variation in on-resistance as a function of junction temperature. The field effect device, having a source junction, gate junction and drain junction, includes a resistive thin film adjacent the drain junction wherein the resistive thin film comprises a material having a negative temperature coefficient of resistance. The material is selected from one or more materials from the group consisting of doped polysilicon, amorphous silicon, silicon-chromium and silicon-nickel, where the material properties, such as thickness and doping level, are chosen to create a desired resistance and temperature profile for the field effect device. Temperature variation of on-resistance for the disclosed field effect device is reduced from the temperature variation for a similar field effect device without the resistive thin film.

Abstract: Improvement of key electrical specifications of vertical semiconductor devices, usually found in the class of devices known as discrete semiconductors, has a direct impact on the performance achievement and power efficiency of the systems in which these devices are used. Imprecise vertical device specifications cause system builders to either screen incoming devices for their required specification targets or to design their system with lower performance or lower efficiency than desired. Disclosed is an architecture and method for achieving a desired target specification for a vertical semiconductor device. Precise trimming of threshold voltage improves targeting of both on-resistance and switching time. Precise trimming of gate resistance also improves targeting of switching time. Precise trimming of a device's effective width improves targeting of both on-resistance and current-carrying capability.

Abstract: A semiconductor field-effect device is disclosed that utilizes an octagonal or inverse-octagonal deep trench super-junction in combination with an octagonal or inverse-octagonal gate trench. The field-effect device achieves improved packing density, improved current density, and improved on resistance, while at the same time maintaining compatibility with the multiple-of-45°-angles of native photomask processing and having well characterized (010), (100) and (110) (and their equivalent) silicon sidewall surfaces for selective epitaxial refill and gate oxidation, resulting in improved scalability. By varying the relative length of each sidewall surface, devices with differing threshold voltages can be achieved without additional processing steps. Mixing trenches with varying sidewall lengths also allows for stress balancing during selective epitaxial refill.

Abstract: A polysilicon resistor is formed using a late implant process. Low dopant concentrations on the order of 6×1019 to 3.75×1020 have shown good results. with a reduced post anneal temperature. Both the first and second order temperature coefficients (TC1 and TC2) can then be adjusted. Using electrical trimming resistors can be produced with highly linear temperature characteristics. By varying the geometries of the resistors, low trimming threshold current densities and voltages can be used to produce good results.

Abstract: A CMOS integrated circuit, in which the PMOS devices each include a buried channel region (26). The P+ source/drain regions (54) and (56) are separated from the channel region (26) by N-type lateral field isolating regions (58) and (60). Whenever a voltage negative enough to turn on the channel is applied, the isolating regions will be inverted by the electric fields from the comers of the gate. Thus, the value of the transistor's threshold voltage is not changed. However, these lateral field isolating regions provide an electric field modification which helps to minimize drain-induced barrier lowering, and thereby reduces the leakage current of the device in the off state. Preferably the lateral field isolating regions are formed by a doping which is maximal at the same depth (below the gate oxide) at which the threshold-voltage-adjust doping of the channel is maximal.The preferred CMOS process provides lateral field isolating regions on the PMOS devices, and also provides LDD regions on the NMOS devices.

Abstract: A CMOS integrated circuit, in which the PMOS devices each include a buried channel region (26). The P+ source/drain regions (54) and (56) are separated from the channel region (26) by N-type lateral field isolating regions (58) and (60). Whenever a voltage negative enough to turn on the channel is applied, the isolating regions will be inverted by the electric fields from the comers of the gate. Thus, the value of the transistor's threshold voltage is not changed. However, these lateral field isolating regions provide an electric field modification which helps to minimize drain-induced barrier lowering, and thereby reduces the leakage current of the device in the off state. Preferably the lateral field isolating regions are formed by a doping which is maximal at the same depth (below the gate oxide) at which the threshold-voltage-adjust doping of the channel is maximal. The preferred CMOS process provides lateral field isolating regions on the PMOS devices, and also provides LDD regions on the NMOS devices.

Abstract: A battery-backed integrated circuit, with a double diode structure connected to signal lines. In the double diode structure, a first junction is three-dimensionally enclosed by a second junction, so that minority carriers generated at the first junction will be collected at the second junction. Thus, when a negative transient voltage appears on the signal line, the first junction can be forward biassed to source the needed current from ground, with minimal minority carrier injection.

Abstract: A battery-backed integrated circuit, which receives battery power to maintain data (or logic states) when the system (external) power supply goes down. The battery power input is connected through a diode, so that the battery cannot be charged when the system power supply is active. The battery isolation diode is a junction diode, which is surrounded by a second junction. The battery junction collects minority carriers which will be generated when the battery protection diode is forward biased (i.e. when the integrated circuit is being powered from the battery). Otherwise, minority carriers can diffuse to other junctions, to cause leakage currents which can significantly degrade the lifetime of a low-powered device.

Abstract: A CMOS integrated circuit, in which the PMOS devices each include a buried channel region (26). The P+ source/drain regions (54) and (56) are separated from the channel region (26) by N-type lateral field isolating regions (58) and (60). Whenever a voltage negative enough to turn on the channel is applied, the isolating regions will be inverted by the electric fields from the corners of the gate. Thus, the value of the transistor's threshold voltage is not changed. However, these lateral field isolating regions provide an electric field modification which helps to minimize drain-induced barrier lowering, and thereby reduces the leakage current of the device in the off state. Preferably the lateral field isolating regions are formed by a doping which is maximal at the same depth (below the gate oxide) at which the threshold-voltage-adjust doping of the channel is maximal.The preferred CMOS process provides lateral field isolating regions on the PMOS devices, and also provides LDD regions on the NMOS devices.

Abstract: A battery-backed integrated circuit, which receives battery power to maintain data (or logic states) when the system (external) power supply goes down. The battery power input is connected through a diode, so that the battery cannot be charged when the system power supply is active. The battery isolation diode is a junction diode, which is surrounded by a second junction. The second junction collects minority carriers which will be generated when the battery protection diode is forward biased (i.e. when the integrated circuit is being powered from the battery). Otherwise, minority carriers can diffuse to other junctions, to cause leakage currents which can significantly degrade the lifetime of a low-powered device.

Abstract: An integrated circuit which uses vertical current flow through arsenic-implanted oxide films to provide low-current loads. These load elements provide a compact four-transistor SRAM which has very simple fabrication and very low power consumption.

Abstract: A CMOS integrated circuit, in which the PMOS devices each include a buried channel region (26). The P+ source/drain regions (54) and (56) are separated from the channel region (26) by N-type lateral field isolating regions (58) and (60). Whenever a voltage negative enough to turn on the channel is applied, the isolating regions will be inverted by the electric fields from the corners of the gate. Thus, the value of the transistor's threshold voltage is not changed. However, these lateral field isolating regions provide an electric field modification which helps to minimize drain-induced barrier lowering, and thereby reduces the leakage current of the device in the off state. Preferably the lateral field isolating regions are formed by a doping which is maximal at the same depth (below the gate oxide) at which the threshold-voltage-adjust doping of the channel is maximal.The preferred CMOS process provides lateral field isolating regions on the PMOS devices, and also provides LDD regions on the NMOS devices.

Abstract: An enclosed buried channel device includes a buried channel region (26) disposed under a gate electrode (24). Source and drain regions (54) and (56) are formed on either side of gate electrode (26). The source/drain regions (54) and (56) are separated from the various channel region (26) by isolating regions of N-type material (58) and (60), respectively. The isolating regions (58) and (60) are operable to be inverted during normal operation of the transistor when the transistor is conducting, but are operable to isolate fields on the drain side of the transistor from the buried channel region (26) to lower the leakage current of the device in the off state.

Abstract: A battery protection device for preventing battery charging comprises a diode formed with a p+ region (36) within an N-type region (34). The diode is completely surrounded by a P-well (32) to prevent minority carrier injection from the N-type region (34) to the N-type substrate (30). The N-type region (34) is connected to the P-well (32) and to the substrate (30) through an electrical connection (43). By preventing minority carrier injection into the substrate (30), leakage through a parasitic transistor is prevented.